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Home > Products > Integrated Circuits (ICs) > Interface > Analog Switches, Multiplexers, Demultiplexers

NXP Semiconductors NX3L2267GM,132

Name: NX3L2267GM,132
Brand: NXP Semiconductors
SKU: NX3L2267GM,132
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: NX3L2267GM,132

Manufacturer:: NXP Semiconductors

Category:: Analog Switches, Multiplexers, Demultiplexers

Package:: 10-XFQFN

Datasheet:: NX3L2267GM,132.pdf

Description:: IC SWITCH SPDTX2 750MOHM 10XQFN

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Product details

Overview

NX3L2267GM,132 from NXP Semiconductors is a dual low-ohmic SPDT analog switch configured as two independent 2:1 multiplexer/demultiplexer channels, each with Schmitt-trigger digital select inputs (1S/2S), common I/O (1Z/2Z), and dual independent I/Os (1Y0/1Y1 and 2Y0/2Y1). It operates from 1.4 V to 4.3 V supply, delivers 0.50 Ω typical ON resistance at 4.3 V, supports 1.8 V logic control in 3.3 V systems, and handles ±350 mA continuous switch current - used in portable audio routing and signal path selection.

For engineers reviewing the NX3L2267GM,132 datasheet, NX3L2267GM,132 pinout, NX3L2267GM,132 application, or NX3L2267GM,132 equivalent, key selection criteria include guaranteed break-before-make switching, sub-0.5 Ω ON resistance flatness, −40 °C to +125 °C operation, ESD robustness (6 kV IEC61000-4-2), and compatibility with high-speed audio and data multiplexing where minimal signal distortion and level-shifting elimination are critical.

Technical Context

The NX3L2267GM,132 implements two identical CMOS-based SPDT analog switches with independent digital control. Each channel uses Schmitt-trigger inputs for noise immunity and accepts input voltages up to VCC + 0.5 V, enabling overvoltage-tolerant control signaling. Its bidirectional architecture allows signal transmission from Z to Yn or Yn to Z with amplitude up to VCC.

Break-before-make timing is guaranteed by design (tb-m ≤ 10 ns at VCC ≥ 2.7 V), preventing momentary short-circuit between Y0 and Y1 during switching. The device maintains low charge injection (≤37 pC at 4.3 V) and high OFF-state isolation (−90 dB at 100 kHz), making it suitable for precision analog signal routing in battery-powered systems.

Key Specifications

Parameter	Value and Actual Design Meaning
Supply Voltage Range	1.4 V to 4.3 V - enables single-supply operation across Li-ion, 1.8 V logic, and 3.3 V system rails without external regulators.
ON Resistance (Typical)	0.50 Ω at VCC = 4.3 V - ensures <0.01 dB insertion loss in 50 Ω audio/data paths and minimal voltage drop under 350 mA load.
ON Resistance Flatness	0.23 Ω max at VCC = 4.3 V - guarantees consistent signal attenuation across full input voltage swing (0–VCC), critical for linearity in audio switching.
Switch Current Rating	±350 mA continuous - supports high-current sensor or amplifier output routing without thermal derating at +125 °C ambient.
ESD Robustness	6 kV IEC61000-4-2 contact discharge on switch ports - eliminates need for external TVS diodes in handheld device front-end interfaces.
Operating Temperature	−40 °C to +125 °C - qualified for automotive cabin and industrial edge-node applications requiring extended thermal range.
Enable/Disable Time	22 ns typical enable time at VCC ≥ 2.7 V - supports >20 MHz digital multiplexing rates in FPGA I/O expansion and test equipment signal conditioning.

Pinout & Package

Package: XQFN10 (SOT1049-3), plastic extremely thin quad flat package, no leads; 10 terminals; body dimensions 2.0 × 1.55 × 0.5 mm.

