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NXP Semiconductors NVT2002GD,125
- Part No.:
- NVT2002GD,125
- Manufacturer:
- NXP Semiconductors
- Category:
- Translators, Level Shifters
- Package:
- Datasheet:
-
NVT2002GD,125.pdf
- Description:
- IC TRANSLTR BIDIRECTIONAL 8XSON
- Quantity:
- Payment:
- Shipping:
Inventory:4,080
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Product details
Overview
NVT2002GD,125 from NXP Semiconductors is a 2-bit bidirectional voltage level translator IC for open-drain and push-pull applications, supporting VREF(A) from 1.0 V to 3.6 V and VREF(B) from 1.8 V to 5.5 V, with ≤1.5 ns max propagation delay, 3.5 Ω typical ON-state resistance, and operation across –40 °C to +105 °C - used in I²C bus interfacing between 1.8 V microcontrollers and 3.3 V peripherals.
For engineers reviewing the NVT2002GD,125 datasheet, NVT2002GD,125 pinout, NVT2002GD,125 application, or NVT2002GD,125 equivalent, key selection criteria include bidirectional translation without direction control, 5 V-tolerant I/Os, flow-through pinout for PCB routing, ESD robustness (4 kV HBM), and compatibility with mixed-voltage SoC-to-peripheral interconnects in industrial and embedded systems.
Technical Context
The NVT2002GD,125 implements a passive MOSFET-based clamping architecture that enables automatic bidirectional level shifting: when either An or Bn is LOW, the internal switch conducts with low RON, establishing a low-impedance path; when HIGH, the port is pulled via external resistors to its respective supply rail (VPU(D) on B-side, VREF(A) on A-side).
Its EN input is referenced to VREF(B), requiring VREF(B) ≥ VREF(A) + 1 V for reliable enable/disable control; the device enters high-impedance state when EN is LOW, and supports transmission speeds <33 MHz under 50 pF load with 197 Ω pull-up - validated for both open-drain (e.g., I²C) and push-pull configurations.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VREF(A) Range | 1.0 V to 3.6 V - sets low-voltage domain reference; must be at least 1 V below VREF(B) for stable operation |
| VREF(B) Range | 1.8 V to 5.5 V - defines high-voltage domain; powers EN input and determines B-side pull-up voltage |
| Max Propagation Delay | ≤1.5 ns - ensures timing integrity in high-speed digital interfaces like I²C up to 1 MHz with margin |
| RON (Typical) | 3.5 Ω - minimizes signal distortion and voltage drop during bidirectional conduction |
| ESD Protection | 4 kV HBM (JESD22-A114), 1000 V CDM (JESD22-C101) - protects downstream 1.0–1.8 V logic from system-level transients |
| Operating Temp | –40 °C to +105 °C - qualified for industrial and automotive under-hood peripheral interfacing |
| I/O Voltage Tolerance | 5 V tolerant on all pins - allows direct connection to 5 V buses without external protection |
Pinout & Package
XSON8U package: plastic extremely thin small outline, no leads, 8-terminal UTLP-based body measuring 3 × 2 × 0.5 mm (SOT996-2); thermally enhanced for compact high-density layouts; no center thermal pad.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GND | Ground reference | Common 0 V return for both domains; must be low-impedance and decoupled near device |
| VREF(A) | Low-voltage side supply | Bias reference for A-side I/Os; sets maximum output voltage on A1/A2 ports |
| A1, A2 | Low-voltage data I/Os | Bidirectional ports connected to 1.0–3.6 V logic; require external pull-up to VREF(A) in open-drain mode |
| EN | Enable control input | Active-HIGH enable referenced to VREF(B); must be pulled HIGH via resistor to VREF(B) for operation |
| VREF(B) | High-voltage side supply | Bias reference for B-side I/Os and EN input; sets B1/B2 output ceiling and enables translation |
| B1, B2 | High-voltage data I/Os | Bidirectional ports connected to 1.8–5.5 V logic; require external pull-up to VPU(D) (typically VREF(B)) |
Key Features
| Feature | Design Value |
|---|---|
| No direction pin required | Enables true bidirectional translation in I²C, SMBus, and GPIO expansion without control logic overhead |
