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NXP Semiconductors NX3V1G66GM,115

Part No.:
NX3V1G66GM,115
Manufacturer:
NXP Semiconductors
Category:
Analog Switches, Multiplexers, Demultiplexers
Package:
6-XFDFN
Datasheet:
AetrixNX3V1G66GM,115.pdf
Description:
IC SW SPST-NOX1 450MOHM 6XSON
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,299

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Product details

Overview

NX3V1G66GM,115 from NXP Semiconductors is a low-ohmic SPST analog switch in XSON6 package, operating from 1.4 V to 4.3 V supply, featuring 0.25 Ω typical ON resistance at 2.7 V and 4.3 V, Schmitt-trigger enable input (E), and bidirectional signal routing between Y and Z terminals. It delivers minimal signal attenuation in portable audio paths and high-fidelity sensor interfaces.

For engineers reviewing the NX3V1G66GM,115 datasheet, NX3V1G66GM,115 pinout, NX3V1G66GM,115 application, or NX3V1G66GM,115 equivalent, this device is selected for ultra-low RON, high ESD robustness (6 kV IEC contact), and operation across −40 °C to +125 °C - critical for space-constrained battery-powered systems requiring rail-to-rail analog switching.

Technical Context

The NX3V1G66GM,115 implements a CMOS transmission gate architecture with Schmitt-triggered enable logic, enabling reliable switching even with slow-rising control signals. Its flat RON (0.1 Ω typical) ensures consistent signal integrity across input voltage swing (0 V to VCC) and temperature (−40 °C to +125 °C).

Designed for bidirectional analog signal routing, it supports continuous 500 mA switch current at 3.3 V, exhibits −90 dB OFF-state isolation at 100 kHz, and maintains <0.01% THD at 20 Hz–20 kHz with 2 Vp-p input under 2.7 V+ supply - confirming suitability for audio and precision sensor front-ends.

Key Specifications

Parameter Value and Actual Design Meaning
Supply Voltage Range 1.4 V to 4.3 V - enables direct interface with 1.8 V, 2.5 V, 3.3 V, and 4.2 V battery rails without level shifting
Typical ON Resistance 0.25 Ω at VCC = 2.7 V and 4.3 V - minimizes insertion loss and thermal drift in high-current analog paths
ON Resistance Flatness 0.1 Ω typical - ensures uniform gain/attenuation across full signal swing (0 V to VCC)
ESD Robustness 6 kV IEC 61000-4-2 contact discharge on switch ports - eliminates need for external TVS in handheld ESD-prone interfaces
Switching Speed 15 ns enable time (ten) at VCC ≥ 2.7 V - supports fast multiplexing in real-time sensor sampling and audio channel selection
Operating Temperature −40 °C to +125 °C - qualified for extended industrial and automotive cabin-adjacent applications
THD @ 20 kHz 0.01% at VCC = 2.7 V, 4.3 V with 2 Vp-p input - preserves fidelity in headphone drivers and codec interconnects

Pinout & Package

XSON6 (SOT886) package: plastic extremely thin small outline, no leads, 6 terminals, body size 1.0 × 1.45 × 0.5 mm, pin 1 indicator located on lower-left corner below marking code "dL".

Pin/Terminal Circuit Role Design Meaning
1 (Y) Independent analog I/O Bidirectional signal path - connects to source or load without polarity constraint; supports rail-to-rail voltage (0 V to VCC)
2 (Z) Independent analog I/O Complementary bidirectional port - forms SPST switch path with Y; identical voltage/current handling
3 (GND) Ground reference 0 V return for internal circuitry and switch substrate; must be low-impedance for THD and noise performance
4 (E) Enable input (active HIGH) Schmitt-triggered logic input - tolerates slow edges; valid HIGH from 0.65×VCC (1.4 V) to 0.7×VCC (4.3 V)
5 (n.c.) No connect Internally unconnected terminal - must remain floating; no PCB trace or solder mask required
6 (VCC) Positive supply Power rail for analog switch core and enable logic; decoupling capacitor (100 nF) recommended within 2 mm