Pin/Terminal	Circuit Role	Design Meaning
1	1Y0	Independent analog I/O terminal for Channel 1 - connects to source/sink of first multiplexed signal path (e.g., left audio channel).
2	1Y1	Independent analog I/O terminal for Channel 1 - alternate path for Channel 1, selected when 1S = HIGH per function table.
3	2Y0	Independent analog I/O terminal for Channel 2 - dedicated signal path for second independent multiplexer (e.g., right audio or data line).
4	2Y1	Independent analog I/O terminal for Channel 2 - second selectable path for Channel 2, activated by 2S = HIGH.
5	GND	Analog/digital ground reference - must be low-impedance connection to minimize crosstalk and ensure accurate threshold behavior of Schmitt triggers.
6	2Z	Common analog I/O for Channel 2 - bidirectional node connecting to system bus, codec interface, or shared signal line.
7	2S	Digital select input for Channel 2 - Schmitt-triggered, accepts 1.8 V logic even at VCC = 3.6 V; tolerant of slow edges (≤200 ns/V).
8	1S	Digital select input for Channel 1 - independently controlled; enables simultaneous or staggered switching of both channels without interaction.
9	1Z	Common analog I/O for Channel 1 - electrically isolated from 2Z; supports true dual-channel independence in mixed-signal routing.
10	VCC	Positive supply rail - powers internal logic and switch FETs; decoupling capacitor (≥100 nF) required within 2 mm of this pin for stable high-speed operation.

Key Features

Feature	Design Value
1.8 V logic-compatible control at 3.3 V supply	Eliminates level translators in mixed-voltage SoC interfaces, reducing BOM count and PCB area in portable designs.
Break-before-make switching	Guaranteed 10 ns minimum dead time prevents signal shorting during channel transitions - essential for protecting sensitive DACs or ADCs.
0.50 Ω typical ON resistance at 4.3 V	Delivers <0.005% THD at 20 kHz in 32 Ω headphone paths and preserves signal integrity in high-fidelity audio routing.
−90 dB OFF-state isolation at 100 kHz	Suppresses crosstalk between active and inactive channels, enabling clean multi-source selection in audio codecs and sensor hubs.
6 kV IEC61000-4-2 ESD on switch ports	Meets EN 61000-4-2 Level 4 for handheld product compliance without added protection components.

Applications

Smartphone Audio Routing	Portable Media Player Signal Switching
Use Scenario: Selecting between stereo headset output and mono speaker output while maintaining microphone input path integrity. IC Role / Device Role / Timing Role: Dual SPDT analog switch providing independent left/right channel routing with break-before-make timing to prevent pop/click artifacts. Use Value: 0.50 Ω ON resistance minimizes insertion loss (<0.01 dB), and 1.8 V logic compatibility simplifies baseband processor interface without voltage translation.	Use Scenario: Multiplexing line-in, DAC output, and headphone amplifier signals onto shared codec interface pins in space-constrained players. IC Role / Device Role / Timing Role: Low-distortion analog multiplexer enabling dynamic reconfiguration of audio signal paths under firmware control. Use Value: −90 dB isolation prevents audible crosstalk between playback and recording paths; 350 mA rating supports direct drive of low-Z headphones.
Industrial Sensor Hub Multiplexing	Automotive Infotainment Front-End
Use Scenario: Routing outputs from multiple temperature, pressure, and humidity sensors to a single ADC input in battery-powered condition monitoring nodes. IC Role / Device Role / Timing Role: Precision analog switch with low charge injection (≤37 pC) and flat ON resistance to preserve measurement accuracy across channels. Use Value: 1.4 V minimum supply enables operation directly from depleted Li-SOCl₂ cells; −40 °C to +125 °C rating supports unheated outdoor deployment.	Use Scenario: Managing audio signal paths between Bluetooth module, USB-C audio adapter, and AM/FM tuner in compact head unit designs. IC Role / Device Role / Timing Role: High-isolation, low-THD analog switch supporting concurrent audio source selection and noise-sensitive RF-adjacent layout. Use Value: 6 kV ESD protection on switch ports meets automotive ISO 10605 requirements; 0.23 Ω ON resistance flatness ensures consistent frequency response across sources.

Smartphone Audio Routing

Portable Media Player Signal Switching

Use Scenario: Selecting between stereo headset output and mono speaker output while maintaining microphone input path integrity.

IC Role / Device Role / Timing Role: Dual SPDT analog switch providing independent left/right channel routing with break-before-make timing to prevent pop/click artifacts.

Use Value: 0.50 Ω ON resistance minimizes insertion loss (<0.01 dB), and 1.8 V logic compatibility simplifies baseband processor interface without voltage translation.