| Flow-through pinout | Minimizes PCB trace crossovers and reduces layout complexity in dense MCU-peripheral interconnects |
| 5 V-tolerant I/Os | Allows direct interface to legacy 5 V peripherals without level-shifting buffers or series resistors |
| Lock-up free operation | Guarantees stable state transitions under voltage sequencing mismatches common in multi-rail power-up |
| High-impedance disable | EN = LOW places all I/Os in Hi-Z, enabling bus sharing and hot-swap isolation in modular systems |
Applications
| I²C Bus Translation | SoC-to-Peripheral Interfacing |
|---|---|
|
Use Scenario: Connecting a 1.8 V ARM Cortex-M microcontroller to a 3.3 V EEPROM or sensor over shared I²C bus. IC Role / Device Role / Timing Role: Bidirectional voltage translator enabling SCL/SDA signal translation without direction control or added timing latency. Use Value: Eliminates need for dual-supply I²C buffers; preserves sub-10 ns propagation delay critical for 400 kHz–1 MHz I²C timing budgets. |
Use Scenario: Interfacing a 1.2 V AI accelerator ASIC to 3.3 V PMIC or 5 V display controller in edge AI gateway. IC Role / Device Role / Timing Role: Voltage domain bridge for GPIO, reset, and interrupt lines between heterogeneous voltage domains. Use Value: Supports mixed-mode operation with 5 V-tolerant B-side I/Os and 1.0–3.6 V A-side flexibility, reducing BOM count. |
| Industrial Sensor Hub | Automotive Body Control Module |
|
Use Scenario: Aggregating multiple 1.8 V digital sensors (temperature, humidity, pressure) into a 3.3 V host MCU in factory automation PLC. IC Role / Device Role / Timing Role: Multi-channel level shifter handling concurrent bidirectional data streams with minimal skew. Use Value: 3.5 Ω RON ensures consistent rise/fall times across channels, avoiding timing mismatch in synchronized sensor reads. |
Use Scenario: Translating LIN or CAN subsystem signals between 1.5 V domain microcontroller and 5 V actuator drivers in BCM. IC Role / Device Role / Timing Role: Isolation and voltage adaptation for non-protocol-specific control lines (enable, fault, status). Use Value: –40 °C to +105 °C rating and 4 kV HBM ESD withstand ensure reliability in harsh automotive environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bidirectional voltage translation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NVT2002TLH | HXSON8 package with center thermal pad (non-electrical); identical electrical specs and pinout except pad placement | Thermal performance improved in high-power density layouts; requires evaluation if GD footprint has traces under center area | Select TLH for new designs needing better thermal dissipation; GD remains valid where space or cost constraints favor XSON8U |
| PCA9306DCUR | 2-bit translator with separate DIR pin; higher RON (~10 Ω), slower propagation (~2.5 ns), and narrower VREF range (1.2–3.3 V / 1.8–5.5 V) | Requires direction control logic; less suitable for pure open-drain I²C but offers configurable unidirectional modes | Choose PCA9306 only if directional control is already present or if lower cost outweighs performance trade-offs |
Compared with NVT2002GD,125, the NVT2002TLH offers identical functionality with enhanced thermal capability in a mechanically compatible footprint, while the PCA9306DCUR provides direction-controlled translation at lower performance and reduced voltage flexibility - making NVT2002GD,125 optimal for cost-sensitive, high-speed, directionless I²C and GPIO bridging.
Availability
NVT2002GD,125 is available at Aetrix Electronics and suitable for industrial sensor hubs, automotive body control modules, and embedded I²C bus expansion requiring stable component supply, long-term lifecycle support, and guaranteed RoHS-compliant sourcing.
Supply support for NVT2002GD,125 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in interface and power management ICs.
The NVT200x family was designed specifically for seamless bidirectional voltage translation in mixed-voltage digital systems - targeting I²C, SMBus, and general-purpose GPIO bridging where direction pins are undesirable and timing margins are tight.
