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NXP Semiconductors NX3L2467GU,115
- Part No.:
- NX3L2467GU,115
- Manufacturer:
- NXP Semiconductors
- Package:
- 16-XFQFN
- Datasheet:
-
NX3L2467GU,115.pdf
- Description:
- IC SWITCH DPDTX2 750MOHM 16XQFN
- Quantity:
- Payment:
- Shipping:
Inventory:4,574
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Product details
Overview
NX3L2467GU,115 from NXP Semiconductors is a dual low-ohmic double-pole double-throw (DPDT) analog switch configured as four independent SPDT channels (1Z/1Y0/1Y1 through 4Z/4Y0/4Y1), operating from 1.4 V to 4.3 V supply, delivering 0.5 Ω typical ON resistance at 4.3 V, and supporting ±350 mA continuous switch current - used in high-fidelity audio routing and compact portable device signal multiplexing.
For engineers reviewing the NX3L2467GU,115 datasheet, NX3L2467GU,115 pinout, NX3L2467GU,115 application, or NX3L2467GU,115 equivalent, key selection criteria include its 0.13 Ω ON-resistance flatness, break-before-make timing (<11 ns), 1.8 V logic compatibility at 3.6 V VCC, -40 °C to +125 °C operation, and XQFN16 package thermal performance.
Technical Context
The NX3L2467GU,115 implements CMOS transmission-gate architecture with Schmitt-trigger digital inputs (1S, 2S) enabling robust switching under slow-rising control signals. Each of its four bidirectional SPDT switches supports rail-to-rail analog signal transmission (VSW = 0 to VCC) with minimal distortion.
Break-before-make switching is guaranteed by design to prevent momentary shorting between Y0/Y1 paths. The device features input voltage tolerance beyond VCC, allowing 1.8 V controllers to drive the switch in 3.3 V systems without level shifters - critical for power-efficient portable designs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage Range | 1.4 V to 4.3 V - enables single-supply operation across Li-ion battery (3.0–4.2 V), 3.3 V, and 1.8 V logic domains. |
| ON Resistance (Typ) | 0.5 Ω at VCC = 4.3 V - ensures <0.1% signal attenuation for 100 mV–2 V audio/video signals at 100 mA load. |
| ON Resistance Flatness | 0.13 Ω max - maintains consistent gain and phase response across full signal swing (0–VCC). |
| Switch Current | ±350 mA continuous - supports high-drive audio codecs, sensor multiplexing, and ADC/DAC channel selection. |
| Enable/Disable Time | 19 ns typ enable / 8 ns typ disable at VCC = 4.3 V - meets timing requirements for fast-switching data acquisition and TDM routing. |
| Operating Temperature | -40 °C to +125 °C - qualified for automotive infotainment front-end and industrial handheld applications. |
| ESD Protection | 6 kV IEC61000-4-2 contact discharge on switch ports - eliminates need for external ESD diodes in consumer interface paths. |
Pinout & Package
XQFN16 package: plastic extremely thin quad flat no-lead, 16-terminal, body dimensions 1.80 × 2.60 × 0.50 mm, thermal pad exposed on underside, lead-free and RoHS compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 5, 9, 13 | 1Y0, 2Y0, 3Y0, 4Y0 | Independent analog input/output terminals - each pairs with corresponding Y1 and Z to form one SPDT switch. |
| 2, 10 | 1S, 2S | Digital select inputs with Schmitt trigger - accept 1.8 V logic directly at 3.6 V VCC; tolerate slow edges (>200 ns/V). |
| 3, 7, 11, 15 | 1Y1, 2Y1, 3Y1, 4Y1 | Second independent analog I/O per channel - selected when respective S input is HIGH. |
| 4, 8, 12, 16 | 1Z, 2Z, 3Z, 4Z | Common analog I/O terminals - bidirectionally connect to Y0 or Y1 based on S input state. |
| 6 | GND | Ground reference (0 V) - must be low-impedance connection; ties to thermal pad for optimal power dissipation. |
| 14 | VCC | Positive supply rail - powers internal logic and switch transistors; decoupling capacitor required within 2 mm. |
Key Features
| Feature | Design Value |
|---|---|
| Rail-to-rail analog switching | Signals from 0 V to VCC transmitted bidirectionally with <0.4 V dropout - preserves full dynamic range in audio and sensor interfaces. |
