onsemi NLSF308MNR2G

Overview

NLSF308MNR2G from onsemi is a quad 2-input AND gate IC fabricated in advanced high-speed CMOS technology, delivering TTL-compatible propagation delay (t_PD = 4.3 ns typ @ V_CC = 5.0 V) with CMOS-level power efficiency (I_CC ≤ 2.0 µA max @ T_A = 25°C). It operates across 2.0–5.5 V, tolerates 7.0 V inputs for mixed-voltage interfacing, and features buffered outputs for noise immunity - used in digital logic control, level-shifting interfaces, and timing-critical combinational circuits.

For engineers reviewing the NLSF308MNR2G datasheet, pinout, applications, or equivalent options, key selection criteria include its QFN-16 package footprint, 4.3 ns propagation delay at 5 V, ±25 mA output drive, 7.0 V input tolerance, and guaranteed operation from −40°C to +85°C.

Technical Context

The NLSF308MNR2G implements four independent 2-input AND gates in a single monolithic silicon-gate CMOS die, with three-stage internal buffering to ensure stable output transitions and high noise immunity (V_NIH/V_NIL = 28% V_CC). Its input structure supports overvoltage tolerance up to 7.0 V, enabling safe interfacing between 3.0 V and 5.0 V logic domains without external level shifters.

Designed for low-noise digital systems, it specifies VOLP ≤ 0.8 V (max) and exhibits balanced t_PLH/t_PHL propagation delays. Latchup performance exceeds 300 mA, and ESD robustness meets HBM > 2000 V and MM > 200 V - critical for industrial and automotive-adjacent control logic applications.

Key Specifications

Pinout & Package

Package: QFN-16 (3 mm × 3 mm, 0.5 mm pitch, exposed thermal pad), case 485G, Pb-free (G suffix), moisture sensitivity level 1.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar quad 2-input AND gate applications.

Compared with SN74LVC08APWR and 74AUP1G08GW,125, the NLSF308MNR2G uniquely combines 7.0 V input tolerance, quad integration in QFN-16, and industrial temperature support - making it optimal for mixed-voltage control logic where layout density and interface flexibility are critical.

Availability

NLSF308MNR2G is available at Aetrix Electronics and suitable for industrial PLCs, automotive body controllers, medical instrument sequencing, and IoT sensor fusion nodes requiring stable component supply, full Pb-free compliance, and guaranteed long-term availability.

Supply support for NLSF308MNR2G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

onsemi (formerly ON Semiconductor) is a global semiconductor supplier specializing in energy-efficient, high-performance silicon solutions for automotive, industrial, cloud, and intelligent power systems.

The NLSF308MNR2G belongs to onsemi's high-speed logic family, engineered for robust mixed-voltage digital interfacing in harsh-environment control applications - emphasizing noise immunity, latchup resilience, and wide operating margins.

FAQ

What is the maximum input voltage rating for NLSF308MNR2G, and how does it benefit system design?

The NLSF308MNR2G supports DC input voltages from −0.5 V to +7.0 V, independent of V_CC. This allows direct connection of 5.0 V logic signals (e.g., from legacy microcontrollers) to a 3.3 V-powered NLSF308MNR2G without external level shifters or clamping diodes. In practice, this simplifies board layout, reduces BOM count, and improves reliability in mixed-voltage industrial control systems where the NLSF308MNR2G serves as an interface gate.

Does NLSF308MNR2G support operation at 2.0 V, and what are the timing implications?

Yes, NLSF308MNR2G is fully specified down to V_CC = 2.0 V, with AC characteristics including t_PLH/t_PHL ≤ 10.5 ns (max) at 2.0 V, CL = 15 pF. At this voltage, propagation delay increases versus 5.0 V operation, but the device remains functional and compliant across the full −40°C to +85°C range. This makes the NLSF308MNR2G suitable for battery-powered edge devices where supply voltage may sag to 2.0 V, and the NLSF308MNR2G maintains deterministic AND logic behavior without timing violation.

How is thermal management handled in the QFN-16 package of NLSF308MNR2G?

The NLSF308MNR2G uses a QFN-16 package (case 485G) with an exposed thermal pad that must be soldered to a PCB copper pour for effective heat dissipation. The datasheet specifies a maximum power dissipation of 450 mW in still air, and thermal resistance θ_JA is optimized via the pad connection. For reliable operation at full output drive (±25 mA per pin), Aetrix recommends minimum 200 mm² of 2-oz copper connected to the pad with ≥4 thermal vias - ensuring the NLSF308MNR2G stays within its −40°C to +85°C junction temperature limits under continuous load.

Are the NC pins on NLSF308MNR2G required to be left floating, or can they be grounded?

Pins 11 and 14 of the NLSF308MNR2G are explicitly designated as No-Connect (NC) in the datasheet and marking diagram. They are not bonded internally and must remain unconnected - neither grounded nor tied to V_CC. Routing traces to or placing solder on these pins risks mechanical stress on the bond wires or contamination of the die surface. The NLSF308MNR2G's functionality and reliability are guaranteed only when NC pins are left floating and unpopulated, per onsemi's assembly and test specifications.

What is the significance of the 'G' suffix in NLSF308MNR2G, and does it affect electrical performance?

The 'G' suffix in NLSF308MNR2G denotes full compliance with Pb-free (lead-free) packaging requirements per JEDEC J-STD-609, using matte tin termination and RoHS-compliant materials. Electrical performance, timing, and thermal specs are identical to the non-Pb-free NLSF308MNR2 variant. The 'G' version is qualified for lead-free reflow profiles (peak 260°C), and the NLSF308MNR2G is the recommended choice for new designs targeting modern environmental compliance standards without trade-offs in speed, power, or ruggedness.