onsemi NLX2G16AMX1TCG
- Part No.:
- NLX2G16AMX1TCG
- Manufacturer:
- onsemi
- Package:
- 6-XFLGA
- Datasheet:
-
NLX2G16AMX1TCG.pdf
- Description:
- IC BUF NON-INVERT 5.5V 6ULLGA
- Quantity:
- Payment:

- Shipping:

Inventory:2,199
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
NLX2G16AMX1TCG from onsemi is a dual non-inverting CMOS buffer IC designed for high-speed signal buffering in space-constrained applications. It operates from 1.65 V to 5.5 V, delivers 1.8 ns typical propagation delay at 5.0 V, supports ±24 mA balanced output drive, and features overvoltage-tolerant (OVT) inputs/outputs up to 7.0 V - enabling robust interfacing in mixed-voltage industrial control and automotive subsystems.
For engineers reviewing the NLX2G16AMX1TCG datasheet, pinout, applications, or equivalent options, key selection criteria include its UDFN6-1.45×1.0 mm package, 125°C operating temperature range, OVT I/O architecture, and AEC-Q100 qualification for automotive use cases requiring reliability under voltage transients and thermal stress.
Technical Context
The NLX2G16AMX1TCG implements two independent, unidirectional non-inverting buffer channels with rail-to-rail input tolerance and symmetrical output drive strength. Its input structure remains functional even when VIN exceeds VCC by up to 2.0 V, eliminating level-shifter requirements in multi-supply domains.
All logic states are maintained across the full −55°C to +125°C operating range, with propagation delays tightly controlled (e.g., 0.5–3.2 ns max at 5.0 V, CL = 15 pF) and input leakage limited to ±0.1 µA at 25°C - ensuring predictable timing and low standby current in always-on sensor interfaces.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 1.65 V to 5.5 V - supports direct interface with 1.8 V, 2.5 V, 3.3 V, and 5 V logic families without external regulators. |
| tPD (Typ) | 1.8 ns @ VCC = 5.0 V, CL = 15 pF - enables sub-500 MHz signal buffering with minimal skew between channels. |
| IO (Source/Sink) | ±24 mA - drives standard TTL loads and short PCB traces without external buffers. |
| VIN/VOUT Tolerance | −0.5 V to +7.0 V - withstands transient overvoltage events and allows hot-swap operation in systems with uncontrolled power sequencing. |
| Operating Temp | −55°C to +125°C - qualified for under-hood automotive, industrial motor control, and outdoor infrastructure applications. |
| ICC (Max) | 10 µA @ TA = 25°C - ensures ultra-low static power in battery-backed or energy-harvesting nodes. |
| Package | UDFN6, 1.45 mm × 1.0 mm, 0.5 mm pitch - fits in <1.5 mm² board area, ideal for wearables and compact ECUs. |
Pinout & Package
Package: UDFN6 (1.45 mm × 1.0 mm, 0.5 mm pitch), exposed thermal pad, RoHS-compliant, Pb-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 - IN A2 | Input of second buffer channel | Accepts overvoltage-tolerant digital signals; referenced to GND, independent of VCC level. |
| 2 - IN A1 | Input of first buffer channel | Non-inverting input with identical OVT behavior as Pin 1; enables dual-channel fanout. |
| 3 - GND | Ground reference | Primary return path for both output drivers and internal logic; must be low-impedance for noise immunity. |
| 4 - VCC | Positive supply | Single supply for both buffers; powers internal circuitry and defines logic thresholds (VIH/VIL). |
| 5 - OUT Y2 | Output of second buffer channel | CMOS-compatible output with ±24 mA drive; maintains OVT capability up to +7.0 V when sinking current. |
| 6 - OUT Y1 | Output of first buffer channel | Matches Pin 5 electrically and thermally; supports matched propagation delay (tPLH/tPHL ≤ 0.5 ns skew). |
Key Features
| Feature | Design Value |
|---|---|
| Overvoltage-Tolerant I/O | Inputs and outputs withstand −0.5 V to +7.0 V regardless of VCC - eliminates need for external clamping diodes in noisy environments. |
| Ultra-Small UDFN6 Footprint | 1.45 mm × 1.0 mm package reduces PCB area by >60% vs. SOIC-8 - critical for miniaturized ADAS modules and portable diagnostics tools. |
| AEC-Q100 Qualified | Grade 1 (−40°C to +125°C) qualification with PPAP support - meets automotive electronics reliability and traceability requirements. |
