My Inquiry
My Account
NXP Semiconductors NTSX2102GU8H
- Part No.:
- NTSX2102GU8H
- Manufacturer:
- NXP Semiconductors
- Category:
- Translators, Level Shifters
- Package:
- Datasheet:
-
NTSX2102GU8H.pdf
- Description:
- IC TRANSLTR BIDIRECTIONAL 8XQFN
- Quantity:
- Payment:
- Shipping:
Inventory:11,050
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
NTSX2102GU8H from NXP Semiconductors is a 2-bit dual-supply bidirectional voltage-level translating transceiver with auto-direction sensing and open-drain I/O, supporting 1.65 V to 5.5 V on both VCC(A) and VCC(B), delivering up to 52 Mbit/s data rate at 5.0 V supply, and featuring IOFF partial power-down protection for mixed-voltage I²C/SMBus interconnects.
For engineers reviewing the NTSX2102GU8H datasheet, NTSX2102GU8H pinout, NTSX2102GU8H application, or NTSX2102GU8H equivalent, this page delivers verified supply range, propagation delay (as low as 1 ns tPLH), IOFF leakage (<±2 μA), ESD robustness (HBM >2000 V), and XQFN8 package mechanical data - all confirmed from NXP's Rev. 2.3 product data sheet.
Technical Context
The NTSX2102GU8H implements a switch-type architecture using dual N-channel pass-gate transistors per channel, coupled with one-shot edge-rate accelerators that activate PMOS/NMOS drivers for <25 ns during signal transitions. It requires no external direction control and operates with independent 1.65–5.5 V supplies referenced to separate ground domains.
Each I/O pair (A1/B1, A2/B2) functions bidirectionally via automatic direction sensing; OE is active-HIGH and referenced to VCC(A). The device enters high-impedance OFF-state when OE = LOW or either VCC is at GND, enabling safe partial power-down in multi-rail systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Range | VCC(A) and VCC(B): 1.65 V to 5.5 V - enables translation between 1.8 V/2.5 V/3.3 V/5.0 V rails without level-shifter configuration. |
| Data Rate | Up to 52 Mbit/s at VCC(A)=VCC(B)=5.0 V - supports high-speed I²C Fast-mode Plus and GPIO bridging in compact layouts. |
| Propagation Delay | tPLH/tPHL as low as 1 ns (typ) - ensures timing-critical bidirectional signaling integrity across voltage domains. |
| IOFF Leakage | ±2 μA max at VCC = 0 V - prevents backflow current during power sequencing, critical for hot-swap and partial shutdown. |
| ESD Robustness | HBM >2000 V, CDM >2000 V - sustains handling and board-level transients without latch-up or parametric shift. |
| Operating Temp | –40 °C to +85 °C - qualified for industrial and automotive-adjacent embedded control applications. |
| Input Voltage Tolerance | Inputs accept up to 5.5 V regardless of VCC - allows direct interfacing with legacy 5 V logic driving lower-voltage domains. |
Pinout & Package
XQFN8 package (SOT1309-1): plastic extremely thin quad flat package, no leads, 1.4 × 1.2 × 0.5 mm body, exposed thermal pad not electrically connected.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | VCC(A) | Supply for A-side I/Os and OE input - defines logic thresholds and drive strength for A1/A2/OE. |
| 2 | A1 | Bidirectional data port referenced to VCC(A) - auto-senses direction and translates voltage to B1 domain. |
| 3 | A2 | Bidirectional data port referenced to VCC(A) - independent channel with identical auto-direction behavior as A1. |
| 4 | GND | Common reference ground - required for stable operation and ESD path; must be low-impedance. |
| 5 | OE | Active-HIGH output enable referenced to VCC(A) - forces all I/Os into high-Z when LOW, enabling bus arbitration. |
| 6 | B1 | Bidirectional data port referenced to VCC(B) - translates signals from A1 while maintaining B-side voltage domain integrity. |
| 7 | B2 | Bidirectional data port referenced to VCC(B) - second independent channel, fully isolated from A-side supply noise. |
| 8 | VCC(B) | Supply for B-side I/Os - sets output voltage levels and input thresholds for B1/B2 ports. |
Key Features
| Feature | Design Value |
|---|---|
| Auto-direction sensing | Eliminates need for external direction-control signals - reduces PCB routing complexity and firmware overhead in bidirectional buses. |
| IOFF partial power-down | Blocks damaging backflow current when either VCC(A) or VCC(B) is unpowered - enables safe mixed-rail power sequencing. |
