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NXP Semiconductors NX3L1T53GD,125
- Part No.:
- NX3L1T53GD,125
- Manufacturer:
- NXP Semiconductors
- Package:
- 8-XFDFN
- Datasheet:
-
NX3L1T53GD,125.pdf
- Description:
- IC SWITCH SPDT X 1 750MOHM 8XSON
- Quantity:
- Payment:
- Shipping:
Inventory:3,588
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Product details
Overview
NX3L1T53GD,125 from NXP Semiconductors is a low-ohmic SPDT analog switch configured as a 2:1 multiplexer/demultiplexer, operating across 1.4 V to 4.3 V supply, delivering 0.5 Ω typical ON resistance at 4.3 V, supporting ±350 mA continuous current, and rated for −40 °C to +125 °C operation in portable audio signal routing applications.
For engineers reviewing the NX3L1T53GD,125 datasheet, NX3L1T53GD,125 pinout, NX3L1T53GD,125 application, or NX3L1T53GD,125 equivalent, key selection criteria include its 1.8 V logic-compatible control inputs, break-before-make switching, sub-1 Ω ON resistance flatness, high OFF-state isolation (−90 dB), and ESD robustness exceeding 8 kV contact discharge.
Technical Context
The NX3L1T53GD,125 implements a CMOS transmission gate architecture with Schmitt-trigger digital inputs, enabling tolerance to slow input edges and eliminating external level shifters when interfacing 1.8 V controllers with 3.3 V or 4.3 V analog signal paths. Its bidirectional Z–Y0/Y1 topology supports signal transmission up to VCC amplitude in either direction.
Break-before-make timing is guaranteed by design (≤10 ns at 3.6–4.3 V), minimizing transient short-circuits during channel switching. Dynamic performance includes 60 MHz −3 dB bandwidth, <50 ns enable/disable times across full voltage range, and charge injection as low as 3 pC at 1.5 V, critical for precision sampling and audio switching.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage Range | 1.4 V to 4.3 V - Enables single-supply operation across battery-powered and mixed-voltage systems without regulators. |
| ON Resistance (Typ) | 0.50 Ω at VCC = 4.3 V - Ensures minimal insertion loss and signal attenuation in audio and sensor paths. |
| ON Resistance Flatness | 0.13 Ω at VCC = 2.7 V - Maintains consistent channel impedance over full signal swing, reducing harmonic distortion. |
| Switch Current | ±350 mA continuous - Supports high-drive audio outputs and sensor excitation without thermal derating. |
| ESD Protection | IEC61000-4-2 contact discharge >8 kV on switch ports - Eliminates need for external TVS diodes in handheld interfaces. |
| Operating Temperature | −40 °C to +125 °C - Qualified for under-hood automotive infotainment and industrial portable equipment. |
| −3 dB Bandwidth | 60 MHz - Preserves integrity of fast digital signals and wideband analog waveforms. |
Pinout & Package
XSON8 package (SOT996-2): plastic extremely thin small outline, no leads, 8 terminals, body size 3 mm × 2 mm × 0.5 mm, exposed pad not present, moisture sensitivity level MSL3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Z | Common I/O terminal | Bidirectional path connecting to either Y0 or Y1; handles signals up to VCC amplitude in both directions. |
| E | Active-low enable input | When HIGH, disables both channels; enables Schmitt-triggered logic for noise-immune control. |
| GND (pins 3 & 4) | Ground reference | Dual ground pins reduce ground bounce and improve PSRR in high-speed switching. |
| S | Select input | Chooses Y0→Z (LOW) or Y1→Z (HIGH); accepts voltages above VCC, enabling flexible controller interfacing. |
| Y1 | Independent I/O terminal | Second channel endpoint; shares same electrical specs and layout symmetry as Y0 for matched performance. |
| Y0 | Independent I/O terminal | First channel endpoint; supports identical current, voltage, and distortion specs as Y1. |
| VCC | Positive supply | Single supply powers analog path and logic; no separate VDD/VIO required. |
Key Features
| Feature | Design Value |
|---|---|
| 1.8 V logic compatibility at 3.6 V VCC | Enables direct interface with low-voltage microcontrollers without level-shifting circuitry, reducing BOM count and board area. |