| Balanced Propagation Delay | tPLH and tPHL differ by ≤0.5 ns per channel - preserves signal integrity in clock distribution and data strobe paths. |
| Low Dynamic Power | CPD = 9–11 pF at 3.3–5.5 V - limits switching power to <150 µW at 10 MHz, extending battery life in remote sensors. |
Applications
| Automotive Body Control Module | Industrial PLC I/O Expansion |
|---|---|
|
Use Scenario: Buffering wake-up signals from door handle sensors to microcontroller GPIOs in low-power sleep mode. IC Role / Device Role / Timing Role: Dual non-inverting buffer isolating 5 V sensor outputs from 3.3 V MCU inputs while tolerating load-dump transients. Use Value: Eliminates external level shifters and TVS diodes due to 7.0 V OVT I/O, reducing BOM count and layout complexity. |
Use Scenario: Driving multiple optocoupler inputs from a single FPGA I/O bank in modular I/O cards. IC Role / Device Role / Timing Role: Fanout buffer providing matched delay and ±24 mA drive to parallel isolated inputs. Use Value: Ensures simultaneous turn-on of optocouplers with <0.5 ns inter-channel skew, improving system-level timing margin. |
| Medical Wearable Sensor Hub | Smart Building Occupancy Controller |
|
Use Scenario: Interfacing analog front-end interrupt lines to an ultra-low-power ARM Cortex-M0+ core. IC Role / Device Role / Timing Role: Low-leakage (±0.1 µA) buffer preserving MCU sleep current while passing edge-triggered wake events. Use Value: Enables sub-1 µA system sleep current - extending coin-cell battery life beyond 12 months. |
Use Scenario: Conditioning PIR sensor outputs before feeding into a Zigbee SoC with strict 3.3 V input limits. IC Role / Device Role / Timing Role: Voltage-tolerant buffer accepting 5 V PIR pulses and translating to clean 3.3 V logic levels. Use Value: Prevents MCU input damage during brown-out conditions where PIR supply may exceed MCU rail. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74LVC2G16DBVR | Same 2-channel non-inverting function but rated only to 6.5 V I/O tolerance; no AEC-Q100 qualification; SOT-23-6 package (larger footprint). | Lacks automotive qualification and lower OVT margin - suitable for commercial-grade industrial gateways but not under-hood use. | Select when cost sensitivity outweighs automotive compliance and board space is less constrained. |
| NLVX2G16AMUTCG | Identical electrical specs and package; differs only in marking and PPAP documentation - same die, same test flow, same qualification data. | No functional difference; used exclusively for automotive customers requiring formal PPAP submission and traceable lot control. | Choose NLVX2G16AMUTCG only if OEM mandates PPAP documentation; otherwise NLX2G16AMX1TCG is functionally identical. |
Compared with SN74LVC2G16DBVR, NLX2G16AMX1TCG provides higher overvoltage resilience and automotive qualification in a smaller footprint; compared with NLVX2G16AMUTCG, it shares identical silicon and performance but omits PPAP-specific labeling - making it optimal for Tier 2 suppliers and non-OEM production.
Availability
NLX2G16AMX1TCG is available at Aetrix Electronics and suitable for automotive body electronics, industrial programmable logic controllers, and medical wearable sensor interfaces requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for NLX2G16AMX1TCG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
onsemi (formerly ON Semiconductor) is a global semiconductor supplier specializing in energy-efficient power management, analog, sensing, and connectivity solutions for automotive, industrial, and cloud infrastructure markets.
The NLX2G16AMX1TCG belongs to the MiniGate family of ultra-small logic ICs, engineered specifically for space-constrained, high-reliability applications where voltage resilience, low power, and AEC-Q100 compliance are mandatory design requirements.
FAQ
What is the maximum input voltage the NLX2G16AMX1TCG can tolerate?
The NLX2G16AMX1TCG supports DC input voltages from −0.5 V to +7.0 V on all pins, independent of VCC level. This overvoltage tolerance applies to both IN A1/IN A2 and OUT Y1/OUT Y2 pins, enabling safe operation during power sequencing mismatches or transient events without external protection components.
