NXP Semiconductors NX3L2467HR,115

Overview

NX3L2467HR,115 from NXP Semiconductors is a dual low-ohmic double-pole double-throw (DPDT) analog switch in HXQFN16 package, supporting 1.4 V to 4.3 V supply, 0.5 Ω typical ON resistance at 2.7 V and 4.3 V, break-before-make switching, and 1.8 V logic-compatible control inputs. It enables bidirectional signal routing in portable audio and interface multiplexing applications.

For engineers reviewing the NX3L2467HR,115 datasheet, NX3L2467HR,115 pinout, NX3L2467HR,115 application, or NX3L2467HR,115 equivalent, key selection criteria include its 0.5 Ω R_ON flatness (0.13 Ω), ±350 mA continuous switch current, -40 °C to +125 °C operation, IEC61000-4-2 6 kV ESD rating on switch ports, and compatibility with 1.8 V controllers driving 4.3 V analog signals without level translation.

Technical Context

The NX3L2467HR,115 integrates four independent SPDT switches-each with two selectable paths (nY0/nY1) routed to a common terminal (nZ)-controlled by two digital select inputs (1S, 2S). Its Schmitt-triggered inputs tolerate slow edge rates, and its CMOS architecture ensures low ICC even when input voltages fall below VCC.

Break-before-make timing is guaranteed by design (typ. 11 ns at 4.3 V), preventing momentary short-circuits during state transitions. The device supports rail-to-rail analog signal transmission (up to VCC amplitude) with minimal distortion, validated by THD ≤ 0.02 % at 2 V_p-p and f(-3dB) ≥ 60 MHz across full supply range.

Key Specifications

Pinout & Package

HXQFN16 (SOT1039-2): plastic thermal enhanced extremely thin quad flat package; no leads; 16 terminals; body 3 × 3 × 0.5 mm.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar analog switch applications.

Compared with NX3L2467PW,118, the NX3L2467HR,115 offers 30 % smaller PCB area and improved thermal efficiency in thin-profile enclosures; versus NX3L2467GU,115, it provides higher thermal conductivity via exposed paddle, making it more suitable for sustained 350 mA switching in compact industrial handhelds.

Availability

NX3L2467HR,115 is available at Aetrix Electronics and suitable for smartphone audio routing, portable media player interface management, and PDA peripheral expansion requiring stable component supply across automotive-grade temperature ranges.

Supply support for NX3L2467HR,115 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and consumer markets.

The NX3L2467 product line delivers ultra-low-R_ON analog switches optimized for battery-powered portable electronics, emphasizing rail-to-rail signal integrity, 1.8 V logic compatibility, and robust ESD resilience in miniature packages.

FAQ

What is the maximum analog signal voltage the NX3L2467HR,115 can switch?

The NX3L2467HR,115 supports analog signals from GND to VCC - meaning its maximum switch voltage equals the applied supply voltage, up to 4.3 V per the recommended operating conditions. Absolute maximum switch voltage is VCC + 0.5 V (≤ 4.6 V), but operation beyond VCC risks increased leakage and is not specified for signal integrity. This rail-to-rail capability enables direct interfacing with unbuffered audio and sensor outputs without external bias networks.

Does the NX3L2467HR,115 support break-before-make switching, and is it guaranteed?

Yes, the NX3L2467HR,115 implements break-before-make (BBM) switching by design, with a guaranteed minimum tb-m of 2 ns at 125 °C and VCC = 4.3 V. This prevents momentary short-circuits between nY0 and nY1 during state transitions - critical for protecting sensitive downstream circuitry like audio amplifiers or ADC inputs. BBM timing is process- and temperature-compensated, eliminating need for external timing control.

Can the NX3L2467HR,115 be controlled directly by a 1.8 V microcontroller in a 3.3 V system?

Yes, the NX3L2467HR,115 accepts 1.8 V logic levels on its 1S and 2S inputs even when VCC = 3.3 V or 4.3 V, with VIH = 1.3 V (min) and VIL = 0.5 V (max) at those supplies. Its Schmitt-trigger inputs further enhance noise immunity. This eliminates level-shifter components, reducing BOM count and PCB area - a key advantage confirmed in NXP's application guidance for portable system integration.

What is the thermal performance difference between NX3L2467HR,115 and NX3L2467PW,118?

The NX3L2467HR,115 (HXQFN16) has a total power dissipation limit of 250 mW above 135 °C, derating at 16.9 mW/K, while the NX3L2467PW,118 (TSSOP16) supports 500 mW above 60 °C, derating at 5.5 mW/K. Though the HXQFN16 offers superior thermal conductivity via its exposed paddle, its lower absolute P_tot reflects its thinner profile. For sustained 350 mA switching, board-level copper pour under the HXQFN16 paddle is essential to meet thermal targets.

How does the NX3L2467HR,115 achieve low THD in audio paths?

The NX3L2467HR,115 achieves THD ≤ 0.02 % at 2 V_p-p through ultra-low and tightly matched ON resistance (0.5 Ω typical, 0.13 Ω flatness), minimal charge injection (15 pC max), and symmetrical switch architecture that preserves waveform integrity across frequency bands up to 20 kHz. These parameters are measured and guaranteed across -40 °C to +125 °C, ensuring consistent audio fidelity in portable devices under real-world thermal conditions.