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Vishay General Semiconductor - Diodes Division NSB8BTHE3_B/I
- Part No.:
- NSB8BTHE3_B/I
- Manufacturer:
- Vishay General Semiconductor - Diodes Division
- Category:
- Single Diodes
- Package:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Datasheet:
-
NSB8BTHE3_B/I.pdf
- Description:
- DIODE GEN PURP 100V 8A TO263AB
- Quantity:
- Payment:
- Shipping:
Inventory:4,342
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Product details
Overview
NSB8BTHE3_B/I from Vishay General Semiconductor is a glass passivated single silicon rectifier diode in D2PAK (TO-263AB) package, rated for 100 V repetitive peak reverse voltage (VRRM), 8.0 A average forward current (IF(AV)), 125 A non-repetitive surge current (IFSM), 1.1 V forward voltage drop at 8.0 A, and operating junction temperature up to 150 °C. It serves as a freewheeling or output rectifier in DC/DC converters and industrial power supplies.
For engineers reviewing the NSB8BTHE3_B/I datasheet, NSB8BTHE3_B/I pinout, NSB8BTHE3_B/I application, or NSB8BTHE3_B/I equivalent, this page delivers verified electrical parameters, thermal resistance (RθJC = 5.0 °C/W), AEC-Q101 qualification status, RoHS-compliant halogen-free construction, and tape-and-reel packaging details - all critical for automotive-grade power supply design and high-reliability industrial rectification.
Technical Context
This device belongs to the NSB8xT family of general-purpose plastic rectifiers, optimized for high surge capability and low conduction loss in medium-power AC/DC and DC/DC conversion stages. Its glass-passivated chip junction ensures stable reverse leakage (IR ≤ 10 μA at 25 °C, ≤ 100 μA at 100 °C) and robustness against transient overvoltage stress.
The D2PAK (TO-263AB) package provides enhanced thermal performance over TO-220AC for surface-mount applications requiring mechanical reliability and automated assembly compatibility. With a typical junction-to-case thermal resistance of 5.0 °C/W, it supports sustained 8.0 A operation at TC = 100 °C when mounted on an adequate heatsink.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VRRM | 100 V - Maximum repetitive reverse blocking voltage; defines safe AC input or flyback voltage swing margin before breakdown. |
| IF(AV) | 8.0 A at TC = 100 °C - Continuous DC output current capability with proper heatsinking; sets minimum heatsink size requirement. |
| IFSM | 125 A (8.3 ms sine) - Peak surge withstand without failure; enables robust startup and fault-current handling in SMPS. |
| VF | 1.1 V at IF = 8.0 A, TJ = 25 °C - Low conduction loss directly reduces power dissipation and improves system efficiency. |
| RθJC | 5.0 °C/W - Thermal resistance from junction to case; used with heatsink RθCA to calculate maximum allowable ambient temperature. |
| TJ max. | 150 °C - Maximum junction temperature; determines derating curve slope and long-term reliability under thermal stress. |
| IR | 10 μA at VR = 100 V, TJ = 25 °C - Low reverse leakage preserves efficiency in high-impedance bias networks and standby modes. |
Pinout & Package
NSB8BTHE3_B/I uses the D2PAK (TO-263AB) surface-mount package with three terminals: Pin 1 (Anode), Pin 2 (Cathode), and Pin 3 (Exposed Cathode Tab / Heatsink Pad). The tab is electrically connected to the cathode and must be soldered to a thermally conductive PCB copper area for effective heat dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 | Anode | Input terminal for forward-biased current flow; connects to AC source or switching node in bridge/freewheeling configuration. |
| Pin 2 | Cathode | Output terminal for forward current; ties to DC bus or load return path; electrically isolated from tab in standard mounting. |
| Pin 3 (Tab) | Cathode (Exposed Metal Pad) | Primary thermal path to PCB; must be soldered to large copper pour; electrically identical to Pin 2 per datasheet mechanical drawing. |
Key Features
| Feature | Design Value |
|---|---|
| Glass passivated pellet chip junction | Enables stable reverse characteristics and long-term reliability under humidity and thermal cycling stress. |
| AEC-Q101 qualified | Validated for automotive power electronics applications including engine control modules and body electronics. |
| RoHS-compliant, halogen-free (HM3 suffix) | Meets global environmental regulations and eliminates corrosive halogen emissions during reflow or end-of-life processing. |
