NXP Semiconductors NX3DV3899HRZ

Overview

NX3DV3899HRZ from NXP Semiconductors is a dual double-pole double-throw (DPDT) analog switch IC designed for bidirectional signal routing in low-voltage portable systems. It features four independent SPDT switches (1Z/1Y0/1Y1, 2Z/2Y0/2Y1, 3Z/3Y0/3Y1, 4Z/4Y0/4Y1), operates from 1.4 V to 4.3 V supply, delivers 2.2 Ω typical ON resistance at 4.3 V, and supports 1.8 V logic control with 350 mA continuous current handling - enabling direct interface with 1.8 V microcontrollers in battery-powered audio/data paths.

For engineers reviewing the NX3DV3899HRZ datasheet, NX3DV3899HRZ pinout, NX3DV3899HRZ application, or NX3DV3899HRZ equivalent, key selection criteria include its break-before-make switching behavior, ±500 mA peak switch current capability, -40 °C to +125 °C temperature range, Schmitt-trigger select inputs tolerant of slow edges, and compatibility with 1.8 V–4.3 V mixed-supply signal routing architectures.

Technical Context

The NX3DV3899HRZ implements four independent CMOS transmission-gate-based SPDT switches controlled by two digital select lines (1S, 2S), each driving one pair of switches. Its Schmitt-trigger inputs ensure robust noise immunity across the full 1.4 V–4.3 V VCC range, with input thresholds scaling proportionally to supply voltage.

Each switch supports bidirectional analog/digital signal flow up to VCC amplitude, exhibits <11 ns break-before-make timing (guaranteed by design), and maintains low charge injection (≤4.0 pC at 4.3 V) and high OFF-state isolation (−70 dB at 1 MHz), making it suitable for precision multiplexing in audio, sensor, and data acquisition paths where signal integrity and crosstalk suppression are critical.

Key Specifications

Pinout & Package

Package: HXQFN16(U), 3 mm × 3 mm × 0.5 mm, thermally enhanced quad flat no-lead with exposed thermal pad (SOT1039-2). Pin 6 is GND; Pin 14 is VCC; Pins 1, 5, 9, 13 are Y0 terminals; Pins 15, 3, 7, 11 are Y1 terminals; Pins 16, 4, 8, 12 are Z (common) terminals; Pins 2 and 10 are select inputs (1S, 2S).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar analog switch applications.

Compared with TS5A3159DRYR and ADG732BRUZ, the NX3DV3899HRZ uniquely integrates dual DPDT topology with guaranteed break-before-make, 1.8 V logic compatibility, and −40 °C to +125 °C qualification - delivering compact, deterministic, and temperature-robust signal routing in space-constrained portable and industrial designs.

Availability

NX3DV3899HRZ is available at Aetrix Electronics and suitable for portable media players, industrial data loggers, and automotive infotainment head units requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for NX3DV3899HRZ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and consumer applications.

The NX3DV3899HRZ belongs to NXP's NX3D analog switch family, engineered specifically for low-voltage, high-fidelity signal routing in battery-powered portable electronics where power efficiency, small footprint, and mixed-voltage interoperability are essential.

FAQ

What is the maximum continuous current rating for the NX3DV3899HRZ switches?

The NX3DV3899HRZ supports 350 mA continuous current per switch under 3.3 V supply conditions, as specified in the datasheet's Features section. This rating applies across the full −40 °C to +125 °C operating temperature range and enables reliable routing of audio driver outputs, sensor excitation currents, and other medium-power analog signals without thermal derating in standard PCB layouts.

Does the NX3DV3899HRZ require external level-shifting when controlled by a 1.8 V microcontroller?

No, the NX3DV3899HRZ does not require external level-shifting when driven by a 1.8 V microcontroller. Its Schmitt-trigger select inputs (1S, 2S) accept logic levels down to 0.9 V VIH minimum at VCC = 1.65 V and scale with supply voltage - allowing direct 1.8 V GPIO control even when VCC = 3.6 V or 4.3 V, as confirmed in Table 7 (Static Characteristics) and Section 1 General Description.

What package type is used for the NX3DV3899HRZ, and is thermal pad soldering required?

The NX3DV3899HRZ uses the HXQFN16(U) package (SOT1039-2), a 3 mm × 3 mm × 0.5 mm thermally enhanced quad flat no-lead with an exposed substrate pad. Per Figure 3 and Package Outline documentation, this pad is attached using conductive die attach material but has no electrical or mechanical requirement to be soldered; if soldered, the land must remain floating or be connected to GND to maintain thermal performance and avoid unintended coupling.

How does the NX3DV3899HRZ ensure signal integrity during switching in audio applications?

The NX3DV3899HRZ ensures audio signal integrity through guaranteed break-before-make timing (≤11 ns), low total harmonic distortion (<0.01 % at 3.6 V), high OFF-state isolation (−70 dB at 1 MHz), and minimal charge injection (≤4.0 pC). These characteristics collectively suppress audible clicks, crosstalk between channels, and DC offset shifts - enabling clean, glitch-free switching of line-level and headphone signals in portable media players and smartphones.

Is the NX3DV3899HRZ pin-compatible with other variants in the NX3DV3899 family?

Yes, the NX3DV3899HRZ shares identical pinout and footprint with the NX3DV3899HR (same SOT1039-2 package), as confirmed in Table 1 (Ordering Information) and Figure 3 (Pin configuration). Both variants use the same HXQFN16(U) package and terminal mapping, enabling drop-in replacement during migration from the legacy HR version to the HRZ variant, which features updated leadframe construction and Static Shielding Bag packaging.