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NXP Semiconductors NVT2002TLH

Part No.:
NVT2002TLH
Manufacturer:
NXP Semiconductors
Category:
Translators, Level Shifters
Package:
Datasheet:
AetrixNVT2002TLH.pdf
Description:
IC TRANSLATOR BIDIR HXSON8U
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:7,511

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Product details

Overview

NVT2002TLH from NXP Semiconductors is a 2-bit bidirectional voltage level translator IC for open-drain and push-pull applications, supporting VREF(A) from 1.0 V to 3.6 V and VREF(B) from 1.8 V to 5.5 V, with ≤1.5 ns max propagation delay, 3.5 Ω typical ON-state resistance, and operation across –40 °C to +105 °C. It enables seamless I²C bus interfacing between 1.8 V microcontrollers and 3.3 V peripherals without direction control.

For engineers reviewing the NVT2002TLH datasheet, NVT2002TLH pinout, NVT2002TLH application, or NVT2002TLH equivalent, this page delivers verified electrical parameters, package-specific pin mapping, real-world use cases in mixed-voltage digital systems, and two validated alternative parts with documented functional and layout implications.

Technical Context

The NVT2002TLH implements a passive MOSFET-based clamping architecture with no internal direction pin-translation direction is determined dynamically by relative voltage levels on A- and B-side ports. Each channel features symmetrical Ron (≤5.0 Ω) and matched propagation delay (<1.5 ns), ensuring minimal skew between A1↔B1 and A2↔B2 paths.

EN is referenced to VREF(B), requiring VREF(B) ≥ VREF(A) + 1 V for reliable enable/disable control. When EN = HIGH, low-impedance conduction occurs; when EN = LOW, both An and Bn pins enter high-impedance state. The device supports up to 33 MHz operation under 50 pF load with 197 Ω pull-up.

Key Specifications

Parameter Value and Actual Design Meaning
VREF(A) Range 1.0 V to 3.6 V - sets low-voltage domain reference; must be ≥1 V below VREF(B) for stable EN operation
VREF(B) Range 1.8 V to 5.5 V - powers EN input and defines high-voltage side; supports 3.3 V and 5 V logic families
Max Propagation Delay ≤1.5 ns - enables timing-critical I²C, SMBus, and GPIO translation up to ~33 MHz with 50 pF load
Typical RON 3.5 Ω - minimizes signal distortion and voltage drop during bidirectional pass-through mode
ESD Protection 4 kV HBM / 1000 V CDM - protects downstream 1.0–1.8 V devices from system-level ESD events
Operating Temperature –40 °C to +105 °C - qualified for automotive and industrial embedded environments
I/O Voltage Tolerance 5 V tolerant - allows direct connection to 5 V buses while powered from lower VREF(A)

Pinout & Package

HXSON8 (SOT1052-2) package: thermal-enhanced 8-terminal no-lead package, 3 mm × 2 mm × 0.5 mm body, 0.5 mm pitch, center thermal pad (non-electrical, optional PCB connection).

Pin Circuit Role Design Meaning
B1 High-voltage I/O port 1 Connects to 1.8–5.5 V bus (e.g., 3.3 V I²C SDA); pulled to VREF(B) via external resistor
A2 Low-voltage I/O port 2 Connects to 1.0–3.6 V domain (e.g., 1.8 V MCU GPIO); referenced to VREF(A)
GND Ground reference Common return path for both voltage domains; required for clamp transistor biasing
EN Enable control input Referenced to VREF(B); must be ≥VREF(A) + 0.6 V to activate translation; pulled to VREF(B) via 200 kΩ
A1 Low-voltage I/O port 1 Paired with B1; identical electrical behavior to A2; supports bidirectional data flow
VREF(B) High-voltage reference supply Powers EN circuitry and defines B-side logic thresholds; decoupling capacitor recommended
B2 High-voltage I/O port 2 Paired with A2; matches B1 functionality; supports independent second channel translation
VREF(A) Low-voltage reference supply Sets A-side output clamping voltage; tied to core supply (e.g., 1.2 V, 1.8 V) of host processor

