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NXP Semiconductors NX3DV3899GU,115
- Part No.:
- NX3DV3899GU,115
- Manufacturer:
- NXP Semiconductors
- Package:
- 16-XFQFN
- Datasheet:
-
NX3DV3899GU,115.pdf
- Description:
- IC SWITCH DPDT X 2 3.3OHM 16XQFN
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
NX3DV3899GU,115 from NXP Semiconductors is a dual double-pole double-throw (DPDT) analog switch IC designed for bidirectional signal routing in low-voltage portable systems. It features four independent SPDT switches (1Z/1Y0/1Y1 through 4Z/4Y0/4Y1), operates from 1.4 V to 4.3 V supply, delivers 2.2 Ω typical ON resistance at 4.3 V, and supports 1.8 V logic control with 350 mA continuous switch current - enabling direct interfacing with 1.8 V microcontrollers in battery-powered audio/data paths.
For engineers reviewing the NX3DV3899GU,115 datasheet, NX3DV3899GU,115 pinout, NX3DV3899GU,115 application, or NX3DV3899GU,115 equivalent, key selection criteria include its break-before-make timing (11 ns max), ±4 pC charge injection, -90 dB crosstalk, -70 dB OFF-state isolation, and compatibility with high-fidelity analog switching in space-constrained mobile designs requiring minimal power and signal distortion.
Technical Context
The NX3DV3899GU,115 implements CMOS transmission-gate architecture with Schmitt-trigger select inputs (1S, 2S), ensuring robust noise immunity across its full 1.4–4.3 V VCC range. Each of its four DPDT channels supports bidirectional analog/digital signal flow between common terminal (nZ) and two independent terminals (nY0/nY1), with no polarity restriction on signal amplitude up to VCC.
Break-before-make switching is guaranteed by design (tb-m ≤ 11 ns at VCC = 4.3 V), preventing momentary short-circuits during state transitions. Input voltage tolerance extends beyond VCC (up to VCC + 0.5 V), and the device maintains sub-1 μA ICC at 3.6 V while delivering < 0.01% THD at 2 Vp-p and 2.3 V–3.6 V supplies - critical for audio and sensor signal integrity.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage Range | 1.4 V to 4.3 V - enables single-supply operation in Li-ion, coin-cell, and multi-rail portable systems without level shifters. |
| ON Resistance (Typ) | 2.2 Ω at VCC = 4.3 V - ensures minimal insertion loss and voltage drop for precision analog signals up to 4.3 V peak. |
| Switch Current (Cont.) | 350 mA - supports driving moderate loads such as audio codecs, ADC/DAC interfaces, or sensor multiplexing without external buffering. |
| Enable/Disable Time | 19 ns / 8 ns (typ, VCC = 4.3 V) - allows fast channel reconfiguration in real-time signal routing applications like USB-C alternate mode switching. |
| Charge Injection | 4.0 pC (max, VCC = 4.3 V) - limits output glitch amplitude in sample-and-hold or precision mux circuits, reducing post-switch settling time. |
| OFF-State Isolation | -70 dB (1 MHz) - suppresses coupling between inactive channels, preserving signal integrity in multi-source audio or data acquisition systems. |
| Operating Temperature | -40 °C to +125 °C - qualified for automotive infotainment, industrial handhelds, and extended-life consumer devices. |
Pinout & Package
XQFN16 package: plastic extremely thin quad flat no-lead, 1.80 mm × 2.60 mm × 0.50 mm body, 16-terminal layout with exposed thermal pad (non-soldered, floating or GND-connected).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 5, 9, 13 | 1Y0 / 2Y0 / 3Y0 / 4Y0 | Independent input/output terminals for first pole of each DPDT switch - bidirectional, compatible with analog or digital signals up to VCC. |
| 2, 10 | 1S / 2S | Select inputs with Schmitt-trigger threshold - tolerate slow edges and accept 1.8 V logic even at 3.6 V VCC, eliminating level translation. |
| 15, 3, 7, 11 | 1Y1 / 2Y1 / 3Y1 / 4Y1 | Independent input/output terminals for second pole of each DPDT switch - functionally identical to Y0 pins, forming full DPDT pairs. |
| 16, 4, 8, 12 | 1Z / 2Z / 3Z / 4Z | Common input/output terminals - serve as central signal path shared between Y0 and Y1; support bidirectional signal flow with no direction bias. |
| 6 | GND | Ground reference for all internal circuitry and switch substrates - must be connected to system ground plane for ESD and noise performance. |
| 14 | VCC | Primary supply rail - powers internal logic and switch transistors; decoupling capacitor (100 nF) recommended within 2 mm of pin. |
Key Features
| Feature | Design Value |
|---|---|
| 1.8 V logic-compatible control | Enables direct connection to 1.8 V GPIOs at VCC = 3.6 V, removing external level shifters and saving PCB area in ultra-thin mobile designs. |