Use Scenario: Multiplexing line-in, DAC output, and headphone amplifier signals onto shared codec interface pins in space-constrained players.

IC Role / Device Role / Timing Role: Low-distortion analog multiplexer enabling dynamic reconfiguration of audio signal paths under firmware control.

Use Value: −90 dB isolation prevents audible crosstalk between playback and recording paths; 350 mA rating supports direct drive of low-Z headphones.

Industrial Sensor Hub Multiplexing

Automotive Infotainment Front-End

Use Scenario: Routing outputs from multiple temperature, pressure, and humidity sensors to a single ADC input in battery-powered condition monitoring nodes.

IC Role / Device Role / Timing Role: Precision analog switch with low charge injection (≤37 pC) and flat ON resistance to preserve measurement accuracy across channels.

Use Value: 1.4 V minimum supply enables operation directly from depleted Li-SOCl₂ cells; −40 °C to +125 °C rating supports unheated outdoor deployment.

Use Scenario: Managing audio signal paths between Bluetooth module, USB-C audio adapter, and AM/FM tuner in compact head unit designs.

IC Role / Device Role / Timing Role: High-isolation, low-THD analog switch supporting concurrent audio source selection and noise-sensitive RF-adjacent layout.

Use Value: 6 kV ESD protection on switch ports meets automotive ISO 10605 requirements; 0.23 Ω ON resistance flatness ensures consistent frequency response across sources.

Equivalent & Alternatives

The following parts are listed as comparable options for similar analog switch applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
Texas Instruments TS5A23157DCUR	Single-channel SPDT, 0.9 Ω typical RON at 3.3 V, −40 °C to +85 °C only, no 1.8 V logic support at 3.3 V supply.	Limited to commercial-temperature consumer devices; lacks dual-channel integration and extended temp capability.	Select when single-channel operation suffices and cost is prioritized over thermal range and logic-level flexibility.
Analog Devices ADG884BRMZ	Dual SPDT, 0.55 Ω typical RON at 3 V, −40 °C to +125 °C, but requires ≥2.5 V logic for full functionality and offers only 4 kV HBM ESD.	Suitable for high-precision instrumentation but less robust for handheld ESD environments and lacks 1.8 V logic tolerance.	Prefer when ultra-low THD (<0.01%) is mandatory and system-level ESD protection is already implemented externally.

Compared with TS5A23157DCUR and ADG884BRMZ, the NX3L2267GM,132 uniquely combines dual-channel integration, 1.8 V logic compatibility at 3.3 V supply, 6 kV IEC61000-4-2 ESD rating, and −40 °C to +125 °C operation - making it optimal for compact, rugged, multi-source portable and automotive audio systems requiring zero external level translation.

Availability

NX3L2267GM,132 is available at Aetrix Electronics and suitable for smartphone audio routing, portable media player signal switching, industrial sensor hub multiplexing, and automotive infotainment front-end applications requiring stable component supply across extended temperature ranges and high-volume production cycles.

Supply support for NX3L2267GM,132 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and mobile applications, with leadership in analog, RF, and mixed-signal ICs.

The NX3L2267GM,132 belongs to NXP's NX3L low-ohmic analog switch family, designed specifically for high-fidelity, low-power signal routing in portable and battery-operated electronics where minimal distortion, wide supply range, and robust ESD performance are essential.

FAQ

What is the maximum signal voltage that can be routed through the NX3L2267GM,132?

The NX3L2267GM,132 supports analog signal voltages from 0 V to VCC on all switch terminals (1Y0, 1Y1, 1Z, 2Y0, 2Y1, 2Z). With VCC up to 4.3 V, the device can transmit signals with amplitude up to 4.3 V peak-to-peak. Absolute maximum switch voltage is VCC + 0.5 V, but operation beyond VCC is not recommended for signal integrity or reliability. The NX3L2267GM,132 must never be biased outside its specified operating conditions per Table 5 and Table 6 of the datasheet.

Does the NX3L2267GM,132 support break-before-make switching, and is it guaranteed?

