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NXP Semiconductors NX3L1G53GD,125
- Part No.:
- NX3L1G53GD,125
- Manufacturer:
- NXP Semiconductors
- Package:
- 8-XFDFN
- Datasheet:
-
NX3L1G53GD,125.pdf
- Description:
- IC SWITCH SPDT X 1 750MOHM 8XSON
- Quantity:
- Payment:
- Shipping:
Inventory:1,580
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Product details
Overview
NX3L1G53GD,125 from NXP Semiconductors is a low-ohmic SPDT analog switch configured as a 2:1 multiplexer/demultiplexer, with active LOW enable (E), digital select (S), common port (Z), and dual I/O ports (Y0/Y1). It delivers 0.5 Ω typical ON resistance at 2.7 V, supports 1.4–4.3 V supply, operates from −40 °C to +125 °C, and enables bidirectional signal routing in portable audio paths.
For engineers reviewing the NX3L1G53GD,125 datasheet, NX3L1G53GD,125 pinout, NX3L1G53GD,125 application, or NX3L1G53GD,125 equivalent, key selection criteria include break-before-make timing, ESD robustness (8 kV IEC61000-4-2), THD < 0.02 % at 2.7 V, −90 dB OFF-state isolation, and XSON8 (SOT996-2) package compatibility with high-density PCB layouts.
Technical Context
The NX3L1G53GD,125 implements CMOS-based transmission gate architecture with Schmitt-trigger inputs for noise immunity and tolerance to slow edge rates. Its control logic uses active LOW enable (E) and single-bit select (S) to route signals bidirectionally between Z and either Y0 or Y1, with guaranteed break-before-make switching to prevent signal contention.
It supports rail-to-rail analog signal transmission up to VCC, maintains flat ON resistance (0.13 Ω typical at 2.7 V), and features low charge injection (9 pC at 3.3 V) and crosstalk (< −90 dB), making it suitable for precision audio and high-fidelity data switching where signal integrity is critical.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ON Resistance (typ) | 0.50 Ω at VCC = 2.7 V - ensures minimal insertion loss and voltage drop in audio/data paths |
| Supply Voltage Range | 1.4 V to 4.3 V - compatible with Li-ion, coin-cell, and multi-rail portable systems |
| Operating Temperature | −40 °C to +125 °C - qualified for extended industrial and automotive cabin environments |
| THD (typ) | 0.02 % at 2.7 V, 2 Vp-p, 20 Hz–20 kHz - preserves audio fidelity in headphone and codec interfaces |
| Isolation (OFF-state) | −90 dB at 100 kHz - prevents signal leakage between inactive channels in multiplexed sensors/audio |
| ESD Protection | 8 kV IEC61000-4-2 contact discharge on switch ports - enhances reliability in handheld device assembly and end-use |
| Enable Time (typ) | 15 ns at VCC = 3.6 V - supports fast channel switching in real-time audio routing and sensor arbitration |
Pinout & Package
Package: XSON8 (SOT996-2), plastic extremely thin small outline package, no leads, 8 terminals, body dimensions 3.0 × 2.0 × 0.5 mm.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Z | Common I/O port | Bidirectional signal path shared between Y0 and Y1; supports rail-to-rail analog/digital signals up to VCC |
| E | Active LOW enable input | Disables both switch paths when HIGH; enables routing only when pulled LOW |
| GND (pins 3 & 4) | Ground reference | Dual ground pins reduce impedance and improve noise rejection in high-speed switching |
| S | Select input | Chooses Y0→Z (S = LOW) or Y1→Z (S = HIGH) when E is active LOW |
| Y1 | Independent I/O port | Second bidirectional channel; electrically isolated from Y0 when OFF |
| Y0 | Independent I/O port | Primary bidirectional channel; used for default audio path or primary sensor interface |
| VCC | Supply voltage | Power rail for internal logic and switch biasing; also defines maximum analog signal swing |
Key Features
| Feature | Design Value |
|---|---|
| Break-before-make switching | Guaranteed by design (min 2 ns break time at 2.7 V) - eliminates momentary short-circuit between Y0 and Y1 during channel change |
