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NXP Semiconductors NX3L1T3157GW,125

Part No.:
NX3L1T3157GW,125
Manufacturer:
NXP Semiconductors
Category:
Analog Switches, Multiplexers, Demultiplexers
Package:
6-TSSOP, SC-88, SOT-363
Datasheet:
AetrixNX3L1T3157GW,125.pdf
Description:
IC SWITCH SPDTX1 500MOHM 6TSSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,349

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Product details

Overview

NX3L1T3157GW,125 from NXP Semiconductors is a low-ohmic single-pole double-throw (SPDT) analog switch configured as a 2:1 multiplexer/demultiplexer, with digital select input (S), two independent I/Os (Y0, Y1), and a common I/O (Z). It operates from 1.4 V to 4.3 V supply, delivers 0.5 Ω typical ON resistance at 4.3 V, supports 1.8 V logic control in 3.3 V systems, and handles ±350 mA continuous switch current - enabling high-fidelity audio routing in portable media players.

For engineers reviewing the NX3L1T3157GW,125 datasheet, NX3L1T3157GW,125 pinout, NX3L1T3157GW,125 application, or NX3L1T3157GW,125 equivalent, this page provides verified functional specifications, XSON6 package details, break-before-make timing data, ESD robustness (8 kV IEC61000-4-2), and real-world use context for signal path selection in battery-powered consumer electronics.

Technical Context

The NX3L1T3157GW,125 implements CMOS-based transmission gate architecture with Schmitt-triggered digital input for noise immunity and slow-edge tolerance. Its bidirectional analog path supports signal amplitudes up to VCC in either direction (Z ↔ Y0/Y1), with guaranteed break-before-make switching to prevent channel shorting during state transitions.

It features rail-to-rail analog signal handling, 1.8 V logic-compatible control input that accepts voltages above VCC, and ultra-low supply current (≤150 nA at 4.3 V) even under sub-VCC input conditions - making it suitable for always-on signal routing in power-constrained mobile devices operating across −40 °C to +125 °C.

Key Specifications

Parameter Value and Actual Design Meaning
Supply Voltage Range 1.4 V to 4.3 V - enables direct integration into 1.8 V, 2.5 V, 3.3 V, and 4.2 V battery-powered systems without level shifters.
ON Resistance (Typ) 0.50 Ω at VCC = 4.3 V - minimizes insertion loss and voltage drop in high-current analog paths (e.g., headphone drivers).
ON Resistance Flatness 0.13 Ω at VCC = 2.7 V - ensures consistent signal amplitude across full input voltage swing, critical for audio fidelity.
Switch Current Rating ±350 mA continuous - supports driving low-impedance loads such as 16 Ω speakers or RF front-end switches.
ESD Robustness 8 kV IEC61000-4-2 contact discharge on switch ports - eliminates need for external TVS diodes in handheld device interfaces.
Enable/Disable Time 22 ns / 10 ns typical at VCC = 3.6 V - enables fast channel reconfiguration in time-sensitive applications like USB-C alternate mode switching.
Operating Temperature −40 °C to +125 °C - qualified for extended thermal environments in automotive infotainment and industrial portable equipment.

Pinout & Package

XSON6 (SOT886) plastic extremely thin small outline package; no leads; 6 terminals; body dimensions 1.0 × 1.45 × 0.5 mm; pin 1 indicator located on lower left corner below marking code.

Pin/Terminal Circuit Role Design Meaning
1 (Y1) Independent input/output First analog channel endpoint; bidirectional signal path selectable via S input.
2 (GND) Ground reference Primary return path for supply and signal currents; must be low-impedance for THD < 0.02 %.
3 (Y0) Independent input/output Second analog channel endpoint; electrically isolated from Y1 when OFF.
4 (Z) Common input/output Shared signal node; connects to Y0 or Y1 based on S logic state; supports rail-to-rail voltage swing.
5 (VCC) Supply voltage Power rail for analog and digital circuitry; also defines maximum switch voltage (VSW ≤ VCC).
6 (S) Select input Digital control line with Schmitt trigger; accepts 1.8 V logic levels at 3.3 V VCC without level translation.