Key Features

Feature Design Value
Ultra-low RON flatness 0.1 Ω typical - eliminates amplitude distortion across full audio band and sensor output range
High ESD immunity on switch ports 6 kV IEC 61000-4-2 contact discharge - protects connected codecs, amplifiers, or sensors without external protection
Wide supply compatibility 1.4 V to 4.3 V operation - interoperable with Li-ion (4.2 V), LDO-regulated 3.3 V/2.5 V/1.8 V domains
500 mA continuous switch current Rated at 3.3 V supply - supports high-drive audio outputs and active sensor biasing without derating
−90 dB OFF-state isolation At 100 kHz - prevents crosstalk between adjacent channels in multi-input audio or data acquisition systems

Applications

Smartphone Audio Routing Portable Media Player Headphone Switch

Use Scenario: Selecting between internal speaker, 3.5 mm jack, and Bluetooth codec outputs in compact smartphone PCB layouts.

IC Role / Device Role / Timing Role: Bidirectional SPST analog switch controlling signal path between baseband processor DAC and multiple output transducers.

Use Value: 0.25 Ω RON and 0.01% THD preserve SNR >100 dB; XSON6 footprint (1.0 × 1.45 mm) saves >40% board area vs. TSSOP5 alternatives.

Use Scenario: Enabling/disabling left/right headphone channels independently during mono/stereo mode transitions in MP3 players.

IC Role / Device Role / Timing Role: Low-distortion analog gate isolating DAC outputs from headphone amplifier inputs based on user-selectable audio format.

Use Value: Schmitt-triggered E input ensures clean switching despite noisy system-level GPIO; −90 dB isolation prevents channel bleed during mute transitions.

PDA Touchscreen Signal Multiplexing Wearable Biometric Sensor Interface

Use Scenario: Routing analog touch panel voltage measurements through shared ADC channel while minimizing offset drift and noise coupling.

IC Role / Device Role / Timing Role: Precision analog switch isolating resistive touchscreen X/Y coordinate sense lines from measurement circuitry during idle periods.

Use Value: 0.1 Ω RON flatness prevents differential gain error; 6 kV ESD rating withstands repeated finger contact discharge events.

Use Scenario: Connecting photodiode or ECG electrode signals to low-noise instrumentation amplifier in ultra-thin fitness bands.

IC Role / Device Role / Timing Role: Rail-to-rail analog switch enabling dynamic reconfiguration of sensor front-end gain paths without signal clipping.

Use Value: 1.4 V minimum supply allows direct use with coin-cell (1.5 V) or energy-harvesting power sources; 500 mA rating supports LED driver biasing in optical HRM modules.

Equivalent & Alternatives

The following parts are listed as comparable options for similar analog switch applications.

Alternative Part Technical Difference Application Difference Selection Advice
TS5A23157DCUR 0.9 Ω typical RON at 3.3 V; 5-pin SOT-23 package; no Schmitt trigger on enable Limited to ≤3.6 V supply; higher RON increases insertion loss in audio paths Select when cost sensitivity outweighs THD and ESD requirements; verify GPIO slew rate compatibility
ADG801BRMZ 0.3 Ω typical RON at 3 V; −40 °C to +125 °C; 6-lead SOT-23 package; 1.8 V min supply Lower ESD rating (2 kV HBM); larger 2.9 × 1.6 mm footprint vs. XSON6's 1.0 × 1.45 mm Prefer for legacy SOT-23 assembly lines; accept trade-off in board area and ESD margin for known ADI supply chain

Compared with TS5A23157DCUR and ADG801BRMZ, the NX3V1G66GM,115 offers the lowest RON flatness (0.1 Ω), smallest footprint (1.0 × 1.45 mm), and highest switch-port ESD rating (6 kV IEC contact), making it optimal for next-generation portable devices where signal fidelity, miniaturization, and field reliability are co-prioritized.

Availability

NX3V1G66GM,115 is available at Aetrix Electronics and suitable for smartphone audio routing, portable media player headphone switching, PDA touchscreen multiplexing, and wearable biometric sensor interfacing requiring stable component supply across industrial and consumer production cycles.

Supply support for NX3V1G66GM,115 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and mobile applications.

