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NXP Semiconductors NE57811S,518

Part No.:
NE57811S,518
Manufacturer:
NXP Semiconductors
Category:
Special Purpose Regulators
Package:
SPAK-5 (5 Leads + Tab)
Datasheet:
AetrixNE57811S,518.pdf
Description:
IC REG CONV DDR 1OUT 5SPAK
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,880

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Product details

Overview

NE57811S,518 from NXP Semiconductors (formerly Philips) is a linear DDR memory termination regulator designed to supply VTT at precisely half the DDR memory supply voltage (VDD/2) for DDR-I (2.5 V) and DDR-II (1.8 V) systems. It delivers ±3.5 A output current, features integrated overtemperature and overcurrent protection, and includes a shutdown pin and buffered reference output (RefOut). It serves as the core termination power source on DIMM modules in high-speed memory subsystems.

For engineers reviewing the NE57811S,518 datasheet, NE57811S,518 pinout, NE57811S,518 application, or NE57811S,518 equivalent, this device is critical for stable DDR bus termination where fast transient response, tight output accuracy (±15 mV), low quiescent current in shutdown (1.2 mA), and thermal robustness in SPAK-5 package are essential selection criteria.

Technical Context

The NE57811S,518 operates as a precision linear "power op-amp" that sources and sinks current instantaneously to maintain VTT = VDD/2 under dynamic DDR bus loading-enabling operation without external inductors or switching FETs. Its internal resistor divider sets the reference, and the buffered RefOut provides a stable 1/2 VDD reference for other memory support circuitry.

It employs thermal shutdown at +150 °C with 20 °C hysteresis and current limiting at 3.6–5.6 A to protect against inrush and overload. Load regulation is ±6 mV at ±1.0 A and ±18 mV at ±3.5 A, supporting stable operation across DDR memory bus states with up to 192 terminated lines.

Key Specifications

Parameter Value and Actual Design Meaning
VTT Output Voltage Exactly VDD/2 - ensures compliance with DDR termination voltage specification relative to memory supply
Output Current Range ±3.5 A (at VDD = 2.5–3.6 V) - supports worst-case DDR bus skew with all 1s or all 0s across 192 lines
Output Voltage Accuracy ±15 mV (VACC = VTT − VDD/2) - guarantees DDR bus voltage stays within ±40 mV spec under load
Shutdown Quiescent Current 1.2 mA max - enables low-power memory suspend modes without compromising system wake latency
Thermal Resistance Rth(j-a) 16.5 °C/W (JEDEC 4-layer PCB) - defines minimum PCB heatsink area (e.g., 225 mm² at 1.5 W avg dissipation)
Reference Output (RefOut) VDD/2 ±15 mV, ±3 mA drive - supplies accurate bias/reference to memory controllers and level shifters
Operating Temperature 0 °C to +70 °C - qualified for commercial desktop, server, and embedded DDR memory applications

Pinout & Package

The NE57811S,518 is housed in a thermally enhanced SPAK-5 (SOT756) plastic surface-mount package with an exposed thermal pad electrically connected to VSS. The package supports high-power dissipation (3.3 W max) and simplifies thermal design in space-constrained DIMM layouts.

Pin/Terminal Circuit Role Design Meaning
1 - VTT Regulated termination output Delivers bidirectional ±3.5 A current to DDR bus termination network; must be decoupled with ≥100 µF ceramic + bulk electrolytic
2 - VDD Main power input Accepts 1.6–3.6 V DDR memory supply; feeds internal divider and power stage; determines VTT setpoint
3 - VSS Circuit ground Primary ground return path; thermal pad connects internally to VSS but must not replace pin 3 as ground connection
4 - SHTDWN Active-low shutdown control Pulling low disables VTT output (3-state) and reduces IQ to ≤1.35 mA; open or pulled high enables normal operation
5 - RefOut Buffered reference output Provides low-impedance VDD/2 reference (±15 mV) for auxiliary circuits; capable of sourcing/sinking up to 3 mA

Key Features

Feature Design Value
Internal VDD/2 resistor divider Eliminates need for external resistive network - ensures precise, temperature-stable VTT setpoint without calibration
Fast transient response Stabilizes VTT within microseconds during DDR bus state transitions - reduces required output capacitance by >50%
Dual protection architecture Independent overcurrent limit (3.6–5.6 A) and thermal shutdown (+150 °C, 20 °C hysteresis) prevent damage during startup or fault conditions
Low-ESR capacitor optimized Designed for ceramic-only output filtering (≥100 µF) - avoids bulky, high-ESR electrolytics and improves high-frequency stability
Shutdown-controlled low-power mode Reduces total system standby power by disabling VTT amplifier while retaining reference functionality via RefOut

Applications

Desktop Microcomputer Systems Workstations

Use Scenario: DDR-I/DDR-II memory subsystem on ATX motherboards with dual-channel DIMM slots and high-bandwidth graphics interfaces.

IC Role / Device Role / Timing Role: Provides dynamically responsive VTT termination power synchronized to DDR memory clock domain and bus activity.

Use Value: Reduces component count by replacing discrete op-amp + resistor networks, cuts board area by 40%, and eliminates inductor-related EMI.

Use Scenario: Multi-CPU symmetric multiprocessing (SMP) workstations with registered DDR memory and ECC support.

IC Role / Device Role / Timing Role: Delivers tightly regulated, low-noise VTT to multiple DIMMs under variable load profiles caused by parallel memory access patterns.

Use Value: Maintains ±15 mV VTT accuracy across ±3.5 A load swings, ensuring signal integrity margins meet JEDEC DDR timing windows.

Servers Embedded Systems

Use Scenario: 1U/2U rack-mounted servers with hot-pluggable memory modules and thermal-aware power management firmware.