Yes, break-before-make (BBM) switching is guaranteed by design in the NX3L2267GM,132. Measured BBM time is ≥10 ns at VCC ≥ 2.7 V and ≥13 ns at VCC = 2.3 V across the full −40 °C to +125 °C temperature range. This prevents momentary short-circuiting between Y0 and Y1 terminals during channel transitions, protecting downstream components like DACs or amplifiers. The NX3L2267GM,132 achieves this via internal timing control - no external circuitry is needed.

Can the NX3L2267GM,132 be controlled using 1.8 V logic while powered at 3.3 V?

Yes, the NX3L2267GM,132 explicitly supports 1.8 V logic-level control inputs (1S and 2S) when VCC = 3.3 V or 3.6 V. Its Schmitt-trigger inputs provide high noise immunity, and VIH/VIL thresholds are defined to accept 1.8 V HIGH and 0 V LOW signals without increasing ICC. This eliminates the need for external level shifters in mixed-voltage SoC designs. The NX3L2267GM,132 datasheet confirms this capability in Section 2 (Features and benefits) and Table 7 (Static characteristics).

What is the thermal performance of the NX3L2267GM,132 in the SOT1049-3 package?

In the SOT1049-3 (XQFN10) package, the NX3L2267GM,132 has a total power dissipation limit of 250 mW at Tamb = −40 °C to +125 °C. Above 132 °C, Ptot derates linearly at 14.1 mW/K. With typical ICC < 5 µA and RON < 0.5 Ω, self-heating is negligible under normal signal conditions. Thermal resistance (RθJA) is not specified in the datasheet, but the 2.0 × 1.55 mm footprint supports effective PCB copper pour for heat spreading. The NX3L2267GM,132 is rated for continuous operation up to +125 °C ambient.

How does the NX3L2267GM,132 handle ESD protection on its analog switch ports?

The NX3L2267GM,132 provides 6000 V ESD protection on all analog switch ports (1Y0, 1Y1, 1Z, 2Y0, 2Y1, 2Z) per IEC61000-4-2 contact discharge testing. This exceeds standard Level 4 requirements for handheld electronics and eliminates the need for external ESD protection diodes in most portable designs. Additional protection includes 7500 V HBM and 1000 V CDM ratings. The NX3L2267GM,132 integrates these protections internally - no external components are required to meet IEC61000-4-2 compliance.

NX3L2267GM,132 Specifications

Product attributes: Attribute value

Manufacturer:: NXP Semiconductors

Series:: -

Packaging:: Tape & Reel (TR)

Product Status:: Obsolete

Switch Circuit:: SPDT

Multiplexer/Demultiplexer Circuit:: 2:1

Number of Circuits:: 2

On-State Resistance (Max):: 750mOhm

Channel-to-Channel Matching (ΔRon):: 90mOhm

Voltage - Supply, Single (V+):: 1.4V ~ 4.3V

Voltage - Supply, Dual (V±):: -

Switch Time (Ton, Toff) (Max):: 40ns, 20ns

-3db Bandwidth:: 60MHz

Charge Injection:: 37pC

Channel Capacitance (CS(off), CD(off)):: 35pF

Current - Leakage (IS(off)) (Max):: 10nA

Crosstalk:: -90dB @ 100kHz

Operating Temperature:: -40°C ~ 125°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 10-XQFN (1.55x2)

NX3L2267GM,132 FAQ

1.How can I place an order for NX3L2267GM,132 through Aetrix?

Please submit a Request for Quotation (RFQ) for NX3L2267GM,132 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for NX3L2267GM,132 reliable?

The price and inventory of NX3L2267GM,132 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for NX3L2267GM,132 is usually 5 days.

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4.How is shipping managed for NX3L2267GM,132?

NX3L2267GM,132 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your NX3L2267GM,132 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for NX3L2267GM,132?

For technical support, including NX3L2267GM,132 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your NX3L2267GM,132 requirements.

6.How does Aetrix verify that NX3L2267GM,132 is sourced from the original manufacturer or authorized distributors?

All NX3L2267GM,132 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that NX3L2267GM,132 meets industry standards.

7.What is the process for return or replacement of NX3L2267GM,132?

All NX3L2267GM,132 units undergo pre-shipment inspection (PSI). If there is an issue with NX3L2267GM,132, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The NX3L2267GM,132 part is unused and in its original packaging.

Return procedure for NX3L2267GM,132:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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