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NXP Semiconductors NX3L2T66GD,125
- Part No.:
- NX3L2T66GD,125
- Manufacturer:
- NXP Semiconductors
- Package:
- 8-XFDFN
- Datasheet:
-
NX3L2T66GD,125.pdf
- Description:
- IC SW SPST-NOX2 750MOHM 8XSON
- Quantity:
- Payment:
- Shipping:
Inventory:1,695
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Product details
Overview
NX3L2T66GD,125 from NXP Semiconductors is a dual low-ohmic SPST analog switch with two independent 0.5 Ω (typical at VCC = 4.3 V) bidirectional channels, Schmitt-trigger enable inputs, and 1.4 V to 4.3 V supply operation. It enables 4.3 V analog signal routing under 1.8 V digital control without level translation and supports continuous 350 mA per channel at 3.3 V.
For engineers reviewing the NX3L2T66GD,125 datasheet, NX3L2T66GD,125 pinout, NX3L2T66GD,125 application, or NX3L2T66GD,125 equivalent, key selection criteria include ON-resistance flatness (0.13 Ω), -40 °C to +125 °C temperature range, ESD robustness (IEC61000-4-2 contact ±4000 V), THD < 0.02 % at 4.3 V, and XQFN8 package compatibility with high-density portable PCB layouts.
Technical Context
The NX3L2T66GD,125 implements two independent CMOS transmission gates, each controlled by an active-HIGH enable input (1E/2E) with Schmitt-trigger hysteresis for noise immunity and slow-edge tolerance. Its rail-to-rail analog switching capability supports bidirectional signal flow between Y and Z terminals up to VCC, with minimal distortion due to low RON and flatness.
Designed for low-voltage mixed-signal systems, it accepts control voltages exceeding VCC (up to 4.6 V), maintains sub-μA supply current at 1.8 V logic drive, and delivers 60 MHz -3 dB bandwidth in ON-state while achieving -90 dB OFF-state isolation at 100 kHz - all specified across industrial and extended automotive-grade temperature ranges.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage | 1.4 V to 4.3 V - Enables direct interface with 1.8 V, 2.5 V, 3.3 V, and 4.3 V system rails without regulators. |
| ON Resistance (peak) | 0.50 Ω (typical at VCC = 4.3 V) - Minimizes voltage drop and power loss for 350 mA continuous channel current. |
| RON Flatness | 0.13 Ω (typical at VCC = 2.7 V) - Ensures consistent signal amplitude across full analog input swing, critical for audio and sensor interfaces. |
| THD | < 0.02 % at VCC = 4.3 V, 2 Vp-p, 20 Hz–20 kHz - Preserves fidelity in portable audio path switching. |
| Enable Propagation Delay | 18 ns (typical, VCC = 4.3 V) - Supports fast digital control of analog paths in real-time signal routing applications. |
| ESD Robustness | IEC61000-4-2 contact ±4000 V on switch ports - Reduces need for external protection in handheld device I/O stages. |
| Operating Temperature | -40 °C to +125 °C - Qualified for extended industrial and under-hood consumer applications. |
Pinout & Package
Package: XQFN8 (SOT902-2), plastic extremely thin quad flat package; no leads; 8 terminals; body 1.6 × 1.6 × 0.5 mm.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1Z, 2Z | Switch terminal (bidirectional) | Analog I/O node - connects to signal source or load; supports rail-to-rail voltage up to VCC. |
| 1Y, 2Y | Switch terminal (bidirectional) | Paired with corresponding Z pin; forms fully symmetric SPST path for analog signal routing. |
| 1E, 2E | Enable input (active HIGH) | Schmitt-triggered logic input - tolerates slow edges and accepts voltages up to 4.6 V, even above VCC. |
| VCC | Positive supply | Single supply for analog and digital sections; defines maximum switch voltage and ON-resistance performance. |
| GND | Ground reference | Common return for supply, logic, and analog signals; required for ESD clamp operation and leakage control. |
Key Features
| Feature | Design Value |
|---|---|
| Rail-to-rail analog switching | Signals from 0 V to VCC pass bidirectionally between Y and Z pins without clipping or distortion. |
| 1.8 V logic compatibility at 3.6 V VCC | Enables direct connection to low-voltage microcontrollers without level shifters, reducing BOM count and layout area. |
