NXP Semiconductors NX3DV3899HR,115

Overview

NX3DV3899HR,115 from NXP Semiconductors is a dual double-pole double-throw (DPDT) analog switch IC designed for bidirectional signal routing in portable and low-voltage systems. It features four independent SPDT switches (1Z/1Y0/1Y1 through 4Z/4Y0/4Y1), operates from 1.4 V to 4.3 V supply, delivers ≤2.2 Ω typical ON resistance at 4.3 V, supports 1.8 V logic control with 350 mA continuous switch current, and is qualified for automotive-grade temperature range (−40 °C to +125 °C).

For engineers reviewing the NX3DV3899HR,115 datasheet, NX3DV3899HR,115 pinout, NX3DV3899HR,115 application, or NX3DV3899HR,115 equivalent, this page provides verified functional context, package-specific pin mapping, real-world use cases in mobile audio/data paths, and validated alternative options for signal-switching designs requiring low R_ON, wide V_CC tolerance, and break-before-make timing.

Technical Context

The NX3DV3899HR,115 implements four independent CMOS transmission gates with Schmitt-trigger select inputs (1S, 2S), enabling robust switching even with slow-rising digital control signals across its full 1.4–4.3 V supply range. Each switch supports bidirectional analog/digital signal flow between common terminal (nZ) and two independent terminals (nY0/nY1), with break-before-make timing guaranteed by design (≤11 ns at 4.3 V).

Its architecture enables 1.8 V controller compatibility at 3.6 V V_CC without level shifters, thanks to input voltage thresholds that scale with supply and clamping that tolerates inputs up to V_CC + 0.5 V. Charge injection is tightly controlled (≤4.0 pC at 4.3 V), and isolation exceeds −70 dB at 1 MHz, supporting high-fidelity audio and precision data routing.

Key Specifications

Pinout & Package

Package: HXQFN16(U), 3 mm × 3 mm × 0.5 mm, thermal-enhanced quad flat no-lead with exposed thermal pad (non-soldered substrate connection).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar analog switch applications.

Compared with TS5A3157DRYR and ADG732BRUZ, the NX3DV3899HR,115 uniquely delivers dual DPDT topology with automotive-grade temperature support, 1.8 V logic compatibility at 4.3 V V_CC, and guaranteed break-before-make timing-making it optimal for portable audio routing and USB OTG switching where channel pairing and reliability are critical.

Availability

NX3DV3899HR,115 is available at Aetrix Electronics and suitable for mobile audio routing, USB data path switching, and automotive infotainment systems requiring stable component supply, long-term lifecycle assurance, and AEC-Q100-compliant performance.

Supply support for NX3DV3899HR,115 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and consumer applications.

The NX3DV3899HR,115 belongs to NXP's NX3D analog switch family, engineered for low-voltage, high-fidelity signal routing in battery-powered and thermally constrained devices where power efficiency, small footprint, and robust ESD immunity are essential.

FAQ

What is the maximum continuous current rating for each switch in the NX3DV3899HR,115?

The NX3DV3899HR,115 supports 350 mA continuous current per switch channel under 3.3 V supply conditions, as specified in the Limiting Values table. This rating applies across the full operating temperature range (−40 °C to +125 °C) and enables reliable use in speaker switching, battery path selection, and other moderate-power analog routing tasks without derating.

Does the NX3DV3899HR,115 require external level translation when driven by a 1.8 V microcontroller?

No, the NX3DV3899HR,115 does not require external level translation. Its Schmitt-trigger select inputs accept 1.8 V logic levels directly-even when V_CC is as high as 4.3 V-due to a low input voltage threshold and input clamping that tolerates VI up to V_CC + 0.5 V. This capability is explicitly confirmed in the General Description and Functional Diagram sections of the datasheet.

What is the thermal pad on the HXQFN16(U) package of the NX3DV3899HR,115 intended for?

The exposed thermal pad on the NX3DV3899HR,115's HXQFN16(U) package (SOT1039-2) is attached to the die substrate using conductive die attach material. Per the Pinning Information section, there is no electrical or mechanical requirement to solder this pad; if connected, it must remain floating or be tied to GND. Its purpose is thermal enhancement-not electrical grounding-and improves power dissipation for sustained 350 mA operation.

Is the NX3DV3899HR,115 pin-compatible with the NX3DV3899GU variant?

No, the NX3DV3899HR,115 is not pin-compatible with the NX3DV3899GU. The HR variant uses the HXQFN16(U) package (SOT1039-2, 3 mm × 3 mm), while the GU variant uses the XQFN16 package (SOT1161-1, 1.8 mm × 2.6 mm). Their pin configurations differ significantly-e.g., V_CC is on pin 14 in HR but pin 13 in GU-and the land patterns are incompatible. PCB redesign is required for substitution.

What is the guaranteed break-before-make time for the NX3DV3899HR,115 at 4.3 V supply?

The NX3DV3899HR,115 guarantees a break-before-make time of ≤11 ns at V_CC = 4.3 V, as documented in Table 9 (Dynamic Characteristics). This timing is ensured by internal design-not just typical behavior-and prevents momentary short-circuits during channel switching, which is critical for protecting sensitive audio codecs and USB transceivers.