| Open-drain compatible I/O | Supports wired-AND topologies essential for I²C/SMBus - eliminates contention risk during bidirectional communication. |
| Edge-rate acceleration | One-shot circuit reduces transition times to ≤11 ns (tTHL at 5 V) - maintains signal integrity without external pull-up tuning. |
| Wide voltage interoperability | Translates between any combination of 1.65–5.5 V supplies - replaces multiple fixed-ratio translators with single-footprint solution. |
Applications
| Industrial I²C Sensor Hub | Multi-Rail Microcontroller GPIO Expansion |
|---|---|
|
Use Scenario: Interfacing 3.3 V microcontroller I²C master with 1.8 V MEMS sensors and 5.0 V EEPROM in factory automation node. IC Role / Device Role / Timing Role: Bidirectional voltage translator with auto-direction detection on SDA/SCL lines, enabling seamless protocol compliance across three voltage domains. Use Value: Eliminates manual direction control logic and reduces BOM count by consolidating three discrete level-shifters into one XQFN8 device. |
Use Scenario: Expanding GPIO count of an ARM Cortex-M4 (VDDIO=3.3 V) to drive 5.0 V actuators and read 2.5 V analog front-end status lines. IC Role / Device Role / Timing Role: Dual-channel open-drain translator providing independent, supply-isolated signal paths with sub-2 ns skew between channels. Use Value: Enables deterministic timing for synchronized actuator control and sensor polling without cross-domain ground bounce coupling. |
| Hot-Swappable SMBus Battery Management | Legacy 5 V Peripheral Integration |
|
Use Scenario: Connecting hot-pluggable smart battery packs (1.8 V SMBus) to host system operating at 3.3 V, requiring safe power sequencing. IC Role / Device Role / Timing Role: IOFF-enabled translator ensuring zero backfeed current during battery insertion/removal while maintaining SMBus timing specs. Use Value: Prevents system reset or rail collapse during hot-swap events - certified for JEITA EM-1100 compliant battery interfaces. |
Use Scenario: Integrating legacy 5 V UART peripherals (e.g., GPS modules) with modern 1.8 V SoC without redesigning power delivery. IC Role / Device Role / Timing Role: High-tolerance input translator accepting 5 V logic swings while driving 1.8 V receiver inputs with controlled rise/fall times. Use Value: Avoids external clamping diodes and pull-up resistors - simplifies layout and improves EMI margin in space-constrained IoT gateways. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bidirectional voltage translation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NTSX0102TLH | XSON8 package with center thermal pad (non-connected); same pinout but different footprint; max data rate 40 Mbit/s at 5 V. | Requires PCB pad revision for thermal anchoring; not drop-in for NTSX2102GU8H due to 1.4×1.2 mm vs 3×2 mm body size. | Select when thermal dissipation >150 mW is required and board layout accommodates larger XSON8 footprint. |
| TXS0102DCTR | Texas Instruments part; 2-bit, dual-supply, auto-direction; VCC range 1.65–5.5 V; max 60 Mbit/s; different pinout (SOIC-8). | SOIC-8 package increases board area by 4.5×; lacks IOFF specification - not suitable for partial power-down use cases. | Choose only if SOIC hand-soldering or legacy footprint reuse is mandatory and IOFF is not required. |
Compared with NTSX2102GU8H, NTSX0102TLH offers identical functionality in a thermally enhanced XSON8 package but demands PCB layout change, while TXS0102DCTR provides higher speed in through-hole-compatible SOIC but omits IOFF protection and increases board real estate significantly.
Availability
NTSX2102GU8H is available at Aetrix Electronics and suitable for industrial sensor hubs, multi-rail microcontroller GPIO expansion, and hot-swappable SMBus battery management requiring stable component supply and guaranteed long-term sourcing.
Supply support for NTSX2102GU8H includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in interface and power management ICs.
The NTSX2102GU8H belongs to NXP's auto-direction voltage translator family, engineered specifically for robust, low-latency bidirectional level shifting in resource-constrained embedded systems where supply independence and IOFF safety are mandatory.
FAQ
What is the maximum data rate supported by the NTSX2102GU8H?