| Ultra-low charge injection (≤6 pC) | Minimizes transient glitches during switching - critical for precision ADC/DAC multiplexing and sample-hold circuits. |
| High OFF-state isolation (-90 dB) | Prevents crosstalk between inactive channels in multi-source audio or sensor routing applications. |
| Low THD and flat frequency response | 60 MHz -3 dB bandwidth and <0.02 % THD ensure transparent audio and wideband signal path integrity. |
Applications
| Smartphone Audio Routing | Portable Media Player Signal Switching |
|---|---|
Use Scenario: Selecting between stereo headset output and mono speaker output in space-constrained smartphone PCBs. IC Role / Device Role / Timing Role: Dual SPST analog switch managing bidirectional audio paths with zero DC offset and minimal insertion loss. Use Value: Eliminates need for discrete FETs or level translators; 0.5 Ω RON preserves SNR, and 1.8 V logic compatibility reduces MCU GPIO overhead. |
Use Scenario: Dynamically routing line-in, microphone, and DAC outputs in battery-powered MP3 players. IC Role / Device Role / Timing Role: Low-distortion analog multiplexer enabling shared audio codec resources across multiple peripherals. Use Value: THD < 0.02 % ensures audiophile-grade playback; -40 °C to +125 °C rating supports operation in hot vehicle cabins. |
| PDA Touchscreen Interface Multiplexing | Wearable Biometric Sensor Hub |
Use Scenario: Isolating resistive touchscreen controller from auxiliary sensors (e.g., ambient light, proximity) during active touch detection. IC Role / Device Role / Timing Role: Fast-enable analog gate preventing signal coupling and ground bounce during measurement cycles. Use Value: 18 ns enable time synchronizes with controller timing; 0.13 Ω RON flatness avoids calibration drift across touch panel voltage gradients. |
Use Scenario: Sharing a single ADC input among ECG, SpO₂, and skin temperature sensors in ultra-thin wearables. IC Role / Device Role / Timing Role: Precision analog switch with sub-6 pC charge injection to prevent baseline shift in biopotential measurements. Use Value: 350 mA current handling supports LED drivers for optical sensing; XQFN8 footprint saves >30 % board area vs. SOIC alternatives. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar analog switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TXS0102DCUR | 2-channel level-translating switch; requires separate VCCA/VCCB; higher RON (≈5 Ω typical); no Schmitt trigger on enable. | Best suited when bidirectional level translation between disparate voltage domains (e.g., 1.8 V ↔ 3.3 V) is required. | Select TXS0102DCUR only if level-shifting functionality is mandatory; NX3L2T66GD,125 offers lower RON and integrated Schmitt trigger for cleaner digital control. |
| MAX4617EUA+ | Single-supply SPST switch; 3.5 Ω RON (typical); -40 °C to +85 °C only; no ESD rating published for switch ports. | Targeted at cost-sensitive industrial controls where extended temperature and ESD robustness are not critical. | Choose MAX4617EUA+ for legacy designs with relaxed thermal/ESD requirements; NX3L2T66GD,125 provides superior performance in portable, high-reliability applications. |
Compared with TXS0102DCUR and MAX4617EUA+, the NX3L2T66GD,125 delivers significantly lower ON resistance, wider temperature support, and certified ESD protection on switch terminals - making it optimal for compact, battery-powered devices requiring high-fidelity analog signal integrity and robust field operation.
Availability
NX3L2T66GD,125 is available at Aetrix Electronics and suitable for smartphone audio routing, portable media player signal switching, PDA touchscreen interface multiplexing, and wearable biometric sensor hub applications requiring stable component supply across industrial temperature grades.
Supply support for NX3L2T66GD,125 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and mobile markets.
The NX3L2T66GD,125 belongs to NXP's NX3L low-voltage analog switch family, engineered specifically for space-constrained portable electronics that demand rail-to-rail analog performance, ultra-low power, and robust ESD immunity without external level translation.
FAQ
What is the maximum analog signal voltage the NX3L2T66GD,125 can switch?
