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NXP Semiconductors NX3P190UK,012
- Part No.:
- NX3P190UK,012
- Manufacturer:
- NXP Semiconductors
- Package:
- -
- Datasheet:
-
NX3P190UK,012.pdf
- Description:
- IC PWR SWITCH HI SIDE LOG 4WLCSP
- Quantity:
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- Shipping:
Inventory:316,670
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Product details
Overview
NX3P190UK,012 from NXP Semiconductors is a logic-controlled high-side load switch built with a P-channel MOSFET, delivering 500 mA continuous current at 1.1 V–3.6 V supply, ultra-low shutdown current (≤2 µA), and 95 mΩ typical RON at 1.8 V - used for power domain isolation in portable battery-powered systems to minimize quiescent loss and extend runtime.
For engineers reviewing the NX3P190UK,012 datasheet, NX3P190UK,012 pinout, NX3P190UK,012 application, or NX3P190UK,012 equivalent, key selection criteria include input voltage compatibility (1.1–3.6 V), enable logic level translation (1.2 V control at 3.6 V VIN), thermal resistance (130 K/W), ESD robustness (4 kV HBM), and WLCSP4 package constraints for space-constrained PCB layouts.
Technical Context
The NX3P190UK,012 integrates level-shifted enable logic to accept low-voltage control signals (e.g., 1.2 V) while operating up to 3.6 V on VIN, eliminating external level translators. Its internal slew-rate control limits inrush current during turn-on, reducing stress on upstream power sources and downstream capacitance.
It features a dedicated pull-down resistor (4 MΩ) on EN to ensure defined OFF-state behavior, and its ground current remains ≤2 µA across full temperature range (−40 °C to +85 °C), enabling reliable deep-sleep operation in always-on subsystems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage Range | 1.1 V to 3.6 V - supports direct interface with modern low-voltage processors and battery discharge profiles down to 1.1 V. |
| RON (Typical) | 95 mΩ at 1.8 V - enables <100 mV dropout at 500 mA load, minimizing power loss and heat generation. |
| Continuous Output Current | 500 mA at Tamb = 85 °C - rated for sustained operation in thermally constrained handheld devices. |
| Shutdown Ground Current | ≤2 µA - preserves battery life during system sleep modes without requiring additional power-gating circuitry. |
| Enable Logic Threshold | 1.2 V HIGH-level input at 3.6 V VIN - allows direct connection to 1.2 V/1.8 V GPIOs without external biasing. |
| ESD Rating | 4000 V HBM (JESD22-A114F Class 3A) - meets IEC 61000-4-2 system-level robustness requirements for consumer interfaces. |
| Operating Temperature | −40 °C to +85 °C - qualified for commercial and industrial portable equipment environments. |
Pinout & Package
Package: WLCSP4 - wafer-level chip-scale package, 0.76 mm × 0.76 mm × 0.51 mm body with backside coating; 4-bump layout optimized for minimal PCB footprint and thermal performance on two-layer boards.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VIN (A1) | Input voltage supply | High-side power rail input; accepts 1.1–3.6 V; must be decoupled locally to suppress switching transients. |
| EN (B1) | Active-HIGH enable input | Logic-controlled switch activation; includes integrated 4 MΩ pull-down for default-OFF safety; supports 1.2 V logic at full VIN range. |
| VOUT (A2) | Switched output | Delivers regulated VIN (minus RON drop) to load; requires local output capacitance to manage inrush and stabilize downstream rails. |
| GND (B2) | Ground reference | 0 V return path for internal circuitry and load current; must connect directly to low-impedance ground plane for thermal and EMI performance. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated level-shifting enable logic | Accepts 1.2 V control signal even when VIN = 3.6 V - eliminates need for external level translator IC or resistor divider. |
| Slew-rate controlled turn-on | Enables soft-start behavior with ~2.5 µs enable time (at 1.8 V) - limits peak inrush current into large load capacitances. |
| Ultra-low ground current | ≤2 µA max over −40 °C to +85 °C - ensures negligible battery drain during standby, critical for multi-week shelf life in IoT sensors. |
| Robust ESD protection | HBM 4000 V / CDM 500 V - exceeds JEDEC standards for handling and board-level reliability without added TVS diodes. |
| Thermally optimized WLCSP | Rth(j-a) = 130 K/W on 2-layer PCB - enables >500 mA operation without heatsinking in compact mobile form factors. |
Applications
| Smartphone Power Rail Switching | Digital Camera Sensor Power Gating |
|---|---|
Use Scenario: Isolating camera module power during idle periods to reduce system-wide leakage. IC Role / Device Role / Timing Role: High-side power switch controlling VDD_IO rail to image sensor and ISP, activated only during capture sequences. Use Value: Reduces standby current by >1.8 µA per switched rail, extending battery life between shots without firmware complexity. |
Use Scenario: Enabling/disabling audio codec power in response to voice-command detection events. IC Role / Device Role / Timing Role: Load switch managing VDD_AU rail, synchronized with wake-up interrupt from low-power DSP core. Use Value: Achieves sub-µA retention in audio subsystem while maintaining fast (<3 µs) wake-up latency for responsive voice UI. |
| Wireless Headset Battery Management | Portable Medical Monitor Power Domains |
Use Scenario: Separating Bluetooth SoC power domain from charging circuitry to prevent backfeed during USB insertion. IC Role / Device Role / Timing Role: Reverse-current blocking high-side switch placed between battery and BT SoC VDD. Use Value: Eliminates need for external Schottky diode; maintains <100 mV dropout at 300 mA while consuming zero quiescent current in OFF state. |
Use Scenario: Independently powering ECG front-end analog circuitry only during measurement cycles. IC Role / Device Role / Timing Role: Precision power gate ensuring clean, noise-free analog supply startup with controlled dV/dt. Use Value: Prevents digital switching noise coupling into sensitive analog paths via controlled ramp-up and low RON conduction. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-side load switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TI TPS22915YZPR | Lower RON (50 mΩ @ 3.3 V) but higher shutdown current (1.5 µA typ); no integrated level shift - requires ≥1.4 V EN drive at 3.6 V VIN. | Better for high-efficiency 3.3 V domains; unsuitable where 1.2 V GPIO control is mandatory. | Select if RON priority outweighs logic-level flexibility and ultra-low IQ. |
| ROHM BD65240GUL | Wider voltage range (0.8–5.5 V); higher max current (1 A); larger DFN package (1.2 × 1.2 mm); no CDM ESD rating published. | Fits higher-power wearables; requires PCB area increase and lacks documented CDM robustness for automated assembly. | Choose for >500 mA loads or sub-1.1 V battery cutoff support, accepting larger footprint and unverified CDM performance. |
Compared with TPS22915YZPR and BD65240GUL, the NX3P190UK,012 uniquely balances ultra-low shutdown current, integrated level shifting, and WLCSP4 size - making it optimal for space- and battery-life-critical 1.2–1.8 V control domains in premium portable electronics.
