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NXP Semiconductors NX3P1107UKZ
- Part No.:
- NX3P1107UKZ
- Manufacturer:
- NXP Semiconductors
- Package:
- 4-UFBGA, WLCSP
- Datasheet:
-
NX3P1107UKZ.pdf
- Description:
- IC PWR SWITCH P-CHAN 1:1 4WLCSP
- Quantity:
- Payment:
- Shipping:
Inventory:3,194
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Product details
Overview
NX3P1107UKZ from NXP Semiconductors is a logic-controlled high-side load switch built around a low-RON P-channel MOSFET, delivering 1.5 A continuous current at supply voltages from 0.9 V to 3.6 V. It features integrated level translation for 1.2 V control logic compatibility, ultra-low OFF-state leakage (≤2.0 µA), and slew-rate-limited turn-on for inrush current control-ideal for power domain isolation in portable battery-powered systems.
For engineers reviewing the NX3P1107UKZ datasheet, NX3P1107UKZ pinout, NX3P1107UKZ application, or NX3P1107UKZ equivalent, this device supports critical low-voltage system partitioning, battery life extension via ground-current optimization (<2 µA OFF-state), and robust ESD protection (HBM >4000 V, CDM >500 V) in space-constrained WLCSP4 packaging.
Technical Context
The NX3P1107UKZ implements a single high-side switching path with active HIGH enable logic and internal gate drive optimized for low-VIN operation down to 0.9 V. Its level-translated EN input accepts 1.2 V logic even when VIN = 3.6 V, decoupling controller voltage scaling from power rail requirements.
Thermal performance is defined by Rth(j-a) = 84 K/W under standard two-layer PCB conditions, while dynamic behavior includes 70 µs typical enable time and 118 µs turn-off time at 3.3 V, with controlled output transition times (tTLH/tTHL) ensuring stable load sequencing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Range | 0.9 V to 3.6 V - enables direct integration into sub-1.2 V logic domains and multi-rail battery systems without external level shifters. |
| RON @ 3.3 V | 34 mΩ typ - minimizes conduction loss and thermal rise at 1.5 A, supporting >95% efficiency in typical load scenarios. |
| OFF-State Leakage | ≤2.0 µA max - preserves battery charge during sleep modes in always-on subsystems like sensors or real-time clocks. |
| Enable Logic | 1.2 V compatible at 3.6 V VIN - allows use with low-voltage microcontrollers (e.g., 1.2 V I/O banks) without pull-up resistors or translators. |
| ESD Rating | HBM >4000 V, CDM >500 V - meets industrial handling requirements and reduces need for external protection components. |
| Operating Temp | −40 °C to +85 °C - validated for consumer and industrial portable equipment environments without derating. |
| Enable Time | 70 µs typ @ 3.3 V - ensures predictable power-up timing for sequenced subsystem activation. |
Pinout & Package
Package: WLCSP4 (Wafer Level Chip-Scale Package), 0.96 × 0.96 × 0.55 mm, backside coating included - optimized for ultra-compact PCB layouts in mobile and wearable devices.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VOUT | Switch output | High-side switched output node; connects to load; must be decoupled locally to suppress transients during switching. |
| GND | Ground reference | Primary return path for load current and internal circuitry; requires low-impedance connection to PCB ground plane. |
| VIN | Power input | Input supply rail (0.9–3.6 V); feeds internal regulator and MOSFET source; must be filtered per recommended layout. |
| EN | Enable input | Active-HIGH digital control signal; internally level-translated to drive gate; no external pull-up required for 1.2 V logic. |
Key Features
| Feature | Design Value |
|---|---|
| Turn-on slew rate limiting | Controls dV/dt at VOUT to limit inrush current and prevent supply droop during hot-plug or capacitive load activation. |
| Ultra-low ground current | ≤2 µA OFF-state and ≤1 µA ON-state - eliminates parasitic drain paths that compromise battery shelf life in standby. |
| Integrated logic-level translation | EN input accepts 1.2 V logic regardless of VIN up to 3.6 V - removes need for discrete level-shifting circuitry. |
| Thermally enhanced WLCSP | 84 K/W junction-to-ambient thermal resistance - enables 1.5 A operation on standard two-layer boards without heatsinking. |
| High noise immunity | Specified VIH/VIL thresholds with hysteresis margin - prevents false triggering in noisy RF or motor-drive adjacent zones. |
Applications
| Smartphone Power Rail Isolation | Digital Camera Sensor Power Control |
|---|---|
Use Scenario: Isolating camera module power from main SoC rail during sleep to reduce system-wide quiescent current. IC Role / Device Role / Timing Role: High-side power switch enabling/disabling 1.8 V sensor supply under AP control with <100 µs response. Use Value: Extends standby battery life by eliminating 2.0 µA OFF-state leakage across unused peripherals. |
Use Scenario: Sequencing flash LED driver power after image sensor initialization to avoid voltage collapse. IC Role / Device Role / Timing Role: Controlled power delivery with slew-limited turn-on to prevent 100+ mA inrush into 100 µF local capacitance. Use Value: Eliminates need for external RC delay networks or dedicated sequencer ICs. |
| Wireless Headset Battery Management | Portable Medical Monitor Subsystem Enable |
Use Scenario: Enabling Bluetooth radio only during active audio streaming to minimize average current draw. IC Role / Device Role / Timing Role: Low-voltage (1.2 V EN) high-side switch interfacing directly with BLE SoC GPIO without level shifters. Use Value: Reduces BOM count and PCB area versus discrete FET + driver solutions in <3 mm² footprints. |
Use Scenario: Powering ECG front-end analog circuitry only during measurement cycles to meet IEC 60601 leakage limits. IC Role / Device Role / Timing Role: Precision-controlled power switch with guaranteed <2.0 µA OFF-state current for patient-isolated subsystems. Use Value: Meets stringent medical device standby power budgets without custom ASIC development. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-side load switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TI TPS22915YZPR | Lower RON (22 mΩ @ 3.3 V) but requires ≥1.65 V EN logic; no integrated level translation. | Better efficiency at high current, but mandates higher-voltage control logic or external translator. | Select when VIN ≥ 1.65 V and EN logic matches; avoid if using sub-1.4 V controllers. |
| ROHM BD6524HFV-E2 | Wider VIN range (0.8–5.5 V), higher current rating (2 A), but larger DFN package (1.6 × 1.6 mm) and no CDM ESD rating specified. | Suitable for higher-power or wider-input applications where board space permits larger footprint. | Prefer for 5 V rail support or >1.5 A loads; not drop-in due to package and pinout differences. |
Compared with TPS22915YZPR and BD6524HFV-E2, the NX3P1107UKZ uniquely balances ultra-low-voltage control compatibility (1.2 V EN), minimal leakage (≤2 µA), and wafer-level packaging (0.96 mm²) - making it optimal for space- and battery-life-constrained portable designs where logic voltage scaling outpaces power rail evolution.