| Break-before-make switching | Guaranteed 2 ns minimum dead time prevents signal shorting during channel transitions - essential for safe analog multiplexing in medical sensors or audio line switching. |
| Ultra-low charge injection (≤4 pC) | Minimizes voltage glitches at switched nodes, reducing need for post-mux filtering and improving accuracy in precision data acquisition front-ends. |
| High OFF-state isolation (-70 dB) | Prevents crosstalk between active and inactive signal paths, maintaining SNR in multi-channel audio codecs or RF front-end switching. |
| ESD robustness (HBM 5 kV on I/O) | Withstands 5000 V HBM on all I/O pins per JESD22-A114F Class 3A - simplifies system-level ESD protection design in handheld consumer products. |
Applications
| Audio Signal Routing | USB-C Alternate Mode Switching |
|---|---|
Use Scenario: Selecting between multiple audio sources (headset mic, Bluetooth codec, analog line-in) in a smartphone or wireless earbud charging case. IC Role / Device Role / Timing Role: Dual DPDT analog switch providing bidirectional, low-distortion signal path selection with <0.01% THD and -90 dB crosstalk. Use Value: Eliminates need for discrete FET arrays or larger mux ICs, reducing BOM count and board space while preserving audio fidelity across 20 Hz–20 kHz bandwidth. | Use Scenario: Dynamically rerouting DisplayPort or PCIe lanes between host and peripheral in USB-C reversible connector implementations. IC Role / Device Role / Timing Role: High-speed analog switch enabling sub-20 ns enable/disable times and 200 MHz -3 dB bandwidth for clean high-speed data lane switching. Use Value: Supports seamless alternate mode negotiation without signal interruption, leveraging break-before-make timing to prevent bus contention during reconfiguration. |
| Portable Medical Sensor Multiplexing | Industrial Handheld Data Acquisition |
Use Scenario: Scanning multiple biopotential electrodes (ECG, EMG) into a single ADC input in a wearable health monitor. IC Role / Device Role / Timing Role: Low-leakage (±500 nA max OFF-state), low-charge-injection analog switch ensuring accurate DC-coupled signal capture with minimal offset drift. Use Value: Maintains measurement accuracy over temperature (-40 °C to +125 °C) and battery voltage variation (1.4–4.3 V), extending usable runtime per charge. | Use Scenario: Sharing a single high-resolution ADC among thermocouples, RTDs, and voltage inputs in a ruggedized field instrument. IC Role / Device Role / Timing Role: Precision analog multiplexer with 2.2 Ω ON resistance and <0.4 V maximum switch voltage drop - minimizing gain error and self-heating effects. Use Value: Delivers consistent channel-to-channel matching (ΔRON ≤ 0.7 Ω) and stable performance across wide ambient ranges, reducing calibration frequency in deployed units. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar analog switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TMUX1574RTER | Single-supply 1.08–3.6 V operation; 0.7 Ω typical RON at 3.3 V; 16-pin WQFN (2.5 × 2.5 mm); no Schmitt-trigger inputs. | Optimized for ultra-low RON in narrow 1.08–3.6 V range; lacks VCC > 3.6 V support and Schmitt-trigger noise immunity. | Preferred when lowest possible ON resistance is required below 3.6 V and system noise environment is controlled. |
| ADG732BRUZ-REEL7 | 32-channel single-pole single-throw; 1.8–5.5 V supply; 4 Ω typical RON at 5 V; 32-pin TSSOP; no break-before-make guarantee. | Higher channel count but larger footprint and higher RON; lacks integrated break-before-make and Schmitt-trigger inputs. | Selected when scaling to >4 channels is needed and PCB area constraints allow TSSOP packaging. |
Compared with TMUX1574RTER and ADG732BRUZ-REEL7, the NX3DV3899GU,115 uniquely combines 4.3 V operation, Schmitt-trigger select inputs, guaranteed break-before-make, and XQFN16's 1.8 × 2.6 mm footprint - making it optimal for compact, battery-powered systems requiring robust signal routing across wide supply and temperature ranges.
Availability
NX3DV3899GU,115 is available at Aetrix Electronics and suitable for portable media players, industrial handhelds, and automotive infotainment systems requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.
Supply support for NX3DV3899GU,115 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with core expertise in mixed-signal analog, RF, and embedded processing.
The NX3DV3899GU,115 belongs to NXP's NX3D ultra-low-voltage analog switch family, engineered specifically for space-constrained, battery-operated consumer and industrial devices demanding high signal fidelity, minimal power, and robust ESD performance.
