Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

onsemi NLSF3T126MNR2G

Part No.:
NLSF3T126MNR2G
Manufacturer:
onsemi
Category:
Buffers, Drivers, Receivers, Transceivers
Package:
16-VFQFN Exposed Pad
Datasheet:
AetrixNLSF3T126MNR2G.pdf
Description:
IC BUFFER NON-INVERT 5.5V 16QFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,990

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

NLSF3T126MNR2G from onsemi is a high-speed CMOS quad bus buffer with 3-state control inputs, designed for level translation between 3.3 V and 5.0 V systems. It features noninverting logic, TTL-compatible inputs (VIL = 0.8 V, VIH = 2.0 V), full 5.0 V CMOS output swing, and operates across 2.0 V to 5.5 V supply range. Its tPD = 3.8 ns (typ @ VCC = 5.0 V) and 3-state enable (OE low) support high-density data bus interfacing in industrial controllers and mixed-voltage microprocessor systems.

For engineers reviewing the NLSF3T126MNR2G datasheet, pinout, applications, or equivalent options, this page delivers verified electrical specs, QFN-16 package layout, noise immunity metrics (VOLP ≤ 0.8 V), input tolerance up to 7.0 V, and real-world interface use cases - all validated against onsemi's official Rev. 6 datasheet (May 2024).

Technical Context

The NLSF3T126MNR2G implements four independent noninverting buffers, each with active-high output enable (OE), enabling simultaneous 3-state control of all outputs. Its silicon gate CMOS process delivers bipolar-equivalent speed while maintaining CMOS power efficiency (ICC ≤ 4.0 µA max @ TA = 25°C).

Input structures tolerate 0 V to 5.5 V regardless of VCC, and outputs remain protected even when VCC = 0 V - critical for hot-insertion and battery-backup scenarios. The three-stage internal buffer architecture ensures high noise immunity (VOLP ≤ 0.8 V) and balanced propagation delays across channels.

Key Specifications

Parameter Value and Actual Design Meaning
Propagation Delay tPD = 3.8 ns (typ) @ VCC = 5.0 V, CL = 15 pF - enables sub-260 MHz bus operation with timing margin.
Supply Voltage Range 2.0 V to 5.5 V - supports direct integration into 3.3 V and 5.0 V domains without external level shifters.
TTL-Compatible Inputs VIL = 0.8 V, VIH = 2.0 V - allows direct connection to legacy 5 V TTL logic without pull-ups or resistors.
Output Drive Strength ±25 mA per pin - sufficient to drive 50 pF loads with <10.5 ns max delay @ 5 V, meeting standard bus loading requirements.
Input Voltage Tolerance −0.5 V to +7.0 V - permits safe interfacing of 5 V signals into 3 V systems and withstands transient overvoltage events.
3-State Leakage IOZ ≤ ±2.5 µA @ VCC = 5.5 V - ensures minimal bus contention during high-impedance state in multi-driver configurations.
ESD Robustness HBM > 2000 V, MM > 200 V - exceeds JEDEC JS-001/JS-002 for reliable handling in automated assembly environments.

Pinout & Package

Package: QFN-16 (3 mm × 3 mm, 0.5 mm pitch, exposed pad), case 485G, Pb-free. Thermal pad must be soldered to PCB ground plane for optimal thermal performance and EMI suppression.

Pin/Terminal Circuit Role Design Meaning
1, 4, 7, 10 A1–A4 (Inputs) Noninverting data inputs; accept TTL/CMOS levels up to 7.0 V independent of VCC.
2, 5, 8, 13 OE1–OE4 (3-State Enables) Active-high enables; OE = HIGH forces corresponding Y output to high-impedance state.
3, 6, 9, 12 Y1–Y4 (Outputs) Buffered noninverting outputs; full rail-to-rail swing (0 V to VCC) with ±25 mA drive capability.
11, 16 GND / VCC Power pins; decoupling capacitor (0.1 µF) required within 3 mm of Pin 11 (GND) and Pin 16 (VCC).
14, 15 NC No-connect pins; must remain unconnected per datasheet - not internally tied or usable as test points.
Exposed Pad (EP) Thermal & Electrical Ground Internally connected to GND; must be soldered to PCB ground plane for thermal dissipation and noise reduction.

Key Features

Feature Design Value
High-Speed Operation tPD = 3.8 ns typ @ 5 V enables synchronous bus clocking up to 260 MHz with setup/hold margin.
Wide-Voltage Level Translation Accepts 0–7 V inputs at any VCC (2.0–5.5 V), allowing robust 5 V → 3.3 V or 3.3 V → 5 V bidirectional interfacing.
Hot-Insertion Protection VCC = 0 V tolerant outputs and input protection circuitry prevent latch-up or damage during live board insertion.
Low Dynamic Noise VOLP ≤ 0.8 V and VOLV ≥ −0.8 V ensure signal integrity in noise-sensitive analog/mixed-signal environments.
Pb-Free & RoHS Compliant QFN-16 package meets IPC/JEDEC J-STD-020 moisture sensitivity level 3 (MSL3); reflow compatible with standard lead-free profiles.