| Solderable matte tin plated leads | Ensures consistent wetting and joint integrity in lead-free reflow processes per J-STD-002 and JESD 22-B102. |
| MSL Level 1 (245 °C peak) | Allows unlimited floor life and direct placement without baking; simplifies SMT line logistics and inventory management. |
Applications
| Automotive DC/DC Converters | Industrial Motor Drive Freewheeling |
|---|---|
|
Use Scenario: Step-down conversion from 12 V or 48 V battery rails to 3.3 V/5 V logic supplies in ADAS ECUs. IC Role / Device Role / Timing Role: Output rectifier in synchronous or asynchronous buck converter topology. Use Value: 1.1 V VF minimizes conduction loss at 5–8 A loads; AEC-Q101 qualification ensures functional safety compliance. |
Use Scenario: Snubberless freewheeling path across IGBTs in 3-phase inverter stages driving HVAC compressors. IC Role / Device Role / Timing Role: Unidirectional current clamp during inductive turn-off transients. Use Value: 125 A IFSM safely absorbs motor back-EMF energy without avalanche degradation or bond wire fusing. |
| Server PSU Secondary Rectification | Renewable Energy Charge Controllers |
|
Use Scenario: High-efficiency 12 V output stage in telecom rectifiers delivering >500 W continuous power. IC Role / Device Role / Timing Role: Primary secondary-side rectifier in center-tapped or full-wave configuration. Use Value: 5.0 °C/W RθJC enables compact heatsink integration on dense server PCBs while maintaining TJ < 130 °C. |
Use Scenario: Battery charging path in solar micro-inverters managing MPPT output to 24 V/48 V lead-acid or LiFePO₄ banks. IC Role / Device Role / Timing Role: Reverse-polarity protection and unidirectional charge routing diode. Use Value: 10 μA IR at 25 °C prevents parasitic discharge overnight; 150 °C TJ rating supports outdoor enclosure operation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar rectifier diode applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STTH8L06S | 600 V VRRM, 8 A IF(AV), TO-220AC package, RθJC = 3.0 °C/W, VF = 1.7 V @ 8 A | Higher voltage rating but higher VF increases conduction loss in 100 V systems; through-hole mounting limits automation. | Select when higher reverse voltage margin is required and board space allows through-hole footprint. |
| ON Semi MUR8100CT | 1000 V VRRM, dual common-cathode configuration, TO-220AB package, VF = 1.75 V @ 8 A per leg | Dual-diode structure adds redundancy but doubles layout area; higher VF degrades efficiency in low-voltage outputs. | Prefer only in designs needing dual-channel rectification or legacy TO-220AB compatibility; not a direct replacement. |
Compared with STTH8L06S and MUR8100CT, NSB8BTHE3_B/I offers lower forward voltage (1.1 V vs ≥1.7 V), surface-mount D2PAK packaging for automated assembly, and AEC-Q101 qualification - making it optimal for space-constrained, high-efficiency, automotive-qualified 100 V rectification where thermal resistance and regulatory compliance are prioritized.
Availability
NSB8BTHE3_B/I is available at Aetrix Electronics and suitable for automotive DC/DC converters, industrial motor drive freewheeling circuits, and renewable energy charge controllers requiring stable component supply, halogen-free compliance, and AEC-Q101 validation.
Supply support for NSB8BTHE3_B/I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Vishay General Semiconductor is a global leader in discrete semiconductors, specializing in diodes, rectifiers, MOSFETs, and optoelectronics with emphasis on reliability, efficiency, and application-specific optimization.
The NSB8xT series was developed for high-surge, low-VF surface-mount rectification in automotive and industrial power systems - balancing thermal performance, regulatory compliance, and manufacturability in D2PAK packaging.
FAQ
What is the maximum junction temperature rating for NSB8BTHE3_B/I?
The NSB8BTHE3_B/I has a maximum junction temperature (TJ max.) of +150 °C, as specified in the Vishay datasheet Document Number 88690. This rating enables reliable operation in under-hood automotive environments and enclosed industrial enclosures. Derating curves show usable current drops linearly above TC = 100 °C, and the device must be mounted with sufficient copper area to maintain TJ ≤ 150 °C under worst-case load conditions. NSB8BTHE3_B/I's thermal design requires attention to PCB copper weight and heatsink interface quality.
Is NSB8BTHE3_B/I pin-compatible with other NSB8xT variants like NSB8JTHE3_B/I?