Key Features

Feature Design Value
No direction pin required Eliminates GPIO overhead and firmware complexity in bidirectional protocols like I²C
Flow-through pinout Enables straight PCB trace routing between A- and B-side connectors, reducing crosstalk and layout area
Lock-up free operation Guarantees stable state transitions without metastability or latch-up under voltage sequencing stress
5 V tolerant I/O Allows direct interface to legacy 5 V peripherals while operating from sub-2 V core supplies
Center thermal pad (HXSON8) Improves thermal dissipation in high-density layouts; electrically isolated, so compatible with GD footprint

Applications

I²C Bus Translation GPIO Voltage Bridging

Use Scenario: Interfacing a 1.8 V ARM Cortex-M microcontroller with a 3.3 V EEPROM or sensor over I²C.

IC Role / Device Role / Timing Role: Bidirectional level shifter on SDA/SCL lines, replacing discrete MOSFET solutions with matched delay and zero direction control.

Use Value: Enables plug-and-play interoperability without modifying firmware or adding external direction logic; supports standard-mode (100 kHz) and fast-mode (400 kHz) I²C.

Use Scenario: Connecting 1.2 V FPGA I/O banks to 3.3 V industrial control signals (e.g., enable, fault, status).

IC Role / Device Role / Timing Role: Dual-channel translator providing isolated voltage domain bridging for control and status lines.

Use Value: Eliminates risk of overvoltage damage to low-voltage logic; maintains signal integrity with <1.5 ns skew between channels.

Multi-Voltage System Integration Legacy Interface Modernization

Use Scenario: Integrating multiple voltage rails (1.0 V CPU core, 1.8 V memory, 3.3 V PMIC) on a single SoC carrier board.

IC Role / Device Role / Timing Role: Scalable voltage translation hub enabling simultaneous communication between heterogeneous subsystems.

Use Value: Reduces BOM count vs. discrete solutions; supports dynamic voltage scaling with stable Ron across temperature.

Use Scenario: Upgrading an older 5 V microcontroller design to use modern 1.8 V sensors while retaining existing 5 V bus infrastructure.

IC Role / Device Role / Timing Role: Backward-compatible level translator allowing phased migration without full board redesign.

Use Value: Preserves investment in legacy connectors and wiring; TL package drops onto GD footprint with no PCB rework.

Equivalent & Alternatives

The following parts are listed as comparable options for similar bidirectional voltage translation applications.

Alternative Part Technical Difference Application Difference Selection Advice
NVT2002GD No center thermal pad; same 3 × 2 mm footprint but different land pattern (no exposed pad); slightly higher thermal resistance Requires PCB redesign if replacing TL; not drop-in due to missing thermal pad solder mask definition Prefer NVT2002TLH for new designs needing better thermal performance or GD-to-TL replacement where center pad is unused
PCA9306DCUR 2-bit translator with enable; wider VREF(A)/VREF(B) range (1.2–3.6 V / 1.8–5.5 V); higher typical RON (7 Ω) Compatible with I²C but slower max frequency (~20 MHz at 50 pF); requires separate VREF decoupling per rail Choose PCA9306DCUR only if NXP supply continuity is constrained; verify timing margins due to higher Ron and propagation delay

Compared with NVT2002GD and PCA9306DCUR, the NVT2002TLH offers superior thermal performance via its isolated center pad, lowest Ron (3.5 Ω), and tightest propagation delay (≤1.5 ns), making it optimal for high-speed, space-constrained, or thermally demanding mixed-voltage interfaces.

Availability

NVT2002TLH is available at Aetrix Electronics and suitable for I²C bus translation, GPIO bridging, multi-rail system integration, and legacy interface modernization requiring stable component supply across automotive, industrial, and embedded computing programs.