Availability
NX3P190UK,012 is available at Aetrix Electronics and suitable for smartphone power rail switching, digital camera sensor power gating, and wireless headset battery management requiring stable component supply, long-lifecycle availability, and consistent wafer-level packaging.
Supply support for NX3P190UK,012 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and consumer applications.
The NX3P190UK,012 belongs to NXP's NX3P family of ultra-low-power load switches, designed specifically for battery-operated portable electronics where minimal quiescent current, small footprint, and logic-level compatibility are primary system constraints.
FAQ
What is the maximum continuous current rating for the NX3P190UK,012 at 85 °C ambient?
The NX3P190UK,012 is rated for 500 mA continuous output current at Tamb = 85 °C, as specified in Table 5 (Limiting Values) and confirmed under Recommended Operating Conditions. This rating assumes proper PCB thermal design per NXP's guidance - including solid copper connections and use of inner-layer heat spreaders - to maintain junction temperature within 125 °C limit.
Does the NX3P190UK,012 support reverse-current blocking?
Yes, the NX3P190UK,012 provides inherent reverse-current blocking due to its P-channel MOSFET architecture. When disabled (EN = LOW), the body diode is reverse-biased, preventing current flow from VOUT to VIN. This eliminates the need for an external blocking diode in battery-backup or dual-rail isolation configurations.
Can the NX3P190UK,012 be used with a 1.2 V microcontroller GPIO driving the EN pin?
Yes - the NX3P190UK,012 supports 1.2 V logic-high input on EN across its full 1.1–3.6 V VIN range, as verified in Table 8 (Static Characteristics). At VIN = 3.6 V, VIH is guaranteed ≤1.2 V, enabling direct interface with 1.2 V or 1.8 V I/O without level-shifting components.
What is the thermal resistance (Rth(j-a)) of the NX3P190UK,012 under standard PCB conditions?
The NX3P190UK,012 has a typical junction-to-ambient thermal resistance of 130 K/W when mounted on a two-layer PCB with optimized copper pour, as stated in Table 7. This value assumes all four bumps are soldered to adequate Cu areas and vias connect to internal ground/power planes - critical for sustaining 500 mA at elevated ambient temperatures.
Is the NX3P190UK,012 qualified for automotive applications?
No - the NX3P190UK,012 is specified for −40 °C to +85 °C operation and carries no AEC-Q200 qualification. NXP explicitly states in Section 17.3 that non-automotive qualified products like the NX3P190UK,012 are not tested or warranted for automotive use, and inclusion in such systems voids standard warranty coverage.
NX3P190UK,012 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- -
- Series:
- *
- Packaging:
- Bulk
- Product Status:
- Active
- Switch Type:
- -
- Number of Outputs:
- -
- Ratio - Input:Output:
- -
- Output Configuration:
- -
- Output Type:
- -
- Interface:
- -
- Voltage - Load:
- -
- Voltage - Supply (Vcc/Vdd):
- -
- Current - Output (Max):
- -
- Rds On (Typ):
- -
- Input Type:
- -
- Features:
- -
- Fault Protection:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
NX3P190UK,012 FAQ
1.How can I place an order for NX3P190UK,012 through Aetrix?
Please submit a Request for Quotation (RFQ) for NX3P190UK,012 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for NX3P190UK,012 reliable?
The price and inventory of NX3P190UK,012 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for NX3P190UK,012 is usually 5 days.
3.What payment methods are accepted for NX3P190UK,012?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for NX3P190UK,012 transactions.
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4.How is shipping managed for NX3P190UK,012?
NX3P190UK,012 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your NX3P190UK,012 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for NX3P190UK,012?
For technical support, including NX3P190UK,012 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your NX3P190UK,012 requirements.
6.How does Aetrix verify that NX3P190UK,012 is sourced from the original manufacturer or authorized distributors?
All NX3P190UK,012 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that NX3P190UK,012 meets industry standards.
7.What is the process for return or replacement of NX3P190UK,012?
All NX3P190UK,012 units undergo pre-shipment inspection (PSI). If there is an issue with NX3P190UK,012, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The NX3P190UK,012 part is unused and in its original packaging.
Return procedure for NX3P190UK,012:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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