No - NSB8BTHE3_B/I is not pin-compatible with NSB8JTHE3_B/I because they differ in reverse voltage rating (100 V vs 600 V) and associated internal die design, though both share the same D2PAK (TO-263AB) mechanical footprint and pinout (Pin 1 = Anode, Pin 2 = Cathode, Pin 3 = Cathode Tab). Electrical substitution requires verification of surge capability, thermal resistance, and leakage behavior under actual circuit conditions. NSB8BTHE3_B/I must not be interchanged with higher-VRRM variants without redesign validation.
Does NSB8BTHE3_B/I require a heatsink in typical 8 A operation?
Yes - NSB8BTHE3_B/I requires a thermally effective PCB copper area acting as a heatsink, especially at IF(AV) = 8.0 A. With RθJC = 5.0 °C/W and typical RθCA ≈ 20–40 °C/W for 2–4 oz copper, junction temperature can exceed 150 °C without adequate copper pour or external heatsink. The datasheet specifies IF(AV) = 8.0 A only at TC = 100 °C, meaning case temperature must be actively managed. NSB8BTHE3_B/I's exposed cathode tab must be fully soldered to ≥ 4 cm² of 2 oz copper for stable operation.
What does the "HM3" suffix in NSB8BTHE3_B/I indicate?
The "HM3" suffix in NSB8BTHE3_B/I denotes RoHS-compliant, halogen-free construction and AEC-Q101 qualification - confirmed in Vishay's ordering information table and material categorization documentation (www.vishay.com/doc?99912). It also indicates compliance with JESD 201 Class 2 whisker testing, ensuring long-term solder joint integrity in automotive thermal cycles. NSB8BTHE3_B/I's HM3 designation differentiates it from E3 (RoHS only) and M3 (RoHS + halogen-free, not AEC-Q101) variants.
Can NSB8BTHE3_B/I be used in place of a Schottky diode in 12 V output rectification?
NSB8BTHE3_B/I is a standard PN junction rectifier, not a Schottky diode, so it has higher VF (1.1 V vs typical 0.4–0.6 V for Schottky) and slower recovery - making it unsuitable as a direct replacement where low VF or fast switching is critical. However, it offers superior surge robustness (125 A IFSM) and higher TJ rating (150 °C vs typically 125 °C for Schottky), so NSB8BTHE3_B/I may be preferred in cost-sensitive, non-high-frequency 12 V rectifiers where efficiency is secondary to ruggedness and temperature resilience.
NSB8BTHE3_B/I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Vishay General Semiconductor - Diodes Division
- Series:
- -
- Package/Case:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Technology:
- Standard
- Voltage - DC Reverse (Vr) (Max):
- 100 V
- Current - Average Rectified (Io):
- 8A
- Voltage - Forward (Vf) (Max) @ If:
- 1.1 V @ 8 A
- Speed:
- Standard Recovery >500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- -
- Current - Reverse Leakage @ Vr:
- 10 µA @ 100 V
- Capacitance @ Vr, F:
- 55pF @ 4V, 1MHz
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- TO-263AB (D2PAK)
- Operating Temperature - Junction:
- -55°C ~ 150°C
NSB8BTHE3_B/I FAQ
1.How can I place an order for NSB8BTHE3_B/I through Aetrix?
Please submit a Request for Quotation (RFQ) for NSB8BTHE3_B/I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for NSB8BTHE3_B/I reliable?
The price and inventory of NSB8BTHE3_B/I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for NSB8BTHE3_B/I is usually 5 days.
3.What payment methods are accepted for NSB8BTHE3_B/I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for NSB8BTHE3_B/I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for NSB8BTHE3_B/I?
NSB8BTHE3_B/I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your NSB8BTHE3_B/I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for NSB8BTHE3_B/I?
For technical support, including NSB8BTHE3_B/I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your NSB8BTHE3_B/I requirements.
6.How does Aetrix verify that NSB8BTHE3_B/I is sourced from the original manufacturer or authorized distributors?
All NSB8BTHE3_B/I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that NSB8BTHE3_B/I meets industry standards.
7.What is the process for return or replacement of NSB8BTHE3_B/I?
All NSB8BTHE3_B/I units undergo pre-shipment inspection (PSI). If there is an issue with NSB8BTHE3_B/I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The NSB8BTHE3_B/I part is unused and in its original packaging.
Return procedure for NSB8BTHE3_B/I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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