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NXP Semiconductors NX3P191UK,023
- Part No.:
- NX3P191UK,023
- Manufacturer:
- NXP Semiconductors
- Package:
- -
- Datasheet:
-
NX3P191UK,023.pdf
- Description:
- SPST, 1 FUNC, 1 CHANNEL, PBGA4
- Quantity:
- Payment:
- Shipping:
Inventory:9,000
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Product details
Overview
NX3P191UK,023 from NXP Semiconductors is a logic-controlled high-side load switch featuring a P-channel MOSFET with 95 mΩ typical ON resistance at 1.8 V supply, integrated output discharge (280 Ω), and 1.1 V to 3.6 V operation. It delivers 500 mA continuous current, supports inrush current limiting, and enables power domain isolation in portable battery-powered systems.
For engineers reviewing the NX3P191UK,023 datasheet, NX3P191UK,023 pinout, NX3P191UK,023 application, or NX3P191UK,023 equivalent, key selection criteria include ultra-low shutdown current (≤2 μA), level-shifted enable logic for 1.2 V control at 3.6 V VIN, thermal resistance (130 K/W), and WLCSP4 package compatibility with space-constrained mobile designs.
Technical Context
The NX3P191UK,023 implements a high-side switching architecture using a P-channel MOSFET with slew-rate-limited turn-on to suppress inrush current. Its internal level shifter allows EN input to operate at voltages as low as 1.2 V while VIN ranges up to 3.6 V.
Functional behavior is defined by active-HIGH enable logic, integrated 280 Ω output discharge path, and OFF-state leakage ≤2 μA across −40 °C to +85 °C. Thermal performance is specified with Rth(j-a) = 130 K/W under standard two-layer PCB conditions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage Range | 1.1 V to 3.6 V - Enables direct interface with low-voltage processors and battery rails down to single-cell Li-ion or alkaline. |
| ON Resistance (RON) | 95 mΩ typ @ 1.8 V - Minimizes conduction loss and voltage drop under 500 mA load, critical for efficiency in portable devices. |
| Continuous Output Current | 500 mA @ Tamb = 85 °C - Supports sustained power delivery to peripherals like cameras, audio codecs, or sensors without thermal derating. |
| Shutdown Current | ≤2 μA max - Extends battery life in standby mode for always-on subsystems in smartphones and wearables. |
| Output Discharge Resistance | 280 Ω - Ensures rapid VOUT discharge (<1 ms for 10 μF) upon disable, preventing floating outputs and enabling safe sequencing. |
| Enable Logic Threshold | 1.2 V min HIGH-level input @ 3.6 V VIN - Allows direct connection to 1.2 V/1.8 V I/O domains without external level shifters. |
| Operating Temperature | −40 °C to +85 °C - Qualified for consumer and industrial portable equipment environments. |
Pinout & Package
Package: WLCSP4 - Wafer-level chip-scale package, 0.76 × 0.76 × 0.51 mm body with backside coating; 4-bump layout optimized for minimal PCB footprint and thermal performance.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VIN | Input voltage supply | High-side power rail input (1.1–3.6 V); connects to battery or regulated source upstream of the switch. |
| EN | Enable input (active HIGH) | Logic-controlled gate driver input; accepts 1.2 V min HIGH signal even at 3.6 V VIN due to integrated level shift. |
| VOUT | Switched output | Drives load; features internal 280 Ω discharge path to GND when EN = LOW, eliminating need for external bleed resistor. |
| GND | Ground reference | 0 V return path for internal circuitry and discharge current; must be solidly connected to PCB ground plane for thermal and EMI performance. |
Key Features
| Feature | Design Value |
|---|---|
| Input inrush current reduction | Slew-rate-limited turn-on prevents peak current spikes during power-up, protecting upstream regulators and reducing EMI. |
| Integrated output discharge | 280 Ω internal resistor actively discharges VOUT capacitance on disable, ensuring fast, predictable power-down sequencing. |
| Ultra-low ground current | ≤2 μA max in shutdown - Directly extends battery runtime in sleep states for mobile and IoT endpoints. |
| Logic-level translation | EN input compatible with 1.2 V logic at full 3.6 V VIN - Eliminates external level-shifting components in mixed-voltage SoC designs. |
| ESD robustness | HBM >4000 V, CDM >500 V - Meets JEDEC standards for handling and board-level reliability in handheld assembly lines. |
Applications
| Smartphone Power Management | Digital Camera Module Supply |
|---|---|
Use Scenario: Isolating camera sensor and ISP power domains during standby to minimize system-wide leakage. IC Role / Device Role / Timing Role: High-side load switch controlling VDD_IO and VDD_ANA rails; activated only during image capture or preview. Use Value: Reduces idle current by >95% versus always-on LDOs, extending battery life between shots without compromising wake latency. |
Use Scenario: Enabling/disabling flash LED driver IC and image sensor bias supplies in compact digital cameras. IC Role / Device Role / Timing Role: Sequenced power switch for analog front-end and flash control; synchronized with shutter command. Use Value: Prevents cross-conduction and ensures clean power ramp-up/down, avoiding sensor reset glitches or flash misfire. |
| Wireless Headset Audio Codec | Portable Medical Sensor Hub |
Use Scenario: Powering Bluetooth audio codec and DAC only during active playback or call mode. IC Role / Device Role / Timing Role: Load switch for audio subsystem rail; controlled by baseband processor GPIO with 1.2 V logic. Use Value: Achieves sub-μA off-state leakage, enabling multi-week shelf life and rapid resume from deep sleep without capacitor recharge delay. |
Use Scenario: Isolating ECG/PPG analog front-end and BLE radio during measurement intervals and sleep cycles. IC Role / Device Role / Timing Role: Precision power gate for low-noise analog section; coordinated with ADC sampling trigger. Use Value: Eliminates ground bounce and supply coupling between digital and analog sections, preserving signal integrity below 1 μV RMS noise floor. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-side load switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TI TPS22915YZPR | Lower RON (60 mΩ @ 3.3 V) but no integrated discharge resistor; requires external 100 kΩ pull-down on EN for 1.2 V logic compatibility. | Better efficiency at higher loads (>700 mA), but adds BOM cost and layout area for discharge and level-shift components. | Prefer when maximum current capability and lowest conduction loss outweigh integration benefits and board space constraints. |
| ROHM BD65240GUL | WLCSP4 package, 105 mΩ RON @ 1.8 V, includes discharge resistor (300 Ω), but lacks level-shifted EN - requires ≥1.4 V logic at 3.6 V VIN. | Direct replacement in space-limited designs where 1.4 V EN threshold is acceptable, but not suitable for 1.2 V controller interfaces. | Select when footprint and discharge integration are critical, and host processor I/O supports ≥1.4 V logic levels. |
Compared with TPS22915YZPR and BD65240GUL, the NX3P191UK,023 uniquely combines 1.2 V-compatible EN logic, integrated 280 Ω discharge, and 95 mΩ RON in a 0.76 mm² WLCSP4, making it optimal for ultra-compact, multi-rail battery-powered systems requiring zero-external-component sequencing.