Availability
NX3P1107UKZ is available at Aetrix Electronics and suitable for smartphone power rail isolation, digital camera sensor control, and portable medical monitor subsystem enable requiring stable component supply across high-mix, low-volume production runs.
Supply support for NX3P1107UKZ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and consumer applications, with leadership in power management and interface ICs.
The NX3P1107UKZ belongs to NXP's NX3P family of ultra-low-voltage load switches, designed specifically to address power domain control challenges in next-generation battery-powered portable electronics.
FAQ
What is the maximum continuous current rating for the NX3P1107UKZ?
The NX3P1107UKZ supports 1.5 A of continuous current at ambient temperatures up to +85 °C, verified under recommended operating conditions with proper PCB thermal design. Derating applies above 85 °C ambient or with elevated junction temperature; the absolute maximum switch current is ±1500 mA per limiting values table.
Does the NX3P1107UKZ require an external pull-up resistor on the EN pin?
No, the NX3P1107UKZ does not require an external pull-up resistor on the EN pin. Its integrated level translation circuitry accepts 1.2 V logic inputs directly-even when VIN is at 3.6 V-and specifies VIH thresholds as low as 0.8 V across the full supply range, enabling reliable operation with open-drain or low-voltage GPIOs.
What is the OFF-state leakage current specification for the NX3P1107UKZ?
The NX3P1107UKZ specifies a maximum OFF-state leakage current (IS(OFF)) of 2.0 µA at VIN = 3.6 V, VEN = GND, and VOUT = GND or 3.6 V, measured over the full −40 °C to +85 °C temperature range. Typical value is 0.1 µA at 25 °C, supporting ultra-low-power battery retention.
Can the NX3P1107UKZ operate from a 0.9 V supply rail?
Yes, the NX3P1107UKZ is fully specified to operate from 0.9 V to 3.6 V. At 0.9 V VIN, its RON is 105–140 mΩ (typ/max), enabling use in emerging ultra-low-voltage subsystems such as sub-1 V memory rails or energy-harvesting interfaces where traditional load switches fail to function.
What package type and dimensions does the NX3P1107UKZ use?
The NX3P1107UKZ uses the WLCSP4 (Wafer Level Chip-Scale Package) with dimensions 0.96 mm × 0.96 mm × 0.55 mm and backside coating. It has four bumps arranged in a 2×2 array (A1/VOUT, B1/GND, A2/VIN, B2/EN), matching JEDEC MO-255 standards for automated assembly and minimal PCB footprint.
NX3P1107UKZ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 4-UFBGA, WLCSP
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Switch Type:
- General Purpose
- Number of Outputs:
- 1
- Ratio - Input:Output:
- 1:1
- Output Configuration:
- High Side
- Output Type:
- P-Channel
- Interface:
- On/Off
- Voltage - Load:
- 0.9V ~ 3.6V
- Voltage - Supply (Vcc/Vdd):
- Not Required
- Current - Output (Max):
- 1.5A
- Rds On (Typ):
- 34mOhm
- Input Type:
- -
- Features:
- Slew Rate Controlled
- Fault Protection:
- -
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 4-WLCSP (0.96x0.96)
NX3P1107UKZ FAQ
1.How can I place an order for NX3P1107UKZ through Aetrix?
Please submit a Request for Quotation (RFQ) for NX3P1107UKZ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for NX3P1107UKZ reliable?
The price and inventory of NX3P1107UKZ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for NX3P1107UKZ is usually 5 days.
3.What payment methods are accepted for NX3P1107UKZ?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for NX3P1107UKZ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for NX3P1107UKZ?
NX3P1107UKZ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your NX3P1107UKZ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for NX3P1107UKZ?
For technical support, including NX3P1107UKZ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your NX3P1107UKZ requirements.
6.How does Aetrix verify that NX3P1107UKZ is sourced from the original manufacturer or authorized distributors?
All NX3P1107UKZ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that NX3P1107UKZ meets industry standards.
7.What is the process for return or replacement of NX3P1107UKZ?
All NX3P1107UKZ units undergo pre-shipment inspection (PSI). If there is an issue with NX3P1107UKZ, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The NX3P1107UKZ part is unused and in its original packaging.
Return procedure for NX3P1107UKZ:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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