The NX3V1G66GM,115 belongs to NXP's NX3 family of ultra-low-RON analog switches, engineered specifically for high-fidelity signal routing in space-constrained portable electronics with stringent ESD and thermal requirements.

FAQ

What is the maximum continuous current rating for NX3V1G66GM,115?

The NX3V1G66GM,115 supports 500 mA continuous switch current when operated at 3.3 V supply voltage, as specified in the Absolute Maximum Ratings table. This rating applies to both Y and Z terminals under DC conditions with proper PCB thermal relief; pulsed current up to 750 mA is allowed at ≤10% duty cycle and 1 ms pulse width.

Does NX3V1G66GM,115 support rail-to-rail analog signal switching?

Yes, the NX3V1G66GM,115 allows signals with amplitude up to VCC to be transmitted bidirectionally between Y and Z terminals. Its CMOS transmission gate architecture ensures full rail-to-rail operation (0 V to VCC) without clipping or distortion, validated across the full −40 °C to +125 °C temperature range.

What is the purpose of the Schmitt trigger on the enable pin (E) of NX3V1G66GM,115?

The Schmitt trigger on the E pin of NX3V1G66GM,115 provides hysteresis (typically 0.3×VCC) to reject noise and tolerate slow input rise/fall times up to 200 ns/V. This eliminates false switching caused by GPIO bounce or long PCB traces, ensuring deterministic ON/OFF state transitions even with marginal control signals.

Can NX3V1G66GM,115 be used with a 1.5 V supply?

Yes, NX3V1G66GM,115 is fully specified down to 1.4 V supply voltage. At 1.5 V, it delivers 0.8 Ω typical ON resistance and maintains −90 dB OFF-state isolation, enabling use in ultra-low-power applications such as coin-cell-powered wearables or energy-harvesting sensor nodes where traditional 1.8 V switches fail to operate.

How does the XSON6 package of NX3V1G66GM,115 impact thermal performance?

The XSON6 (SOT886) package of NX3V1G66GM,115 features a 1.0 × 1.45 mm body with 0.5 mm height and thermal pad-less construction. Its total power dissipation is rated at 250 mW up to +125 °C ambient, with linear derating above 118 °C (7.8 mW/K). For 500 mA switching at 3.3 V, junction temperature rise remains within safe limits when mounted on standard 2-layer FR4 with 25 mm² copper pour.

NX3V1G66GM,115 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
-
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Switch Circuit:
SPST - NO
Multiplexer/Demultiplexer Circuit:
1:1
Number of Circuits:
1
On-State Resistance (Max):
450mOhm
Channel-to-Channel Matching (ΔRon):
-
Voltage - Supply, Single (V+):
1.4V ~ 4.3V
Voltage - Supply, Dual (V±):
-
Switch Time (Ton, Toff) (Max):
24ns, 9ns
-3db Bandwidth:
25MHz
Charge Injection:
12pC
Channel Capacitance (CS(off), CD(off)):
70pF
Current - Leakage (IS(off)) (Max):
10nA
Crosstalk:
-
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
6-XSON, SOT886 (1.45x1)

NX3V1G66GM,115 FAQ

1.How can I place an order for NX3V1G66GM,115 through Aetrix?

Please submit a Request for Quotation (RFQ) for NX3V1G66GM,115 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for NX3V1G66GM,115 reliable?

The price and inventory of NX3V1G66GM,115 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for NX3V1G66GM,115 is usually 5 days.

3.What payment methods are accepted for NX3V1G66GM,115?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for NX3V1G66GM,115 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for NX3V1G66GM,115?

NX3V1G66GM,115 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your NX3V1G66GM,115 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for NX3V1G66GM,115?

For technical support, including NX3V1G66GM,115 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your NX3V1G66GM,115 requirements.

6.How does Aetrix verify that NX3V1G66GM,115 is sourced from the original manufacturer or authorized distributors?

All NX3V1G66GM,115 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that NX3V1G66GM,115 meets industry standards.

7.What is the process for return or replacement of NX3V1G66GM,115?

All NX3V1G66GM,115 units undergo pre-shipment inspection (PSI). If there is an issue with NX3V1G66GM,115, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The NX3V1G66GM,115 part is unused and in its original packaging.

Return procedure for NX3V1G66GM,115:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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