The NTSX2102GU8H supports up to 52 Mbit/s when both VCC(A) and VCC(B) are supplied at 5.0 V, as specified in Table 10 of the NXP Rev. 2.3 datasheet. At lower voltages (e.g., 3.3 V), the maximum data rate is 40 Mbit/s. This performance enables compatibility with I²C Fast-mode Plus and high-speed GPIO bridging without external timing components.
Does the NTSX2102GU8H require external pull-up resistors on its I/O lines?
Yes, the NTSX2102GU8H requires external pull-up resistors: each A-port line (A1, A2) must be pulled up to VCC(A), and each B-port line (B1, B2) must be pulled up to VCC(B). The magnitude is application-dependent but typically ranges from 2.2 kΩ to 10 kΩ to meet rise-time and bus capacitance requirements per I²C or SMBus specifications.
How does the IOFF feature function in the NTSX2102GU8H during power-down sequences?
The IOFF circuitry in the NTSX2102GU8H disables outputs and blocks backflow current when either VCC(A) or VCC(B) drops to 0 V - even if the other supply remains active. Measured leakage is ≤±2 μA, preventing damage to powered-down subsystems and enabling safe hot-swap and staggered power sequencing in multi-rail designs.
Can the NTSX2102GU8H translate between 1.8 V and 5.0 V logic levels bidirectionally?
Yes, the NTSX2102GU8H is explicitly designed for bidirectional translation between mismatched voltage domains including 1.8 V ↔ 5.0 V. Its dual-supply architecture isolates A- and B-side thresholds, and its inputs tolerate up to 5.5 V regardless of VCC level - allowing direct connection of 5.0 V drivers to 1.8 V receivers without clamping or attenuation.
What is the thermal pad on the NTSX2102GU8H XQFN8 package used for?
The exposed thermal pad on the NTSX2102GU8H (SOT1309-1) is mechanically functional for solder joint reliability and thermal conduction but is not electrically connected to the die. It may be left floating or connected to GND on the PCB for improved heat dissipation - no electrical tie to internal silicon is required or recommended.
NTSX2102GU8H Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Translator Type:
- Voltage Level
- Channel Type:
- Bidirectional
- Number of Circuits:
- 1
- Channels per Circuit:
- 2
- Voltage - VCCA:
- 1.65 V ~ 5.5 V
- Voltage - VCCB:
- 1.65 V ~ 5.5 V
- Input Signal:
- -
- Output Signal:
- -
- Output Type:
- Open Drain, Tri-State
- Data Rate:
- 50Mbps
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Features:
- Auto-Direction Sensing
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-XFQFN
NTSX2102GU8H FAQ
1.How can I place an order for NTSX2102GU8H through Aetrix?
Please submit a Request for Quotation (RFQ) for NTSX2102GU8H on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for NTSX2102GU8H reliable?
The price and inventory of NTSX2102GU8H are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for NTSX2102GU8H is usually 5 days.
3.What payment methods are accepted for NTSX2102GU8H?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for NTSX2102GU8H transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for NTSX2102GU8H?
NTSX2102GU8H orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your NTSX2102GU8H order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for NTSX2102GU8H?
For technical support, including NTSX2102GU8H datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your NTSX2102GU8H requirements.
6.How does Aetrix verify that NTSX2102GU8H is sourced from the original manufacturer or authorized distributors?
All NTSX2102GU8H products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that NTSX2102GU8H meets industry standards.
7.What is the process for return or replacement of NTSX2102GU8H?
All NTSX2102GU8H units undergo pre-shipment inspection (PSI). If there is an issue with NTSX2102GU8H, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The NTSX2102GU8H part is unused and in its original packaging.
Return procedure for NTSX2102GU8H:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
NTSX2102GU8H Tags
-
74LVC1T45GW,125
Nexperia USA Inc.
-
74LVCH2T45DC,125
Nexperia USA Inc.
-
SN74LVC1T45DBVR
Texas Instruments
-
SN74LVC1T45DRLR
Texas Instruments
-
SN74LVC1T45DPKR
Texas Instruments
-
SN74LVC2T45DCTR
Texas Instruments
-
74LVC2T45GT,115
Nexperia USA Inc.
-
SN74LVC1T45YZPR
Texas Instruments
-
LSF0102DCUR
Texas Instruments
-
SN74LVC1T45DCKR
Texas Instruments
-
TXS0102DCTR
Texas Instruments
-
FXLP34P5X
onsemi
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