Key Features

Feature Design Value
Break-before-make switching Guaranteed by design (tb-m ≤ 10 ns at VCC ≥ 2.7 V); prevents momentary short between Y0 and Y1 during transition.
Rail-to-rail analog signal handling Supports signals from GND to VCC on all ports (Z, Y0, Y1); enables full dynamic range usage in audio and sensor interfaces.
1.8 V logic-compatible control VIH = 1.3 V max at VCC = 3.6 V; allows direct interface with low-voltage microcontrollers without pull-up resistors or translators.
Ultra-low charge injection 9 pC typical at VCC = 3.3 V; reduces glitch-induced DC offset in precision ADC/DAC multiplexing applications.
High OFF-state isolation −90 dB at 100 kHz; suppresses crosstalk between active and inactive channels in multi-source audio routing.

Applications

Smartphone Audio Routing Portable Media Player Signal Switching

Use Scenario: Selecting between stereo headset output and mono speaker output in a smartphone during call or playback mode.

IC Role / Device Role / Timing Role: SPDT analog switch controlling bidirectional audio path between codec DAC and dual output transducers.

Use Value: 0.5 Ω ON resistance preserves SNR > 100 dB; 1.8 V logic compatibility enables direct GPIO control from application processor.

Use Scenario: Routing line-in, microphone, or DAC output to shared headphone jack in an MP3 player with multiple input sources.

IC Role / Device Role / Timing Role: 2:1 multiplexer managing analog signal flow between source and load while maintaining impedance matching.

Use Value: −90 dB isolation prevents audible crosstalk between mic and playback paths; 350 mA rating supports 32 Ω headphone drive.

PDA Peripheral Interface USB-C Alternate Mode Switching

Use Scenario: Sharing a single USB OTG port between host-mode peripherals (keyboard, storage) and device-mode accessories (cable, dock).

IC Role / Device Role / Timing Role: Analog switch isolating D+/D− lines during role negotiation and reconfiguring signal paths post-negotiation.

Use Value: 22 ns enable time enables rapid reconfiguration within USB PD timing budgets; 8 kV ESD protection eliminates external clamping diodes.

Use Scenario: Dynamically routing DisplayPort or USB 3.1 lanes through a single Type-C connector based on cable plug orientation and mode detection.

IC Role / Device Role / Timing Role: High-speed analog switch enabling lane remapping without signal degradation or timing skew.

Use Value: 60 MHz −3 dB bandwidth supports USB 3.1 Gen 1 signaling; flat ON resistance (<0.13 Ω variation) maintains eye diagram integrity.

Equivalent & Alternatives

The following parts are listed as comparable options for similar analog switch applications.

Alternative Part Technical Difference Application Difference Selection Advice
TXS0102DCUR 2-channel bidirectional level translator (not analog switch); no rail-to-rail analog pass-through; 5 V tolerant I/O but no Z-Y0/Y1 topology. Designed for digital signal translation only; unsuitable for analog audio or sensor multiplexing requiring continuous voltage domain bridging. Choose only if digital-level shifting (e.g., I²C bus extension) is required - not for analog signal routing.
TMUX1574RSVR SPDT analog switch with 0.7 Ω typical RON at 3.3 V; wider −40 °C to +125 °C range; no integrated Schmitt trigger on control input. Higher RON increases insertion loss in low-voltage audio paths; lacks built-in noise immunity for noisy PCB environments. Acceptable where Schmitt triggering is provided externally and 0.2 Ω higher RON is tolerable in system SNR budget.

Compared with TXS0102DCUR and TMUX1574RSVR, the NX3L1T3157GW,125 uniquely combines true analog bidirectionality, sub-0.5 Ω RON at 4.3 V, Schmitt-triggered control, and 8 kV ESD-hardened switch ports - making it optimal for compact, high-fidelity, low-power consumer audio routing where signal integrity and layout simplicity are critical.

Availability

NX3L1T3157GW,125 is available at Aetrix Electronics and suitable for smartphone audio routing, portable media player signal switching, PDA peripheral interface, and USB-C alternate mode switching requiring stable component supply and long-term production continuity.

Supply support for NX3L1T3157GW,125 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and consumer markets.

The NX3L1T3157GW,125 belongs to NXP's NX3L low-voltage analog switch family, engineered specifically for high-fidelity, low-power signal routing in space-constrained portable electronics operating across wide supply and temperature ranges.