The NX3L2T66GD,125 supports analog signals from 0 V to VCC across its Y and Z terminals. With a maximum supply voltage of 4.3 V, it can reliably switch signals up to 4.3 V peak-to-peak in either direction. The absolute maximum switch voltage is VCC + 0.5 V (4.6 V at 4.3 V supply), but operation beyond VCC is not recommended for signal integrity or reliability.
Does the NX3L2T66GD,125 require external level translation when driven by a 1.8 V microcontroller?
No. The NX3L2T66GD,125 features Schmitt-trigger enable inputs with low VIH thresholds (e.g., 1.3 V typical at VCC = 3.6 V) and accepts control voltages up to 4.6 V - allowing direct 1.8 V logic drive even at VCC = 3.6 V or 4.3 V. This eliminates external level shifters and simplifies interface design in mixed-voltage systems.
What is the thermal performance of the NX3L2T66GD,125 in the XQFN8 package?
The NX3L2T66GD,125 in XQFN8 (SOT902-2) has a total power dissipation limit of 250 mW at Tamb = -40 °C to +125 °C. Above 118 °C, Ptot derates linearly at 7.8 mW/K. Its 1.6 × 1.6 × 0.5 mm body and exposed thermal pad (per SOT902-2 outline) enable efficient heat transfer in thermally dense portable PCB layouts.
How does the NX3L2T66GD,125 achieve low THD in audio applications?
The NX3L2T66GD,125 achieves THD < 0.02 % through ultra-low and flat ON resistance (0.50 Ω typical, 0.13 Ω flatness), symmetric CMOS transmission gate architecture, and optimized channel matching. These characteristics minimize nonlinear distortion and amplitude variation across the audio band (20 Hz–20 kHz) when switching line-level or headphone-drive signals.
Is the NX3L2T66GD,125 pin-compatible with other variants in the NX3L2T66 family?
Yes - the NX3L2T66GD,125 shares identical pinout and footprint with NX3L2T66GM,125 (same XQFN8 package). Both use SOT902-2 mechanical outline and identical terminal mapping (1Z/7, 2Z/3, 1Y/6, 2Y/2, GND/4, 1E/1, 2E/5, VCC/8), enabling drop-in replacement within the same package variant group.
NX3L2T66GD,125 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Switch Circuit:
- SPST - NO
- Multiplexer/Demultiplexer Circuit:
- 1:1
- Number of Circuits:
- 2
- On-State Resistance (Max):
- 750mOhm
- Channel-to-Channel Matching (ΔRon):
- 20mOhm
- Voltage - Supply, Single (V+):
- 1.4V ~ 4.3V
- Voltage - Supply, Dual (V±):
- -
- Switch Time (Ton, Toff) (Max):
- 28ns, 20ns
- -3db Bandwidth:
- 60MHz
- Charge Injection:
- 6pC
- Channel Capacitance (CS(off), CD(off)):
- 35pF
- Current - Leakage (IS(off)) (Max):
- 10nA
- Crosstalk:
- -90dB @ 100kHz
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-XSON, SOT996-2 (2x3)
NX3L2T66GD,125 FAQ
1.How can I place an order for NX3L2T66GD,125 through Aetrix?
Please submit a Request for Quotation (RFQ) for NX3L2T66GD,125 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for NX3L2T66GD,125 reliable?
The price and inventory of NX3L2T66GD,125 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for NX3L2T66GD,125 is usually 5 days.
3.What payment methods are accepted for NX3L2T66GD,125?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for NX3L2T66GD,125 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for NX3L2T66GD,125?
NX3L2T66GD,125 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your NX3L2T66GD,125 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for NX3L2T66GD,125?
For technical support, including NX3L2T66GD,125 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your NX3L2T66GD,125 requirements.
6.How does Aetrix verify that NX3L2T66GD,125 is sourced from the original manufacturer or authorized distributors?
All NX3L2T66GD,125 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that NX3L2T66GD,125 meets industry standards.
7.What is the process for return or replacement of NX3L2T66GD,125?
All NX3L2T66GD,125 units undergo pre-shipment inspection (PSI). If there is an issue with NX3L2T66GD,125, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The NX3L2T66GD,125 part is unused and in its original packaging.
Return procedure for NX3L2T66GD,125:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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