NXP Semiconductors NX1117C33Z,115

Overview

NX1117C33Z,115 from NXP Semiconductors is a fixed-output 3.3 V, ±1 % accuracy, low-dropout linear voltage regulator in SOT223 package, delivering up to 1 A output current with thermal shutdown, SOA control, and output current limiting - used as post-regulator for DC-DC converters in USB devices and hard drive controllers.

For engineers reviewing the NX1117C33Z,115 datasheet, NX1117C33Z,115 pinout, NX1117C33Z,115 application, or NX1117C33Z,115 equivalent, key selection criteria include dropout voltage at 800 mA (≤1.2 V), input voltage range (up to 20 V), quiescent current (5–6 mA), thermal resistance (72 K/W on FR4), and no minimum load requirement for stable regulation.

Technical Context

The NX1117C33Z,115 implements internal SOA control to dynamically limit output current under high VIN–VOUT conditions, preventing thermal runaway. Its reference voltage (1.25 V) feeds an error amplifier that regulates output via PNP pass transistor architecture.

It operates across –40 °C to +125 °C ambient temperature, with line regulation ≤4.5 mV over 4.75–10 V input and load regulation ≤7 mV from 0–800 mA - enabling reliable point-of-load regulation in industrial and consumer equipment without external compensation.

Key Specifications

Pinout & Package

SOT223 (SC-73) plastic surface-mount package with integrated heat sink; 4 leads, standard footprint per Figure 21 (6.7 × 3.7 mm body, 1.1 mm height).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar LDO regulator applications.

Compared with TLV1117-33IDCYR and LD1117S33TR, the NX1117C33Z,115 delivers tighter ±1 % regulation and lower IQ - critical for USB-compliant I/O rails and long-life battery systems - while maintaining identical SOT223 mechanical compatibility and thermal derating behavior.

Availability

NX1117C33Z,115 is available at Aetrix Electronics and suitable for USB device power supplies, hard drive controllers, and consumer equipment point-of-load applications requiring stable component supply, consistent parametric performance, and long-term lifecycle support.

Supply support for NX1117C33Z,115 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and consumer markets.

The NX1117C/NX1117CE series was designed specifically for high-reliability post-regulation in space-constrained, thermally demanding applications - emphasizing robustness, accuracy, and ease of use without external components.

FAQ

What is the maximum input voltage rating for the NX1117C33Z,115?

The NX1117C33Z,115 has an absolute maximum input voltage of 20 V, as specified in Table 5 (Limiting Values). Operation above this level risks permanent damage. For reliable long-term use, the recommended operating input range is 4.75 V to 10 V - sufficient to maintain regulation while preserving SOA margin and thermal headroom in the NX1117C33Z,115.

Does the NX1117C33Z,115 require an output capacitor, and what value is recommended?

Yes, the NX1117C33Z,115 requires a minimum 10 µF ceramic output capacitor placed close to pins 2 and 4, as shown in Figure 19. This stabilizes the control loop and improves transient response. The NX1117C33Z,115 is optimized for low-ESR ceramics; tantalum or aluminum electrolytics are not recommended due to ESR-related instability risks.

Is there a minimum load current required for regulation stability in the NX1117C33Z,115?

No, the NX1117C33Z,115 does not require any minimum load current for stable regulation. As confirmed in Section 2 ("Features and benefits"), fixed-output versions like the NX1117C33Z,115 operate stably from 0 mA to 1 A - eliminating the need for bleed resistors in low-power or sleep-mode applications where the NX1117C33Z,115 supplies intermittent loads.

How does the SOA control function in the NX1117C33Z,115 affect its safe operating area?

The SOA control in the NX1117C33Z,115 actively limits output current when the VIN–VOUT differential exceeds safe power dissipation thresholds - preventing thermal runaway without external foldback circuitry. This means the NX1117C33Z,115 self-derates current under high-differential conditions (e.g., 12 V input → 3.3 V output), ensuring reliability even in unventilated enclosures.

What is the thermal resistance (R_th(j-a)) of the NX1117C33Z,115 on a standard FR4 PCB?

When mounted on a standard FR4 PCB with single-sided copper and tin-plated finish (per Table 7), the NX1117C33Z,115 exhibits a typical thermal resistance of 72 K/W from junction to ambient. This value assumes the standard SOT223 footprint with no extended copper pour - actual R_th(j-a) improves significantly with larger thermal pads, as documented in the NX1117C33Z,115 datasheet.