FAQ

What is the maximum analog signal voltage the NX3L1T3157GW,125 can switch?

The NX3L1T3157GW,125 supports analog signal voltages from GND to VCC on all ports (Z, Y0, Y1). With a maximum recommended supply of 4.3 V, it can reliably switch signals up to 4.3 V peak-to-peak in either direction. Exceeding VCC risks violating the absolute maximum switch voltage rating of VCC + 0.5 V, potentially causing latch-up or permanent damage. Always maintain VSW ≤ VCC for guaranteed operation.

Does the NX3L1T3157GW,125 require external level-shifting when controlled by a 1.8 V microcontroller in a 3.3 V system?

No, the NX3L1T3157GW,125 does not require external level-shifting. Its digital select input (S) has a VIH threshold of 1.3 V maximum at VCC = 3.6 V, fully compatible with standard 1.8 V logic HIGH levels. This feature eliminates external translators and simplifies PCB layout - a key advantage confirmed in the device's functional description and Table 7 static characteristics.

Is the NX3L1T3157GW,125 pin-compatible with other members of the NX3L family?

The NX3L1T3157GW,125 uses the XSON6 (SOT886) package with fixed 6-pin configuration (Y1-GND-Y0-Z-VCC-S). While other NX3L devices like NX3L2T3157 share identical pinout and package, the NX3L1T3157GW,125 is a single-pole double-throw variant - distinct from dual-channel or SPST versions. Pin compatibility holds only for same-function, same-package variants; cross-referencing requires verifying both topology and pin assignment per datasheet.

What is the thermal performance limit of the NX3L1T3157GW,125 in its XSON6 package?

In the XSON6 package, the NX3L1T3157GW,125 has a total power dissipation limit of 250 mW at ambient temperatures from −40 °C to +125 °C. Above 118 °C, Ptot derates linearly at 7.8 mW/K. At maximum rated switch current (±350 mA) and worst-case RON (0.9 Ω), power dissipation reaches ~110 mW - well within safe operating limits under typical conditions, provided PCB copper area meets recommended thermal pad guidelines.

How does the NX3L1T3157GW,125 achieve high noise immunity on its digital input?

The NX3L1T3157GW,125 achieves high noise immunity through an integrated Schmitt trigger on the S input, providing hysteresis of approximately 0.4 V to 0.6 V depending on VCC. This design rejects slow-rising/falling edges and transient noise on control lines - a documented feature explicitly cited in the General Description section and validated in the VIH/VIL specifications across all supply voltages.

NX3L1T3157GW,125 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
-
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Switch Circuit:
SPDT
Multiplexer/Demultiplexer Circuit:
2:1
Number of Circuits:
1
On-State Resistance (Max):
500mOhm
Channel-to-Channel Matching (ΔRon):
20mOhm
Voltage - Supply, Single (V+):
1.4V ~ 4.3V
Voltage - Supply, Dual (V±):
-
Switch Time (Ton, Toff) (Max):
40ns, 20ns
-3db Bandwidth:
60MHz
Charge Injection:
15pC
Channel Capacitance (CS(off), CD(off)):
35pF
Current - Leakage (IS(off)) (Max):
10nA
Crosstalk:
-
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
6-TSSOP

NX3L1T3157GW,125 FAQ

1.How can I place an order for NX3L1T3157GW,125 through Aetrix?

Please submit a Request for Quotation (RFQ) for NX3L1T3157GW,125 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for NX3L1T3157GW,125 reliable?

The price and inventory of NX3L1T3157GW,125 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for NX3L1T3157GW,125 is usually 5 days.

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5.How can I obtain technical support or documentation for NX3L1T3157GW,125?

For technical support, including NX3L1T3157GW,125 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your NX3L1T3157GW,125 requirements.

6.How does Aetrix verify that NX3L1T3157GW,125 is sourced from the original manufacturer or authorized distributors?

All NX3L1T3157GW,125 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that NX3L1T3157GW,125 meets industry standards.

7.What is the process for return or replacement of NX3L1T3157GW,125?

All NX3L1T3157GW,125 units undergo pre-shipment inspection (PSI). If there is an issue with NX3L1T3157GW,125, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The NX3L1T3157GW,125 part is unused and in its original packaging.

Return procedure for NX3L1T3157GW,125:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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