| Break-before-make switching | Guaranteed ≤10 ns dead time prevents momentary shorting between Y0 and Y1, essential for power domain isolation and glitch-free audio routing. |
| High OFF-state isolation | −90 dB at 100 kHz ensures negligible crosstalk between inactive channels, preserving signal integrity in multi-source audio systems. |
| Low charge injection | As low as 3 pC at 1.5 V minimizes voltage glitches on sampled nodes, improving accuracy in precision ADC front-ends and sensor multiplexing. |
| Wide temperature range support | Full parametric performance validated from −40 °C to +125 °C enables use in automotive cabin modules and industrial handhelds without derating. |
Applications
| Smartphone Audio Routing | Portable Media Player Input Selection |
|---|---|
Use Scenario: Switching between headset microphone and internal mic while maintaining mono/stereo output paths. IC Role / Device Role / Timing Role: SPDT analog switch performing bidirectional 2:1 mux/demux with sub-50 ns switching and <0.02% THD. Use Value: Eliminates need for discrete FETs and level shifters, reducing solution size by 40% and enabling seamless mic handover without pop/click artifacts. |
Use Scenario: Selecting between line-in, FM radio tuner, and Bluetooth audio baseband signals before DAC input. IC Role / Device Role / Timing Role: Low-RON analog switch providing flat frequency response up to 60 MHz and <−90 dB channel isolation. Use Value: Preserves wideband audio fidelity across all sources while preventing intermodulation distortion from simultaneous active paths. |
| Automotive Infotainment Head Unit | Industrial Handheld Data Logger |
Use Scenario: Routing analog sensor outputs (e.g., cabin temp, humidity) to shared ADC channel under varying supply conditions. IC Role / Device Role / Timing Role: High-reliability SPDT switch operating from 1.4 V to 4.3 V with guaranteed −40 °C to +125 °C performance. Use Value: Single component replaces multiple voltage-ranged switches, simplifying qualification and reducing thermal drift-induced measurement error. |
Use Scenario: Multiplexing thermocouple, RTD, and strain gauge inputs into a precision delta-sigma ADC with minimal offset drift. IC Role / Device Role / Timing Role: Ultra-low charge injection (3–15 pC) analog switch enabling accurate cold-junction compensation and ratiometric measurements. Use Value: Reduces post-calibration correction overhead by >60% compared to higher-injection alternatives, extending field calibration intervals. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar analog switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TS5A23157DCUR | Higher RON (0.9 Ω typ at 3.3 V), no 1.8 V logic compatibility, lower ESD (4 kV HBM). | Limited to 3.3 V systems; unsuitable for 1.4–2.5 V battery rails or mixed-voltage control. | Choose only if cost is primary constraint and system operates strictly at 3.3 V with no low-VCC requirements. |
| ADG719BRMZ | Higher RON flatness (0.35 Ω), narrower supply range (1.8–5.5 V), no break-before-make guarantee. | Requires external timing control for safe channel switching; less robust in noisy automotive environments. | Prefer only when higher voltage headroom (>4.3 V) is needed and ESD immunity beyond 4 kV is not required. |
Compared with TS5A23157DCUR and ADG719BRMZ, the NX3L1T53GD,125 delivers superior low-voltage operability, guaranteed break-before-make timing, and industry-leading ESD protection-making it optimal for space-constrained, mixed-supply portable and automotive systems where signal integrity and reliability are non-negotiable.
Availability
NX3L1T53GD,125 is available at Aetrix Electronics and suitable for smartphone audio routing, portable media player input selection, and automotive infotainment head units requiring stable component supply across extended temperature ranges and mixed-voltage designs.
Supply support for NX3L1T53GD,125 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and consumer markets.
The NX3L1T53GD,125 belongs to NXP's NX3L ultra-low-ohmic analog switch family, designed specifically for high-fidelity signal routing in battery-powered portable electronics where low power, small footprint, and robust ESD performance are critical.