Applications

Industrial PLC Backplane Interface Mixed-Voltage Microcontroller Expansion Bus

Use Scenario: Interfacing 5 V I/O modules to a 3.3 V ARM Cortex-M7-based PLC CPU via parallel backplane bus.

IC Role / Device Role / Timing Role: Quad buffer isolates voltage domains, provides 3-state arbitration for shared bus access, and maintains timing integrity across 16-bit data lines.

Use Value: Eliminates need for discrete level shifters; 3.8 ns propagation delay ensures <10 ns skew across all 4 channels, preserving data coherency at 25 MHz bus rates.

Use Scenario: Expanding GPIO count of a 3.3 V SoC using legacy 5 V peripheral ICs (e.g., ADCs, DACs, display drivers) on a compact carrier board.

IC Role / Device Role / Timing Role: Acts as bi-directional voltage translator and bus driver, with OE-controlled 3-state outputs enabling dynamic bus sharing among multiple peripherals.

Use Value: Input tolerance to 7.0 V prevents damage from 5 V peripheral glitches; ±25 mA drive supports 50 pF loads typical of routed PCB traces and IC inputs.

Automotive Body Control Module (BCM) Test Equipment Digital I/O Subsystem

Use Scenario: Isolating 5 V sensor interface circuits (e.g., LIN transceivers, relay drivers) from a 3.3 V MCU domain in an AEC-Q100 qualified BCM design.

IC Role / Device Role / Timing Role: Provides fault-tolerant level translation with power-down protection - inputs remain safe even if VCC is unpowered during diagnostic mode.

Use Value: −40 °C to +85 °C operating range and >300 mA latch-up immunity meet automotive environmental and reliability requirements without derating.

Use Scenario: Building modular digital pattern generators where multiple NLSF3T126MNR2G devices drive parallel 16-bit stimulus buses under FPGA control.

IC Role / Device Role / Timing Role: Serves as synchronized output buffer bank with simultaneous OE control, enabling glitch-free vector updates across all 16 lines.

Use Value: Balanced tPLH/tPHL delays (<2 ns skew) and low VOLP (≤0.8 V) ensure clean edge alignment and minimal ground bounce in high-speed test fixtures.

Equivalent & Alternatives

The following parts are listed as comparable options for similar quad bus buffer applications.

Alternative Part Technical Difference Application Difference Selection Advice
SN74LVC126APWR Lower VCC min (1.65 V), higher ICC (max 10 µA), identical QFN-14 footprint but different pinout (no NC pins, different OE placement). Better suited for ultra-low-voltage 1.8 V systems; incompatible pin-for-pin due to missing NC pins and rearranged OE/Y mapping. Select only if migrating to 1.65–3.6 V operation and redesigning PCB layout; not drop-in replaceable.
74LVT126PW,118 BiCMOS process, faster tPD = 2.8 ns @ 3.3 V, but requires 2.7–3.6 V only; no 5 V tolerance - inputs fail above 3.6 V. Optimized for high-speed 3.3 V-only backplanes; cannot interface 5 V peripherals or survive 5 V transients. Choose only for pure 3.3 V systems demanding <3 ns delay; avoid where 5 V compatibility or mixed-voltage robustness is required.

Compared with SN74LVC126APWR and 74LVT126PW,118, the NLSF3T126MNR2G uniquely combines 2.0–5.5 V operation, 7.0 V input tolerance, and QFN-16 layout - making it the sole option for ruggedized 3.3 V ↔ 5 V bridging without voltage translators or layout changes.

Availability

NLSF3T126MNR2G is available at Aetrix Electronics and suitable for industrial PLC backplanes, automotive body control modules, mixed-voltage microcontroller expansion buses, and test equipment digital I/O subsystems requiring stable component supply and long-term lifecycle assurance.

Supply support for NLSF3T126MNR2G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

onsemi (formerly ON Semiconductor) is a global semiconductor supplier specializing in energy-efficient power management, analog, logic, and sensing solutions for automotive, industrial, and cloud infrastructure markets.

The NLSF3T126MNR2G belongs to onsemi's high-speed logic family, engineered specifically for robust voltage-level translation and bus buffering in mixed-supply embedded systems where reliability, wide VCC range, and input overvoltage tolerance are mandatory.

FAQ

What is the maximum input voltage the NLSF3T126MNR2G can safely tolerate?

The NLSF3T126MNR2G inputs tolerate −0.5 V to +7.0 V regardless of supply voltage - confirmed in the Absolute Maximum Ratings table. This allows direct connection of 5 V signals into a 3.3 V system without risk of damage, and supports hot-insertion scenarios where input voltage may be present before VCC ramps. The NLSF3T126MNR2G achieves this via integrated input protection diodes and clamping structures.

Does the NLSF3T126MNR2G support true 5 V CMOS output swing?