FAQ
What is the maximum signal voltage the NX3DV3899GU,115 can switch without damage?
The NX3DV3899GU,115 supports bidirectional analog signal switching up to VCC (maximum 4.3 V) between nZ and nY0/nY1 terminals. Absolute maximum switch voltage is VCC + 0.5 V (4.6 V), but sustained operation above VCC risks increased leakage and reduced reliability. For 4.3 V signals, use VCC = 4.3 V and ensure input transition rates stay within 200 ns/V to maintain proper Schmitt-trigger behavior. The NX3DV3899GU,115 datasheet specifies this limit in Table 5 (Limiting Values).
Can the NX3DV3899GU,115 be used with a 1.8 V microcontroller while powered at 3.6 V?
Yes, the NX3DV3899GU,115 explicitly supports 1.8 V logic-level control inputs (1S, 2S) when VCC = 3.6 V, as confirmed in Section 2 ("Features and benefits") and Table 7 (VIH/VIL). Its Schmitt-trigger inputs provide noise immunity, and the low input threshold eliminates need for external level translation. This capability is a key differentiator of the NX3DV3899GU,115 in mixed-voltage portable designs.
Does the NX3DV3899GU,115 require external pull-up or pull-down resistors on its select inputs?
No, the NX3DV3899GU,115 does not require external biasing on 1S or 2S pins because its Schmitt-trigger inputs have defined VIH and VIL thresholds across the full 1.4–4.3 V VCC range (Table 7). Driving these pins directly from CMOS outputs - whether 1.8 V, 2.5 V, or 3.3 V - ensures reliable switching without added components. This simplifies layout and reduces BOM cost for the NX3DV3899GU,115.
What thermal considerations apply to the NX3DV3899GU,115 in its XQFN16 package?
The NX3DV3899GU,115 in XQFN16 (SOT1161-1) has a total power dissipation limit of 250 mW, derating linearly above 133 °C at 14.5 mW/K. To maintain reliability, ensure the thermal pad is either left floating or connected to GND via adequate copper area (≥25 mm² recommended). Junction-to-ambient thermal resistance (RθJA) is not specified, so board-level thermal simulation or IR imaging is advised for high-current (350 mA) continuous operation in sealed enclosures.
How does the NX3DV3899GU,115 achieve break-before-make timing, and is it guaranteed across temperature?
The NX3DV3899GU,115 guarantees break-before-make timing by internal design - not process variation - with a maximum tb-m of 11 ns at VCC = 4.3 V and 125 °C (Table 9). This specification holds across the full -40 °C to +125 °C operating range, eliminating risk of signal shorting during channel switching. Unlike many analog switches relying on external timing control, the NX3DV3899GU,115 embeds this safety feature in silicon, simplifying system timing validation.
NX3DV3899GU,115 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Switch Circuit:
- DPDT
- Multiplexer/Demultiplexer Circuit:
- 2:2
- Number of Circuits:
- 2
- On-State Resistance (Max):
- 3.3Ohm
- Channel-to-Channel Matching (ΔRon):
- 700mOhm
- Voltage - Supply, Single (V+):
- 1.4V ~ 4.3V
- Voltage - Supply, Dual (V±):
- -
- Switch Time (Ton, Toff) (Max):
- 40ns, 20ns
- -3db Bandwidth:
- 200MHz
- Charge Injection:
- 4pC
- Channel Capacitance (CS(off), CD(off)):
- 8pF
- Current - Leakage (IS(off)) (Max):
- 5nA
- Crosstalk:
- -90dB @ 1MHz
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-XQFN (1.8x2.6)
NX3DV3899GU,115 FAQ
1.How can I place an order for NX3DV3899GU,115 through Aetrix?
Please submit a Request for Quotation (RFQ) for NX3DV3899GU,115 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for NX3DV3899GU,115 reliable?
The price and inventory of NX3DV3899GU,115 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for NX3DV3899GU,115 is usually 5 days.
3.What payment methods are accepted for NX3DV3899GU,115?
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4.How is shipping managed for NX3DV3899GU,115?
NX3DV3899GU,115 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your NX3DV3899GU,115 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for NX3DV3899GU,115?
For technical support, including NX3DV3899GU,115 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your NX3DV3899GU,115 requirements.
6.How does Aetrix verify that NX3DV3899GU,115 is sourced from the original manufacturer or authorized distributors?
All NX3DV3899GU,115 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that NX3DV3899GU,115 meets industry standards.
7.What is the process for return or replacement of NX3DV3899GU,115?
All NX3DV3899GU,115 units undergo pre-shipment inspection (PSI). If there is an issue with NX3DV3899GU,115, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The NX3DV3899GU,115 part is unused and in its original packaging.
Return procedure for NX3DV3899GU,115:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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