| 1.8 V logic-compatible control | VIH = 1.4 V min at VCC = 4.3 V - allows direct interfacing with ultra-low-power microcontrollers without level translation circuitry. |
| Break-before-make guarantee | <11 ns tb-m at VCC = 4.3 V - prevents signal shorting during channel transitions, essential for glitch-free audio and data routing. |
| Low charge injection | 15 pC max at VCC = 4.3 V - minimizes voltage glitches on high-impedance nodes (e.g., SAR ADC sample capacitors). |
| High OFF-isolation | -90 dB at 100 kHz - suppresses crosstalk between active and inactive channels in multi-source audio mixing. |
Applications
| Smartphone Audio Routing | Portable Media Player Signal Switching |
|---|---|
|
Use Scenario: Selecting between stereo headset, mono speaker, and line-out outputs in space-constrained smartphone PCBs. IC Role / Device Role / Timing Role: Dual DPDT analog switch managing four independent audio paths with simultaneous left/right channel control via 1S/2S. Use Value: 0.5 Ω RON and 0.13 Ω flatness preserve SNR >100 dB; XQFN16 footprint (1.8 × 2.6 mm) saves >60% board area vs. TSSOP16. |
Use Scenario: Multiplexing microphone inputs (digital MEMS and analog electret) and headphone/line outputs in portable media players. IC Role / Device Role / Timing Role: Bidirectional analog switch enabling flexible I/O reconfiguration under firmware control without hardware changes. Use Value: ±350 mA current rating supports high-drive headphone amplifiers; 6 kV ESD protection eliminates external TVS diodes on jack interfaces. |
| PDA Touchscreen Interface | Industrial Handheld Data Acquisition |
|
Use Scenario: Routing analog touch panel signals (X+, X−, Y+, Y−) to ADC inputs while isolating unused channels from noise. IC Role / Device Role / Timing Role: Four-channel SPDT switch providing selectable signal paths with break-before-make to avoid ADC input overload. Use Value: -90 dB isolation at 100 kHz prevents coupling between driven and floating electrodes; 1.4 V min VCC enables operation from single-cell LiFePO₄. |
Use Scenario: Switching multiple sensor inputs (thermocouple, RTD, voltage) into a shared precision ADC in battery-powered test equipment. IC Role / Device Role / Timing Role: Low-leakage analog multiplexer (IS(OFF) ≤ ±10 nA at VCC = 4.3 V) maintaining measurement accuracy across temperature ranges. Use Value: 15 pC charge injection prevents offset errors in 16-bit+ SAR conversions; -40 °C to +125 °C rating supports extended field deployment. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar analog switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Texas Instruments TS5A23157DCUR | Single SPDT, 0.65 Ω RON at 3.3 V, SOT-23-6 package, no Schmitt trigger, 1.65–5.5 V supply. | Lacks dual DPDT configuration and break-before-make guarantee; requires two devices to match NX3L2467GU,115 channel count. | Select when board space permits discrete SPDT placement and 1.8 V logic compatibility is not required. |
| Analog Devices ADG884BRMZ | Dual SPDT, 0.45 Ω RON at 3 V, MSOP-10 package, 1.8–5.5 V supply, no integrated ESD protection beyond 2 kV HBM. | Higher ESD vulnerability (no 6 kV IEC61000-4-2 rating); lacks thermal-enhanced XQFN package for high-current operation. | Prefer for precision instrumentation where ultra-low RON dominates over ruggedness and thermal performance. |
Compared with TS5A23157DCUR and ADG884BRMZ, the NX3L2467GU,115 delivers integrated dual DPDT functionality in a thermally optimized 1.8 × 2.6 mm XQFN16, with guaranteed break-before-make timing, 1.8 V logic compatibility, and 6 kV system-level ESD protection - reducing BOM count and improving reliability in portable consumer designs.
Availability
NX3L2467GU,115 is available at Aetrix Electronics and suitable for smartphone audio routing, portable media player signal switching, PDA touchscreen interface, and industrial handheld data acquisition requiring stable component supply across automotive and industrial temperature grades.
Supply support for NX3L2467GU,115 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and consumer applications.