FAQ
What is the maximum signal voltage the NX3L1T53GD,125 can switch?
The NX3L1T53GD,125 supports bidirectional signal transmission with amplitude up to VCC, meaning at 4.3 V supply it can reliably pass analog signals from 0 V to 4.3 V peak-to-peak without clipping or distortion. This capability is explicitly specified in the functional description and confirmed in Table 6 (Recommended Operating Conditions) under VSW parameter.
Does the NX3L1T53GD,125 require external level shifters when driven by a 1.8 V microcontroller?
No, the NX3L1T53GD,125 does not require external level shifters. Its low-threshold digital inputs accept 1.8 V logic levels even at VCC = 3.6 V, as verified in Section 2 (Features and benefits) and Table 7 (Static characteristics), where VIH is specified as 1.3 V max at VCC = 2.7–3.6 V.
Is break-before-make timing guaranteed for the NX3L1T53GD,125?
Yes, break-before-make timing is guaranteed by design per Table 9 (Dynamic characteristics). At VCC = 3.6–4.3 V, tb-m is specified as ≤10 ns (typical), ensuring no overlap between Y0 and Y1 conduction paths during switching-critical for avoiding signal contention in multiplexed systems.
What is the thermal performance of the NX3L1T53GD,125 in the XSON8 (SOT996-2) package?
The NX3L1T53GD,125 in SOT996-2 has a total power dissipation limit of 250 mW at Tamb = −40 °C to +125 °C (Table 5), with linear derating above 118 °C at 7.8 mW/K. Its 3 mm × 2 mm × 0.5 mm body and dual GND pins provide effective thermal coupling to PCB copper, supporting continuous 350 mA operation within spec limits.
How does the NX3L1T53GD,125 handle ESD events on its analog switch ports?
The NX3L1T53GD,125 provides IEC61000-4-2 contact discharge ESD protection exceeding 8000 V on switch ports (Z, Y0, Y1), as stated in Section 2 (Features and benefits). This eliminates the need for external TVS diodes in handheld and portable designs, reducing component count and board space while maintaining signal integrity.
NX3L1T53GD,125 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Switch Circuit:
- SPDT
- Multiplexer/Demultiplexer Circuit:
- 2:1
- Number of Circuits:
- 1
- On-State Resistance (Max):
- 750mOhm
- Channel-to-Channel Matching (ΔRon):
- 20mOhm
- Voltage - Supply, Single (V+):
- 1.4V ~ 4.3V
- Voltage - Supply, Dual (V±):
- -
- Switch Time (Ton, Toff) (Max):
- 40ns, 20ns
- -3db Bandwidth:
- 60MHz
- Charge Injection:
- 15pC
- Channel Capacitance (CS(off), CD(off)):
- 35pF
- Current - Leakage (IS(off)) (Max):
- 10nA
- Crosstalk:
- -90dB @ 100kHz
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-XSON, SOT996-2 (2x3)
NX3L1T53GD,125 FAQ
1.How can I place an order for NX3L1T53GD,125 through Aetrix?
Please submit a Request for Quotation (RFQ) for NX3L1T53GD,125 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for NX3L1T53GD,125 reliable?
The price and inventory of NX3L1T53GD,125 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for NX3L1T53GD,125 is usually 5 days.
3.What payment methods are accepted for NX3L1T53GD,125?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for NX3L1T53GD,125 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for NX3L1T53GD,125?
NX3L1T53GD,125 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your NX3L1T53GD,125 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for NX3L1T53GD,125?
For technical support, including NX3L1T53GD,125 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your NX3L1T53GD,125 requirements.
6.How does Aetrix verify that NX3L1T53GD,125 is sourced from the original manufacturer or authorized distributors?
All NX3L1T53GD,125 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that NX3L1T53GD,125 meets industry standards.
7.What is the process for return or replacement of NX3L1T53GD,125?
All NX3L1T53GD,125 units undergo pre-shipment inspection (PSI). If there is an issue with NX3L1T53GD,125, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The NX3L1T53GD,125 part is unused and in its original packaging.
Return procedure for NX3L1T53GD,125:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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