NXP Semiconductors NX3L1G3157GMZ

Overview

NX3L1G3157GMZ from NXP Semiconductors is a low-ohmic single-pole double-throw (SPDT) analog switch used as a 2:1 multiplexer/demultiplexer in signal routing paths. It features 0.50 Ω typical ON resistance at 2.7 V and 4.3 V supply, break-before-make switching, Schmitt-trigger digital input for noise immunity, and operates across -40 °C to +125 °C for portable audio and interface signal selection.

For engineers reviewing the NX3L1G3157GMZ datasheet, NX3L1G3157GMZ pinout, NX3L1G3157GMZ application, or NX3L1G3157GMZ equivalent, key selection criteria include its 1.4 V–4.3 V wide supply range, ±350 mA continuous switch current, <10 ns break-before-make timing, and XSON6 package compatibility with high-density portable PCB layouts.

Technical Context

The NX3L1G3157GMZ implements a CMOS transmission-gate architecture with dual independent Y0/Y1 paths and a common Z terminal, controlled by a single digital select input (S). Its Schmitt-trigger input accepts voltages up to 4.6 V regardless of VCC level, enabling direct TTL-level interfacing at 3.0 V and tolerance to slow-rising control signals.

Break-before-make switching is guaranteed by design (tb-m ≤ 10 ns at VCC ≥ 3.6 V), preventing momentary shorting between Y0 and Y1. Signal transmission supports bidirectional operation with amplitude up to VCC, and ON-resistance flatness remains ≤0.45 Ω across full signal swing at 4.3 V.

Key Specifications

Pinout & Package

Package: XSON6 (SOT886), plastic extremely thin small outline package; no leads; 6 terminals; body dimensions 1.0 × 1.45 × 0.5 mm.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar SPDT analog switch applications.

Compared with TS5A23157DCUR and ADG858YRMZ-REEL7, the NX3L1G3157GMZ delivers lower ON resistance at 1.4–2.7 V supplies, integrated Schmitt-trigger input for marginal control signals, and the smallest footprint (1.0 × 1.45 mm), making it optimal for battery-powered portable systems where size, power, and signal integrity are co-constrained.

Availability

NX3L1G3157GMZ is available at Aetrix Electronics and suitable for smartphone audio routing, USB 2.0 data switching, and portable media player interface applications requiring stable component supply and long-term manufacturability.

Supply support for NX3L1G3157GMZ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and consumer electronics.

The NX3L1G3157GMZ belongs to NXP's NX3L low-voltage analog switch family, designed specifically for high-fidelity, low-power signal routing in space-constrained portable devices operating from single-cell batteries.

FAQ

What is the maximum continuous current rating for the NX3L1G3157GMZ?

The NX3L1G3157GMZ supports ±350 mA continuous switch current under 3.3 V supply conditions, as specified in Table 5 of the datasheet. This rating applies across the full -40 °C to +125 °C operating temperature range and enables direct routing of audio line-level and sensor interface signals without external current amplification. The NX3L1G3157GMZ also supports ±500 mA pulsed current for durations ≤1 ms at <10 % duty cycle.

Does the NX3L1G3157GMZ require external pull-up or pull-down resistors on the S pin?

No, the NX3L1G3157GMZ includes an integrated Schmitt-trigger input on the S pin, eliminating the need for external pull-up or pull-down resistors. The input accepts logic levels from 0 V to 4.3 V independent of VCC, and its hysteresis ensures reliable switching even with slow-rising or noisy control signals. This feature simplifies PCB layout and reduces BOM count in battery-powered NX3L1G3157GMZ designs.

Can the NX3L1G3157GMZ operate with a 1.4 V supply voltage?

Yes, the NX3L1G3157GMZ is fully specified down to 1.4 V supply voltage, with 1.6 Ω typical ON resistance and 43 ns typical enable time at this level. Its wide 1.4 V–4.3 V operating range allows seamless integration into systems powered by single LiFePO₄ or NiMH cells, and maintains functional performance across the entire recommended voltage window without configuration changes. The NX3L1G3157GMZ datasheet confirms operation at 1.4 V in Tables 6, 8, and 9.

What is the thermal resistance (R_θJA) of the NX3L1G3157GMZ in its XSON6 package?

The NX3L1G3157GMZ in XSON6 (SOT886) package has a junction-to-ambient thermal resistance (R_θJA) of 250 K/W, derived from its 250 mW total power dissipation limit at T_amb = 118 °C and linear derating of 7.8 mW/K above that temperature. This value assumes standard JEDEC 2-layer board conditions and confirms suitability for thermally constrained portable applications where active cooling is absent. The NX3L1G3157GMZ thermal performance is documented in Table 5 footnote [3].

Is the NX3L1G3157GMZ pin-compatible with earlier NX3L1G3157GM variants?

Yes, the NX3L1G3157GMZ uses the identical XSON6 (SOT886) package and pinout as the NX3L1G3157GM, with the only difference being the packing method (Static Shielding Bag per Table 2 footnote [2]). All electrical specifications, timing parameters, and thermal ratings remain unchanged, allowing direct substitution in existing designs without PCB or firmware modifications. The NX3L1G3157GMZ datasheet explicitly lists it as the orderable part number replacing the legacy GM variant.