The NX3L2467 product line targets ultra-low-power, space-constrained portable electronics, delivering high-performance analog switching with minimal board footprint and robust ESD immunity for next-generation mobile interfaces.
FAQ
What is the maximum signal voltage that can be switched by the NX3L2467GU,115?
The NX3L2467GU,115 supports rail-to-rail analog signal switching from 0 V to VCC. With a maximum supply voltage of 4.3 V, it can transmit signals up to 4.3 V peak-to-peak without clipping or distortion. Absolute maximum switch voltage is VCC + 0.5 V, but operation beyond VCC is not recommended for signal integrity.
Does the NX3L2467GU,115 require external level-shifting when controlled by a 1.8 V microcontroller?
No. The NX3L2467GU,115 features low-threshold digital inputs with VIH = 1.4 V (min) at VCC = 4.3 V and Schmitt-trigger action, enabling direct 1.8 V logic control even when VCC is 3.3 V or 3.6 V - eliminating external level shifters and saving PCB area and bill-of-materials cost.
How does the break-before-make timing of the NX3L2467GU,115 prevent signal corruption?
The NX3L2467GU,115 guarantees break-before-make operation with <11 ns tb-m at VCC = 4.3 V. This ensures that one path (e.g., 1Y0–1Z) is fully disconnected before the alternate path (1Y1–1Z) connects, preventing momentary shorts between signal sources - critical for avoiding clicks in audio paths or latch-up in mixed-signal systems.
What thermal considerations apply to the NX3L2467GU,115 in XQFN16 package?
The NX3L2467GU,115 in XQFN16 (SOT1161-1) has a total power dissipation limit of 250 mW at Tamb ≤ 133 °C, derating linearly at 14.5 mW/K above that. Its exposed thermal pad must be soldered to a dedicated PCB copper pour for effective heat transfer - achieving junction-to-ambient θJA ≈ 120 °C/W with 200 mm² 2-oz copper.
Can the NX3L2467GU,115 be used in automotive infotainment systems?
Yes. The NX3L2467GU,115 is qualified for operation from -40 °C to +125 °C and features 6 kV IEC61000-4-2 contact ESD protection on switch ports - meeting key requirements for head unit audio routing, USB-C alternate mode signal switching, and sensor multiplexing in AEC-Q200–aligned designs.
NX3L2467GU,115 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Switch Circuit:
- DPDT
- Multiplexer/Demultiplexer Circuit:
- 2:1
- Number of Circuits:
- 2
- On-State Resistance (Max):
- 750mOhm
- Channel-to-Channel Matching (ΔRon):
- 70mOhm
- Voltage - Supply, Single (V+):
- 1.4V ~ 4.3V
- Voltage - Supply, Dual (V±):
- -
- Switch Time (Ton, Toff) (Max):
- 40ns, 20ns
- -3db Bandwidth:
- 60MHz
- Charge Injection:
- 15pC
- Channel Capacitance (CS(off), CD(off)):
- 35pF
- Current - Leakage (IS(off)) (Max):
- 10nA
- Crosstalk:
- -90dB @ 100kHz
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-XQFN (1.8x2.6)
NX3L2467GU,115 FAQ
1.How can I place an order for NX3L2467GU,115 through Aetrix?
Please submit a Request for Quotation (RFQ) for NX3L2467GU,115 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for NX3L2467GU,115 reliable?
The price and inventory of NX3L2467GU,115 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for NX3L2467GU,115 is usually 5 days.
3.What payment methods are accepted for NX3L2467GU,115?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for NX3L2467GU,115 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for NX3L2467GU,115?
NX3L2467GU,115 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your NX3L2467GU,115 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for NX3L2467GU,115?
For technical support, including NX3L2467GU,115 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your NX3L2467GU,115 requirements.
6.How does Aetrix verify that NX3L2467GU,115 is sourced from the original manufacturer or authorized distributors?
All NX3L2467GU,115 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that NX3L2467GU,115 meets industry standards.
7.What is the process for return or replacement of NX3L2467GU,115?
All NX3L2467GU,115 units undergo pre-shipment inspection (PSI). If there is an issue with NX3L2467GU,115, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The NX3L2467GU,115 part is unused and in its original packaging.
Return procedure for NX3L2467GU,115:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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