FAQ
What is the recommended VREF(B) to VREF(A) voltage differential for reliable operation of the NVT2002GD,125?
The NVT2002GD,125 requires VREF(B) to be at least 1 V higher than VREF(A) for stable translator behavior and proper EN activation. For example, pairing VREF(A) = 1.8 V with VREF(B) = 3.3 V meets this requirement and is commonly used in I²C applications. Operating outside this margin may cause incomplete switching or increased propagation delay in the NVT2002GD,125.
Can the NVT2002GD,125 be used with push-pull drivers, and what design considerations apply?
Yes, the NVT2002GD,125 supports push-pull drivers on both A and B sides, but outputs must be 3-stateable or direction-controlled to prevent contention. Unlike open-drain use, push-pull operation requires external logic to ensure only one side drives HIGH at a time. The NVT2002GD,125 itself does not provide direction arbitration - it relies on system-level control to avoid bus conflicts.
Does the NVT2002GD,125 require external pull-up resistors, and how are their values selected?
Yes, the NVT2002GD,125 requires external pull-up resistors on both A and B sides for open-drain operation. Values depend on driver sink current, bus capacitance, and target speed - e.g., 750 Ω for 1.0 V ↔ 1.8 V at 3 mA drive. Table 6 in the NXP datasheet provides minimum RPU guidance. The NVT2002GD,125's low RON allows stronger pull-ups without excessive voltage drop.
Is the NVT2002GD,125 pin-compatible with other packages in the NVT2002 family, such as the TSSOP8 or HXSON8 variants?
The NVT2002GD,125 (XSON8U) shares identical pin functions and ordering with NVT2002DP (TSSOP8) and NVT2002TLH (HXSON8), but physical pin spacing and package dimensions differ. While signal mapping is consistent, PCB footprints are not interchangeable - the NVT2002GD,125 uses a 0.5 mm pitch 3×2 mm body without thermal pad, unlike the TLH's center pad or DP's gull-wing leads.
What is the maximum capacitive load the NVT2002GD,125 can drive while maintaining <33 MHz operation?
The NVT2002GD,125 supports <33 MHz operation with a total node capacitance of ≤50 pF and 197 Ω pull-up resistors, per datasheet characterization. This includes PCB trace capacitance, device I/O capacitance (~9.3 pF on-state), and probe/jig contributions. Exceeding 50 pF increases RC-limited rise/fall times, reducing usable frequency - so layout optimization is essential for high-speed use of the NVT2002GD,125.
NVT2002GD,125 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Translator Type:
- Voltage Level
- Channel Type:
- Bidirectional
- Number of Circuits:
- 1
- Channels per Circuit:
- 2
- Voltage - VCCA:
- 1 V ~ 3.6 V
- Voltage - VCCB:
- 1.8 V ~ 5.5 V
- Input Signal:
- -
- Output Signal:
- -
- Output Type:
- Open Drain, Push-Pull
- Data Rate:
- -
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Features:
- Auto-Direction Sensing
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-XFDFN
NVT2002GD,125 FAQ
1.How can I place an order for NVT2002GD,125 through Aetrix?
Please submit a Request for Quotation (RFQ) for NVT2002GD,125 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for NVT2002GD,125 reliable?
The price and inventory of NVT2002GD,125 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for NVT2002GD,125 is usually 5 days.
3.What payment methods are accepted for NVT2002GD,125?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for NVT2002GD,125 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for NVT2002GD,125?
NVT2002GD,125 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your NVT2002GD,125 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for NVT2002GD,125?
For technical support, including NVT2002GD,125 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your NVT2002GD,125 requirements.
6.How does Aetrix verify that NVT2002GD,125 is sourced from the original manufacturer or authorized distributors?
All NVT2002GD,125 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that NVT2002GD,125 meets industry standards.
7.What is the process for return or replacement of NVT2002GD,125?
All NVT2002GD,125 units undergo pre-shipment inspection (PSI). If there is an issue with NVT2002GD,125, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The NVT2002GD,125 part is unused and in its original packaging.
Return procedure for NVT2002GD,125:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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