| Low ON resistance flatness | 0.13 Ω typical at 2.7 V - minimizes amplitude distortion across full signal range in audio applications |
| High noise immunity | Schmitt-trigger inputs on S and E - tolerate slow rise/fall times and reject transient noise in noisy portable environments |
| High current handling | 350 mA continuous at 3.3 V - supports driving low-impedance loads such as 16 Ω headphones or sensor excitation circuits |
| Wide voltage compatibility | Accepts control inputs up to 4.3 V even when VCC = 1.4 V - simplifies level-shifting in mixed-voltage SoC interfaces |
Applications
| Smartphone Audio Routing | Portable Media Player Signal Switching |
|---|---|
Use Scenario: Selecting between stereo headphone output and mono speaker output in a smartphone during call or media playback. IC Role / Device Role / Timing Role: SPDT analog switch enabling dynamic reconfiguration of audio signal paths under processor control. Use Value: 0.5 Ω ON resistance and < 0.02 % THD preserve audio clarity; −90 dB isolation prevents speaker bleed into headphone channel. | Use Scenario: Multiplexing line-in, microphone, and DAC outputs in a portable music player with dual audio jacks. IC Role / Device Role / Timing Role: Bidirectional 2:1 mux/demux managing analog signal flow between codecs, amplifiers, and connectors. Use Value: Rail-to-rail operation supports full 3.3 V audio swing; 15 ns enable time allows responsive UI-driven audio mode changes. |
| Wearable Biometric Sensor Interface | Industrial Handheld Data Logger |
Use Scenario: Switching between multiple analog sensor inputs (ECG, temperature, accelerometer) to a shared ADC in a compact wearable. IC Role / Device Role / Timing Role: Low-leakage analog switch providing channel selection without signal degradation or offset error. Use Value: ±5 nA OFF-state leakage at 25 °C ensures accurate DC-coupled sensor measurements; 1.4 V min supply enables ultra-low-power operation. | Use Scenario: Isolating legacy RS-232 and modern USB-C analog auxiliary signals in a rugged field data logger. IC Role / Device Role / Timing Role: Robust signal routing component handling mixed-voltage interface selection with ESD protection. Use Value: 8 kV IEC61000-4-2 contact ESD rating protects against user-handling events; −40 °C to +125 °C rating ensures outdoor reliability. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar analog switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TS5A23157DCUR | 0.9 Ω typical RON at 3.3 V; 5-pin SOT-23 package; no dual GND pins | Limited to lower-current applications; lacks dual ground for noise-sensitive audio | Choose for cost-sensitive, space-constrained designs where 0.9 Ω RON is acceptable and ESD rating (4 kV) suffices |
| ADG858BRMZ-REEL7 | 0.4 Ω typical RON at 3 V; ±0.5 V overvoltage tolerant; 10-lead MSOP package | Supports fault-protected operation but requires larger footprint and higher BOM cost | Choose when overvoltage protection and sub-0.4 Ω performance justify MSOP size and price premium |
Compared with TS5A23157DCUR and ADG858BRMZ-REEL7, the NX3L1G53GD,125 offers optimal balance of ultra-low RON, dual-GND noise suppression, industry-leading 8 kV ESD, and XSON8's 3×2 mm footprint-making it ideal for high-density portable audio and sensor multiplexing where signal integrity and reliability are prioritized.
Availability
NX3L1G53GD,125 is available at Aetrix Electronics and suitable for smartphone audio routing, portable media player signal switching, and wearable biometric sensor interface applications requiring stable component supply across industrial temperature ranges and high-volume production cycles.
Supply support for NX3L1G53GD,125 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and consumer markets.
The NX3L1G53GD,125 belongs to NXP's NX3L low-voltage analog switch family, designed specifically for energy-efficient, high-fidelity signal routing in battery-powered portable electronics with stringent ESD and thermal requirements.