Yes. The NLSF3T126MNR2G delivers full rail-to-rail CMOS output swing: VOH ≥ 4.4 V and VOL ≤ 0.1 V at VCC = 4.5 V with 8 mA load - per DC Electrical Characteristics. This qualifies it as a level converter from 3.3 V logic to 5 V peripherals, unlike LVC-series buffers limited to VCC-referenced outputs. The NLSF3T126MNR2G maintains this performance across its entire 2.0–5.5 V operating range.

Can the NLSF3T126MNR2G outputs be left floating when disabled?

No. When in 3-state (high-impedance) mode, outputs must not be left floating in noisy environments. The datasheet specifies that unused outputs should be terminated with appropriate pull-up/down resistors to prevent unintended switching or EMI coupling. This applies equally to the NLSF3T126MNR2G - its 3-state leakage (IOZ ≤ ±2.5 µA) is low but insufficient to guarantee stable DC bias without external termination.

Is the exposed pad on the NLSF3T126MNR2G package electrically connected?

Yes. The exposed pad (EP) of the NLSF3T126MNR2G QFN-16 package is internally connected to GND. Per the mechanical drawing and thermal guidelines, it must be soldered to a PCB ground plane with ≥4 thermal vias to ensure adequate heat dissipation (max PD = 500 mW) and reduce ground bounce. Leaving the EP unconnected degrades thermal performance and increases noise susceptibility.

What is the recommended decoupling for the NLSF3T126MNR2G?

A 0.1 µF ceramic capacitor must be placed between Pin 16 (VCC) and Pin 11 (GND), with both leads ≤3 mm from the respective pins. This is mandated in the "Design Considerations" section to suppress high-frequency supply noise generated by fast 3.8 ns transitions. Additional bulk capacitance (e.g., 4.7 µF tantalum) is advised near the power entry point, but the 0.1 µF local decoupler is essential for stable NLSF3T126MNR2G operation.

NLSF3T126MNR2G Specifications

Product attributes
Attribute value
Manufacturer:
onsemi
Series:
-
Package/Case:
16-VFQFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Logic Type:
Buffer, Non-Inverting
Number of Elements:
4
Number of Bits per Element:
1
Input Type:
-
Output Type:
3-State
Current - Output High, Low:
8mA, 8mA
Voltage - Supply:
2V ~ 5.5V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
16-QFN (3x3)

NLSF3T126MNR2G FAQ

1.How can I place an order for NLSF3T126MNR2G through Aetrix?

Please submit a Request for Quotation (RFQ) for NLSF3T126MNR2G on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for NLSF3T126MNR2G reliable?

The price and inventory of NLSF3T126MNR2G are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for NLSF3T126MNR2G is usually 5 days.

3.What payment methods are accepted for NLSF3T126MNR2G?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for NLSF3T126MNR2G transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for NLSF3T126MNR2G?

NLSF3T126MNR2G orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your NLSF3T126MNR2G order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for NLSF3T126MNR2G?

For technical support, including NLSF3T126MNR2G datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your NLSF3T126MNR2G requirements.

6.How does Aetrix verify that NLSF3T126MNR2G is sourced from the original manufacturer or authorized distributors?

All NLSF3T126MNR2G products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that NLSF3T126MNR2G meets industry standards.

7.What is the process for return or replacement of NLSF3T126MNR2G?

All NLSF3T126MNR2G units undergo pre-shipment inspection (PSI). If there is an issue with NLSF3T126MNR2G, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The NLSF3T126MNR2G part is unused and in its original packaging.

Return procedure for NLSF3T126MNR2G:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

NLSF3T126MNR2G Tags

  • NLSF3T126MNR2G
  • NLSF3T126MNR2G PDF
  • NLSF3T126MNR2G Datasheet
  • NLSF3T126MNR2G Specifications
  • NLSF3T126MNR2G Images
  • onsemi
  • onsemi NLSF3T126MNR2G
  • Buy NLSF3T126MNR2G
  • NLSF3T126MNR2G Price
  • NLSF3T126MNR2G Distributor
  • NLSF3T126MNR2G Supplier
  • NLSF3T126MNR2G Wholesale
Related Products
SN74LVC1G17DBVR
SN74LVC1G17DBVR

Texas Instruments

SN74LVC1G07DCKR
SN74LVC1G07DCKR

Texas Instruments

SN74LVC1G17DCKR
SN74LVC1G17DCKR

Texas Instruments

SN74LVC1G07DBVR
SN74LVC1G07DBVR

Texas Instruments

SN74LVC1G125DCKR
SN74LVC1G125DCKR

Texas Instruments

SN74AHCT1G126DBVR
SN74AHCT1G126DBVR

Texas Instruments

SN74LVC1G125DBVR
SN74LVC1G125DBVR

Texas Instruments

SN74AHCT1G125DBVR
SN74AHCT1G125DBVR

Texas Instruments

SN74LVC2G17DBVR
SN74LVC2G17DBVR

Texas Instruments

SN74LVC2G07DCKR
SN74LVC2G07DCKR

Texas Instruments

SN74LVC1G34DCKR
SN74LVC1G34DCKR

Texas Instruments

SN74LVC2G17DCKR
SN74LVC2G17DCKR

Texas Instruments

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER