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NXP Semiconductors NX3L1T53GM,125
- Part No.:
- NX3L1T53GM,125
- Manufacturer:
- NXP Semiconductors
- Package:
- 8-XFQFN Exposed Pad
- Datasheet:
-
NX3L1T53GM,125.pdf
- Description:
- IC SWITCH SPDTX1 750MOHM 8XQFNU
- Quantity:
- Payment:
- Shipping:
Inventory:4,219
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Product details
Overview
NX3L1T53GM,125 from NXP Semiconductors is a low-ohmic SPDT analog switch configured as a 2:1 multiplexer/demultiplexer with active-low enable (E), digital select (S), common port (Z), and dual I/O ports (Y0/Y1). It operates from 1.4 V to 4.3 V, delivers 0.50 Ω typical ON resistance at 4.3 V, supports 1.8 V logic control in 3.3 V systems, and handles ±350 mA continuous current - enabling high-fidelity audio routing in portable media players.
For engineers reviewing the NX3L1T53GM,125 datasheet, NX3L1T53GM,125 pinout, NX3L1T53GM,125 application, or NX3L1T53GM,125 equivalent, key selection criteria include its break-before-make timing (≤10 ns at 4.3 V), −90 dB OFF-state isolation, 60 MHz −3 dB bandwidth, charge injection <15 pC, and operation across −40 °C to +125 °C for automotive infotainment and industrial HMI designs.
Technical Context
The NX3L1T53GM,125 implements CMOS transmission-gate architecture with Schmitt-trigger inputs for noise immunity and rail-to-rail analog signal switching up to VCC. Its control logic accepts input voltages exceeding VCC, enabling direct interfacing with 1.8 V microcontrollers in 3.3 V supply domains without level shifters.
Break-before-make switching is guaranteed by design (tb-m ≤10 ns at VCC ≥3.6 V), and dynamic performance includes 10–22 ns enable/disable times depending on supply voltage. Total harmonic distortion remains ≤0.02% at VCC ≥2.3 V with 2 V(p-p) signals into 32 Ω loads, supporting high-fidelity audio path selection.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage Range | 1.4 V to 4.3 V - enables single-supply operation across battery-powered and regulated rail systems |
| ON Resistance (Typ) | 0.50 Ω at VCC = 4.3 V - minimizes insertion loss and thermal drift in precision analog paths |
| Switch Bandwidth | 60 MHz (−3 dB) - supports high-speed digital and wideband analog signal routing |
| OFF-State Isolation | −90 dB at 100 kHz - prevents crosstalk between inactive channels in multi-source systems |
| Charge Injection | 15 pC max at VCC = 4.3 V - reduces glitch-induced settling errors in sampled-data circuits |
| Operating Temperature | −40 °C to +125 °C - qualified for under-hood automotive and industrial edge computing environments |
| ESD Protection | 8 kV IEC61000-4-2 contact discharge on switch ports - enhances robustness in handheld device interfaces |
Pinout & Package
The NX3L1T53GM,125 uses the SOT902-2 (XQFN8) package: plastic extremely thin quad flat package, no leads, 8 terminals, body size 1.6 × 1.6 × 0.5 mm, with exposed thermal pad not intended for soldering.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (Y0) | Independent I/O port | Connects to first signal source/destination; bidirectional analog or digital path |
| 2 (Y1) | Independent I/O port | Connects to second signal source/destination; mutually exclusive with Y0 when selected |
| 3 (S) | Select input | Digital control line determining Z ↔ Y0 (S = L) or Z ↔ Y1 (S = H); Schmitt-triggered |
| 4 (GND) | Ground reference | Primary return path for analog and digital currents; two GND pins improve PSRR |
| 5 (GND) | Ground reference | Second ground terminal reduces ground bounce and improves channel-to-channel isolation |
| 6 (E) | Enable input (active LOW) | Global switch disable: E = H forces all paths OFF regardless of S state |
| 7 (Z) | Common I/O port | Central hub for multiplexing; connects to system bus, codec interface, or sensor hub |
| 8 (VCC) | Supply voltage | Power rail for analog switch core and input buffers; decoupling required within 2 mm |
Key Features
| Feature | Design Value |
|---|---|
| 1.8 V logic compatibility at 3.3 V VCC | Enables direct MCU GPIO control without level translators, reducing BOM count and layout area |
| Break-before-make switching | Guarantees no momentary short between Y0 and Y1 during channel transitions, preventing signal corruption |
| Rail-to-rail analog signal handling | Supports signals from GND to VCC on all ports, preserving full dynamic range in audio and sensor interfaces |
| Ultra-low supply current | ICC ≤150 nA at VCC = 4.3 V - extends battery life in always-on portable applications |
| High noise immunity | Schmitt-trigger inputs tolerate slow rise/fall times and reject EMI, improving reliability in noisy PCB environments |
Applications
| Audio Signal Routing | USB Interface Switching |
|---|---|
Use Scenario: Selecting between stereo headphone output and mono speaker output in a smartphone during call state transitions. IC Role / Device Role / Timing Role: SPDT analog switch providing low-distortion, low-latency path selection with break-before-make guarantee. Use Value: 0.02% THD and 60 MHz bandwidth preserve audio fidelity; 10 ns tb-m prevents audible click/pop artifacts. | Use Scenario: Sharing a single USB data pair between host controller and peripheral IC in space-constrained wearables. IC Role / Device Role / Timing Role: Bidirectional 2:1 mux enabling dynamic reconfiguration of D+/D− lines without protocol layer intervention. Use Value: 0.5 Ω RON ensures minimal signal integrity degradation; −90 dB isolation prevents cross-talk between USB modes. |
| Industrial Sensor Multiplexing | Automotive Infotainment Input Selection |
Use Scenario: Routing analog outputs from multiple temperature/humidity sensors to a single ADC input in an environmental monitoring node. IC Role / Device Role / Timing Role: Precision analog multiplexer with ultra-low leakage (<500 nA OFF-state) and rail-to-rail support. Use Value: ±350 mA current rating accommodates sensor excitation; −40 °C to +125 °C rating matches industrial ambient requirements. | Use Scenario: Switching between Bluetooth audio stream and FM radio tuner output to a shared amplifier stage in a car head unit. IC Role / Device Role / Timing Role: High-isolation analog switch managing RF-sensitive audio paths with ESD-hardened switch ports. Use Value: 8 kV IEC61000-4-2 contact ESD protection withstands dashboard touch events; 0.13 Ω RON flatness ensures consistent gain across channels. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar analog switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TS5A23157DCUR | Higher ON resistance (0.9 Ω typ at 3.3 V); no 1.8 V logic compatibility; only rated to +85 °C | Limited to consumer-grade portable devices; unsuitable for automotive or extended-temp industrial use | Choose TS5A23157DCUR only if cost is primary constraint and temperature range ≤85 °C suffices |
| ADG719BRMZ | Lower bandwidth (100 MHz), higher charge injection (25 pC), no break-before-make guarantee, 3.6 V max VCC | Not suitable for high-fidelity audio or fast-switching multi-source systems requiring glitch-free transitions | Select ADG719BRMZ only for low-frequency instrumentation where timing precision is non-critical |
Compared with TS5A23157DCUR and ADG719BRMZ, the NX3L1T53GM,125 uniquely combines 1.8 V logic drive, −40 °C to +125 °C operation, guaranteed break-before-make, and sub-0.5 Ω ON resistance - making it the only option qualified for automotive infotainment and industrial HMI signal routing where reliability and signal integrity are co-critical.
Availability
NX3L1T53GM,125 is available at Aetrix Electronics and suitable for portable media players, automotive infotainment systems, and industrial sensor nodes requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for NX3L1T53GM,125 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with leadership in analog, mixed-signal, and RF technologies.
The NX3L1T53GM,125 belongs to NXP's NX3L low-voltage analog switch family, engineered for energy-efficient signal routing in battery-powered portable electronics and harsh-environment industrial controls.
FAQ
What is the maximum signal voltage the NX3L1T53GM,125 can switch?
The NX3L1T53GM,125 supports rail-to-rail analog signal switching from GND to VCC on all ports (Z, Y0, Y1). With VCC up to 4.3 V, the absolute maximum switch voltage is VCC + 0.5 V per datasheet limiting values - meaning it safely handles signals up to 4.8 V peak when VCC = 4.3 V. This allows direct interfacing with legacy 5 V tolerant peripherals while operating from a 4.3 V supply.
Does the NX3L1T53GM,125 require external pull-up or pull-down resistors on its control pins?
No, the NX3L1T53GM,125 does not require external biasing on S or E pins. Its Schmitt-trigger inputs provide hysteresis and defined thresholds (VIH = 1.4 V min, VIL = 0.6 V max at VCC = 4.3 V), ensuring clean logic transitions even with slow-rising signals. Internal input structures eliminate need for external resistors, simplifying PCB layout and reducing component count.
Can the NX3L1T53GM,125 be used in audio applications with low total harmonic distortion?
Yes, the NX3L1T53GM,125 is optimized for audio routing: THD is ≤0.02% at VCC ≥2.3 V with 2 V(p-p) signals into 32 Ω loads. Its 0.50 Ω typical ON resistance, 0.13 Ω flatness, and 60 MHz bandwidth preserve signal integrity across the full 20 Hz–20 kHz audio band - confirmed in NXP's Figure 19 test circuit and validated in portable media player reference designs.
What is the thermal pad on the NX3L1T53GM,125 package used for?
The exposed metal pad on the bottom of the NX3L1T53GM,125's SOT902-2 (XQFN8) package is a thermal pad designed to enhance heat dissipation. However, per NXP's package drawing (Fig 27), it is explicitly marked "not for soldering" - meaning it must remain electrically isolated and unconnected to any PCB copper pour or plane. Thermal transfer occurs via conduction through the package mold compound, not solder joint conduction.
How does the NX3L1T53GM,125 handle input voltages exceeding VCC on its control pins?
The NX3L1T53GM,125 features overvoltage-tolerant control inputs: S and E accept VI up to VCC + 0.5 V (absolute max) and down to −0.5 V. This allows direct connection to 1.8 V GPIOs in a 3.3 V system without level shifters - verified by NXP's "Control input accepts voltages above supply voltage" feature and tested per JESD78 latch-up conditions (exceeds 100 mA).
NX3L1T53GM,125 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Switch Circuit:
- SPDT
- Multiplexer/Demultiplexer Circuit:
- 2:1
- Number of Circuits:
- 1
- On-State Resistance (Max):
- 750mOhm
- Channel-to-Channel Matching (ΔRon):
- 20mOhm
- Voltage - Supply, Single (V+):
- 1.4V ~ 4.3V
- Voltage - Supply, Dual (V±):
- -
- Switch Time (Ton, Toff) (Max):
- 40ns, 20ns
- -3db Bandwidth:
- 60MHz
- Charge Injection:
- 15pC
- Channel Capacitance (CS(off), CD(off)):
- 35pF
- Current - Leakage (IS(off)) (Max):
- 10nA
- Crosstalk:
- -90dB @ 100kHz
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-XQFNU (1.6x1.6)
NX3L1T53GM,125 FAQ
1.How can I place an order for NX3L1T53GM,125 through Aetrix?
Please submit a Request for Quotation (RFQ) for NX3L1T53GM,125 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for NX3L1T53GM,125 reliable?
The price and inventory of NX3L1T53GM,125 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for NX3L1T53GM,125 is usually 5 days.
3.What payment methods are accepted for NX3L1T53GM,125?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for NX3L1T53GM,125 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for NX3L1T53GM,125?
NX3L1T53GM,125 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your NX3L1T53GM,125 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for NX3L1T53GM,125?
For technical support, including NX3L1T53GM,125 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your NX3L1T53GM,125 requirements.
6.How does Aetrix verify that NX3L1T53GM,125 is sourced from the original manufacturer or authorized distributors?
All NX3L1T53GM,125 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that NX3L1T53GM,125 meets industry standards.
7.What is the process for return or replacement of NX3L1T53GM,125?
All NX3L1T53GM,125 units undergo pre-shipment inspection (PSI). If there is an issue with NX3L1T53GM,125, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The NX3L1T53GM,125 part is unused and in its original packaging.
Return procedure for NX3L1T53GM,125:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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