Supply support for NVT2002TLH includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in interface and power management ICs.

The NVT200x family was designed specifically for robust, pin-efficient bidirectional level translation in resource-constrained embedded systems where direction control logic is undesirable or unavailable.

FAQ

What is the maximum operating frequency supported by the NVT2002TLH?

The NVT2002TLH supports up to 33 MHz in open-drain systems with 50 pF load and 197 Ω pull-up resistors, as confirmed in the datasheet's dynamic characteristics section. Real-world frequency depends on total node capacitance, driver strength, and pull-up resistor selection-designers should validate timing margins using the RC-based rise/fall time equations provided in Section 7.4 of the NVT2002TLH datasheet.

Can the NVT2002TLH replace the discontinued NVT2002GD without PCB changes?

Yes-the NVT2002TLH is explicitly designated as the drop-in replacement for NVT2002GD per Discontinuation Notice 202111012DN. Its HXSON8 package shares identical 3 mm × 2 mm outline and pin positions; the center thermal pad is non-electrical and may be left floating or connected to GND without affecting functionality, making it compatible with existing GD footprints.

What are the voltage requirements for the EN pin on the NVT2002TLH?

The EN pin on the NVT2002TLH must be driven by VREF(B) (1.8–5.5 V) and pulled up via a 200 kΩ resistor to VPU(D). For reliable operation, VREF(B) must be at least 1 V higher than VREF(A), and VI(EN) must remain within 0–5.5 V. EN = LOW places all I/Os in high-impedance state during power-up or shutdown.

Does the NVT2002TLH support push-pull drivers, or is it limited to open-drain applications?

The NVT2002TLH supports both open-drain and push-pull drivers, as stated in the General Description. For push-pull use, outputs must be 3-stateable or unidirectional to prevent contention; for open-drain, no direction control is needed. The device's clamping architecture inherently handles bidirectional signal flow regardless of driver type, provided proper pull-up configuration and voltage margining.

How does the center thermal pad on the NVT2002TLH affect thermal performance and PCB layout?

The center thermal pad on the NVT2002TLH is electrically isolated from the die and serves only mechanical and thermal functions. It improves heat dissipation in high-density layouts but may be left floating or connected to GND-no electrical connection is required. Unlike the NVT2002GD, the TL package's pad allows enhanced thermal reliability without altering signal routing or requiring redesign of the GD footprint.

NVT2002TLH Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
-
Package/Case:
Packaging:
Tape & Reel (TR)
Product Status:
Active
Translator Type:
Voltage Level
Channel Type:
Bidirectional
Number of Circuits:
1
Channels per Circuit:
2
Voltage - VCCA:
1 V ~ 3.6 V
Voltage - VCCB:
1.8 V ~ 5.5 V
Input Signal:
-
Output Signal:
-
Output Type:
Open Drain, Push-Pull
Data Rate:
33MHz
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Features:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-XFDFN Exposed Pad

NVT2002TLH FAQ

1.How can I place an order for NVT2002TLH through Aetrix?

Please submit a Request for Quotation (RFQ) for NVT2002TLH on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for NVT2002TLH reliable?

The price and inventory of NVT2002TLH are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for NVT2002TLH is usually 5 days.

3.What payment methods are accepted for NVT2002TLH?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for NVT2002TLH transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for NVT2002TLH?

NVT2002TLH orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your NVT2002TLH order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for NVT2002TLH?

For technical support, including NVT2002TLH datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your NVT2002TLH requirements.

6.How does Aetrix verify that NVT2002TLH is sourced from the original manufacturer or authorized distributors?

All NVT2002TLH products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that NVT2002TLH meets industry standards.

7.What is the process for return or replacement of NVT2002TLH?

All NVT2002TLH units undergo pre-shipment inspection (PSI). If there is an issue with NVT2002TLH, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The NVT2002TLH part is unused and in its original packaging.

Return procedure for NVT2002TLH:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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