FAQ
What is the maximum continuous current rating for the NX3L1G53GD,125?
The NX3L1G53GD,125 supports 350 mA continuous current per channel at 3.3 V supply, verified across −40 °C to +125 °C. This rating applies to bidirectional conduction between Z and Y0 or Y1 under recommended operating conditions, with derating required above 118 °C per the datasheet's power dissipation curve.
Does the NX3L1G53GD,125 support rail-to-rail analog signal transmission?
Yes, the NX3L1G53GD,125 allows signals with amplitude up to VCC to be transmitted bidirectionally between Z and Y0/Y1. Its CMOS transmission gate architecture enables full rail-to-rail operation without clamping or distortion, provided switch voltages remain within 0 V to VCC per the recommended operating conditions.
How does the break-before-make feature function in the NX3L1G53GD,125?
The NX3L1G53GD,125 guarantees break-before-make timing by design, with measured minimum break time of 2 ns at 2.7 V. When the select input (S) changes state while enable (E) is active LOW, the previously selected channel disconnects before the new channel connects-preventing momentary short-circuit between Y0 and Y1.
What ESD protection levels does the NX3L1G53GD,125 provide on its switch ports?
The NX3L1G53GD,125 provides 8000 V ESD protection on switch ports (Z, Y0, Y1) per IEC61000-4-2 contact discharge testing. It also meets HBM Class 3A (>7500 V), MM (>200 V), and CDM (>1000 V) standards, ensuring robustness during board assembly and end-user handling in portable devices.
Can the NX3L1G53GD,125 operate with a 1.4 V supply voltage?
Yes, the NX3L1G53GD,125 is fully specified down to 1.4 V supply, delivering 1.6 Ω typical ON resistance and functional logic thresholds at this voltage. Its wide 1.4–4.3 V range supports direct integration with ultra-low-power microcontrollers and energy-harvesting systems without external level shifting.
NX3L1G53GD,125 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Switch Circuit:
- SPDT
- Multiplexer/Demultiplexer Circuit:
- 2:1
- Number of Circuits:
- 1
- On-State Resistance (Max):
- 750mOhm
- Channel-to-Channel Matching (ΔRon):
- 20mOhm
- Voltage - Supply, Single (V+):
- 1.4V ~ 4.3V
- Voltage - Supply, Dual (V±):
- -
- Switch Time (Ton, Toff) (Max):
- 24ns, 8ns
- -3db Bandwidth:
- 60MHz
- Charge Injection:
- 15pC
- Channel Capacitance (CS(off), CD(off)):
- 35pF
- Current - Leakage (IS(off)) (Max):
- 10nA
- Crosstalk:
- -90dB @ 100kHz
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-XSON, SOT996-2 (2x3)
NX3L1G53GD,125 FAQ
1.How can I place an order for NX3L1G53GD,125 through Aetrix?
Please submit a Request for Quotation (RFQ) for NX3L1G53GD,125 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for NX3L1G53GD,125 reliable?
The price and inventory of NX3L1G53GD,125 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for NX3L1G53GD,125 is usually 5 days.
3.What payment methods are accepted for NX3L1G53GD,125?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for NX3L1G53GD,125 transactions.
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4.How is shipping managed for NX3L1G53GD,125?
NX3L1G53GD,125 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your NX3L1G53GD,125 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for NX3L1G53GD,125?
For technical support, including NX3L1G53GD,125 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your NX3L1G53GD,125 requirements.
6.How does Aetrix verify that NX3L1G53GD,125 is sourced from the original manufacturer or authorized distributors?
All NX3L1G53GD,125 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that NX3L1G53GD,125 meets industry standards.
7.What is the process for return or replacement of NX3L1G53GD,125?
All NX3L1G53GD,125 units undergo pre-shipment inspection (PSI). If there is an issue with NX3L1G53GD,125, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The NX3L1G53GD,125 part is unused and in its original packaging.
Return procedure for NX3L1G53GD,125:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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