Does the NLX2G16AMX1TCG require external pull-up or pull-down resistors on unused inputs?
No - the NLX2G16AMX1TCG has no internal pull resistors, but its inputs are overvoltage-tolerant and CMOS-compatible. Unused inputs must be tied to VCC or GND to prevent floating states that could increase ICC or cause erratic output behavior; leaving them open is not permitted per datasheet recommendations.
Is the NLX2G16AMX1TCG pin-compatible with other MiniGate dual buffers like NLX2G00 or NLX2G04?
No - the NLX2G16AMX1TCG uses a dedicated 6-pin UDFN layout optimized for dual non-inverting buffers (Pins 1/2 = inputs, Pins 5/6 = outputs). NLX2G00 (dual NAND) and NLX2G04 (dual inverter) have different logic functions and incompatible pin assignments; they are not pin-compatible replacements.
What is the thermal performance of the NLX2G16AMX1TCG in its UDFN6 package?
The NLX2G16AMX1TCG's UDFN6 package (Case 517AQ) features an exposed thermal pad. With proper PCB copper pour (≥25 mm² thermal pad connected to internal ground plane), junction-to-board thermal resistance (θJB) is approximately 65°C/W, allowing continuous operation at full drive strength up to +125°C ambient when mounted per onsemi's recommended footprint.
Can the NLX2G16AMX1TCG be used in 1.2 V logic systems?
No - the NLX2G16AMX1TCG has a minimum VCC specification of 1.65 V per Recommended Operating Conditions. At 1.2 V, VIH/VIL thresholds become undefined, propagation delay increases unpredictably, and output drive falls below guaranteed specifications; it is not characterized or supported for 1.2 V operation.
NLX2G16AMX1TCG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- onsemi
- Series:
- MiniGate™
- Package/Case:
- 6-XFLGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Logic Type:
- Buffer, Non-Inverting
- Number of Elements:
- 2
- Number of Bits per Element:
- 1
- Input Type:
- -
- Output Type:
- Push-Pull
- Current - Output High, Low:
- 32mA, 32mA
- Voltage - Supply:
- 1.65V ~ 5.5V
- Operating Temperature:
- -55°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 6-ULLGA (1.45x1)
NLX2G16AMX1TCG FAQ
1.How can I place an order for NLX2G16AMX1TCG through Aetrix?
Please submit a Request for Quotation (RFQ) for NLX2G16AMX1TCG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for NLX2G16AMX1TCG reliable?
The price and inventory of NLX2G16AMX1TCG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for NLX2G16AMX1TCG is usually 5 days.
3.What payment methods are accepted for NLX2G16AMX1TCG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for NLX2G16AMX1TCG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for NLX2G16AMX1TCG?
NLX2G16AMX1TCG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your NLX2G16AMX1TCG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for NLX2G16AMX1TCG?
For technical support, including NLX2G16AMX1TCG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your NLX2G16AMX1TCG requirements.
6.How does Aetrix verify that NLX2G16AMX1TCG is sourced from the original manufacturer or authorized distributors?
All NLX2G16AMX1TCG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that NLX2G16AMX1TCG meets industry standards.
7.What is the process for return or replacement of NLX2G16AMX1TCG?
All NLX2G16AMX1TCG units undergo pre-shipment inspection (PSI). If there is an issue with NLX2G16AMX1TCG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The NLX2G16AMX1TCG part is unused and in its original packaging.
Return procedure for NLX2G16AMX1TCG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
NLX2G16AMX1TCG Tags
-
SN74LVC1G17DBVR
Texas Instruments
-
SN74LVC1G07DCKR
Texas Instruments
-
SN74LVC1G17DCKR
Texas Instruments
-
SN74LVC1G07DBVR
Texas Instruments
-
SN74LVC1G125DCKR
Texas Instruments
-
SN74AHCT1G126DBVR
Texas Instruments
-
SN74LVC1G125DBVR
Texas Instruments
-
SN74AHCT1G125DBVR
Texas Instruments

-
SN74LVC2G17DBVR
Texas Instruments

-
SN74LVC2G07DCKR
Texas Instruments
-
SN74LVC1G34DCKR
Texas Instruments

-
SN74LVC2G17DCKR
Texas Instruments
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…