IC Role / Device Role / Timing Role: Enables coordinated VTT shutdown per memory channel during CPU idle states to reduce platform power by >2 W per channel.

Use Value: Achieves <1.35 mA shutdown current while preserving RefOut for memory controller biasing - no reinitialization delay on wake.

Use Scenario: Industrial media gateways with DDR-II SDRAM and real-time video buffering requirements.

IC Role / Device Role / Timing Role: Supplies stable VTT under wide ambient temperature variation (0–70 °C) and bursty video data traffic loads.

Use Value: Thermal resistance of 16.5 °C/W allows reliable operation on 2-layer PCBs with minimal heatsinking - lowers BOM cost vs. switching solutions.

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR termination regulator applications.

Alternative Part Technical Difference Application Difference Selection Advice
ISL6537CRZ Switching buck regulator (not linear); higher efficiency (>85%) but requires external inductor, FET, and compensation components Better suited for high-ambient-temperature or high-power-density server boards where thermal headroom is constrained Select ISL6537CRZ only when >2 W average dissipation cannot be managed thermally with linear solution
TPS51100PWR Linear DDR terminator with identical VDD/2 architecture; ±4 A rating, wider VDD range (1.5–3.6 V), and lower IQ in shutdown (100 µA) Preferred for DDR2/DDR3 hybrid designs requiring tighter tolerance (±10 mV) and extended low-power operation TPS51100PWR offers improved accuracy and lower standby current but requires layout review for thermal pad compatibility with SOT756 footprint

Compared with ISL6537CRZ and TPS51100PWR, the NE57811S,518 delivers simpler, lower-noise, inductor-free termination ideal for cost-sensitive commercial DDR-I/II platforms where thermal design can accommodate its linear dissipation profile.

Availability

NE57811S,518 is available at Aetrix Electronics and suitable for desktop microcomputer systems, workstations, and embedded systems requiring stable component supply for DDR memory termination.

Supply support for NE57811S,518 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors (originally Philips Semiconductors) is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and consumer applications.

The NE57811S,518 belongs to NXP's legacy DDR power management portfolio, engineered specifically to simplify high-speed memory interface design by integrating precision termination regulation, protection, and reference functions into a single linear IC.

FAQ

What is the primary function of the NE57811S,518 in a DDR memory system?

The NE57811S,518 serves as a dedicated linear termination regulator that generates VTT at exactly half the DDR memory supply voltage (VDD/2) to terminate the memory bus. It sources and sinks up to ±3.5 A to maintain signal integrity across DDR-I and DDR-II interfaces, eliminating the need for discrete op-amps and resistor networks. Its design directly supports JEDEC-compliant DDR termination requirements.

Does the NE57811S,518 require external inductors or switching components?

No, the NE57811S,518 is a fully integrated linear regulator and does not require external inductors, switching FETs, or compensation networks. Its architecture relies on a high-gain power op-amp topology with internal feedback, enabling fast transient response and stable operation using only ceramic and bulk capacitors. This simplifies layout and reduces EMI compared to switching alternatives.

How does the SHTDWN pin affect the operation of the NE57811S,518?

When the SHTDWN pin is pulled low, the NE57811S,518 disables its VTT output amplifier and places VTT in high-impedance (3-state) mode, reducing total quiescent current to ≤1.35 mA. RefOut remains active, providing VDD/2 reference. If left unconnected, an internal 10 kΩ pull-up to VDD keeps the device enabled. This feature enables dynamic power gating during memory idle states without disrupting system reference rails.

What is the maximum allowable VDD voltage for the NE57811S,518?

The absolute maximum VDD voltage for the NE57811S,518 is +3.6 V, as specified in its maximum ratings table. Operation is guaranteed across 1.6 V to 3.6 V, supporting both DDR-I (2.5 V) and DDR-II (1.8 V) memory supplies. Exceeding 3.6 V risks permanent damage; derating is recommended for long-term reliability at elevated temperatures.

Can the NE57811S,518 be used with DDR3 memory systems?

The NE57811S,518 is not designed for DDR3, which requires VTT = VDDQ/2 where VDDQ = 1.5 V and tighter output accuracy (±10 mV). While its VDD range covers 1.5 V, its specified accuracy is ±15 mV and its current limit and thermal design target DDR-I/II use cases. For DDR3, NXP recommends newer regulators like the TPS51100, which meets DDR3-specific tolerances and timing requirements.

NE57811S,518 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
-
Package/Case:
SPAK-5 (5 Leads + Tab)
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Applications:
Converter, DDR
Voltage - Input:
1.6V ~ 3.6V
Number of Outputs:
1
Voltage - Output:
-
Operating Temperature:
0°C ~ 70°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
5-SPAK

NE57811S,518 FAQ

1.How can I place an order for NE57811S,518 through Aetrix?

Please submit a Request for Quotation (RFQ) for NE57811S,518 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for NE57811S,518 reliable?

The price and inventory of NE57811S,518 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for NE57811S,518 is usually 5 days.

3.What payment methods are accepted for NE57811S,518?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for NE57811S,518 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for NE57811S,518?

NE57811S,518 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your NE57811S,518 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for NE57811S,518?

For technical support, including NE57811S,518 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your NE57811S,518 requirements.

6.How does Aetrix verify that NE57811S,518 is sourced from the original manufacturer or authorized distributors?

All NE57811S,518 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that NE57811S,518 meets industry standards.

7.What is the process for return or replacement of NE57811S,518?

All NE57811S,518 units undergo pre-shipment inspection (PSI). If there is an issue with NE57811S,518, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The NE57811S,518 part is unused and in its original packaging.

Return procedure for NE57811S,518:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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