Availability
NX3P191UK,023 is available at Aetrix Electronics and suitable for smartphone power management, digital camera module supply, wireless headset audio codec, and portable medical sensor hub applications requiring stable component supply, long-term lifecycle support, and wafer-level packaging consistency.
Supply support for NX3P191UK,023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and consumer markets.
The NX3P191UK,023 belongs to NXP's NX3P family of ultra-small, low-voltage load switches designed specifically for power domain isolation in space- and power-constrained portable electronics.
FAQ
What is the maximum continuous current rating for the NX3P191UK,023?
The NX3P191UK,023 supports 500 mA continuous output current at an ambient temperature of 85 °C, as specified in Table 5 of the datasheet. At 25 °C, it can handle up to ±1000 mA transient current, but sustained operation above 500 mA requires thermal derating per the device's Rth(j-a) = 130 K/W specification and PCB layout optimization.
Does the NX3P191UK,023 require an external discharge resistor?
No, the NX3P191UK,023 includes an integrated 280 Ω output discharge resistor connected between VOUT and GND. This eliminates the need for external components to safely discharge output capacitance during disable, simplifying design and reducing BOM count in space-sensitive applications.
Can the NX3P191UK,023 be controlled directly by a 1.2 V GPIO?
Yes - the NX3P191UK,023 features integrated logic-level translation on its EN pin, allowing reliable HIGH-level detection at 1.2 V even when VIN is at the maximum 3.6 V. This is confirmed in Table 8 (VIH specifications) and enables direct interfacing with low-voltage processors without external level shifters.
What is the typical ON resistance of the NX3P191UK,023 at 1.8 V supply?
The typical ON resistance of the NX3P191UK,023 is 95 mΩ at VIN = 1.8 V, Tamb = 25 °C, and ILOAD = 200 mA, as stated in Table 9. This value increases to 110 mΩ at 1.5 V and 150 mΩ at 1.2 V, reflecting the P-channel MOSFET's voltage-dependent RDS(on) behavior.
Is the NX3P191UK,023 qualified for automotive applications?
No - the NX3P191UK,023 is specified for −40 °C to +85 °C operation and is not automotive-qualified. NXP explicitly states in Section 17.3 that unless otherwise declared, their products are not suitable for automotive use. For AEC-Q100-compliant alternatives, consult NXP's automotive-grade load switch portfolio.
What package type does the NX3P191UK,023 use, and what are its dimensions?
The NX3P191UK,023 uses the WLCSP4 (Wafer-Level Chip-Scale Package) with 4 bumps, measuring 0.76 mm × 0.76 mm × 0.51 mm including backside coating. Pin mapping follows a 2×2 bump array: A1 = VIN, B1 = EN, A2 = VOUT, B2 = GND - as shown in Figure 4 and Table 3 of the datasheet.
NX3P191UK,023 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- -
- Series:
- *
- Packaging:
- Bulk
- Product Status:
- Active
- Switch Type:
- -
- Number of Outputs:
- -
- Ratio - Input:Output:
- -
- Output Configuration:
- -
- Output Type:
- -
- Interface:
- -
- Voltage - Load:
- -
- Voltage - Supply (Vcc/Vdd):
- -
- Current - Output (Max):
- -
- Rds On (Typ):
- -
- Input Type:
- -
- Features:
- -
- Fault Protection:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
NX3P191UK,023 FAQ
1.How can I place an order for NX3P191UK,023 through Aetrix?
Please submit a Request for Quotation (RFQ) for NX3P191UK,023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for NX3P191UK,023 reliable?
The price and inventory of NX3P191UK,023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for NX3P191UK,023 is usually 5 days.
3.What payment methods are accepted for NX3P191UK,023?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for NX3P191UK,023 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for NX3P191UK,023?
NX3P191UK,023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your NX3P191UK,023 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for NX3P191UK,023?
For technical support, including NX3P191UK,023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your NX3P191UK,023 requirements.
6.How does Aetrix verify that NX3P191UK,023 is sourced from the original manufacturer or authorized distributors?
All NX3P191UK,023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that NX3P191UK,023 meets industry standards.
7.What is the process for return or replacement of NX3P191UK,023?
All NX3P191UK,023 units undergo pre-shipment inspection (PSI). If there is an issue with NX3P191UK,023, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The NX3P191UK,023 part is unused and in its original packaging.
Return procedure for NX3P191UK,023:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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