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NXP Semiconductors NX3V1T384GM,115

Part No.:
NX3V1T384GM,115
Manufacturer:
NXP Semiconductors
Category:
Analog Switches, Multiplexers, Demultiplexers
Package:
6-XFDFN
Datasheet:
AetrixNX3V1T384GM,115.pdf
Description:
IC SW SPST-NCX1 450MOHM 6XSON
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,316

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Product details

Overview

NX3V1T384GM,115 from NXP Semiconductors is a low-ohmic SPST analog switch in XSON6 package, operating from 1.4 V to 4.3 V supply, featuring 0.25 Ω typical ON resistance at 2.7 V and 4.3 V, Schmitt-trigger enable input (active LOW), and bidirectional signal routing between Y and Z terminals. It enables precision analog path switching in portable audio and data interfaces.

For engineers reviewing the NX3V1T384GM,115 datasheet, NX3V1T384GM,115 pinout, NX3V1T384GM,115 application, or NX3V1T384GM,115 equivalent, key selection criteria include ultra-low RON flatness (0.1 Ω), ±500 mA continuous switch current, −40 °C to +125 °C operation, and IEC61000-4-2 ESD robustness (6 kV contact) on switch ports.

Technical Context

The NX3V1T384GM,115 implements a CMOS transmission gate architecture with Schmitt-trigger action on the active-LOW enable (E) input, ensuring noise immunity against slow-rising/falling control signals. Its bidirectional Y–Z path supports rail-to-rail analog signals up to VCC, with minimal distortion due to ultra-flat ON resistance (0.1 Ω max variation).

Static leakage is tightly controlled: OFF-state leakage ≤ ±500 nA over full temperature range, and supply current ≤ 7 µA at 4.3 V. Dynamic performance includes 5 ns disable time (VCC ≥ 2.7 V) and −90 dB OFF-isolation at 100 kHz, making it suitable for high-fidelity audio and low-noise sensor multiplexing.

Key Specifications

Parameter Value and Actual Design Meaning
Supply Voltage 1.4 V to 4.3 V - Enables direct interface with 1.8 V, 2.5 V, 3.3 V, and 4.3 V logic and analog rails without level shifting.
ON Resistance (Typ) 0.25 Ω at VCC = 2.7 V and 4.3 V - Ensures <0.01% signal attenuation for 100 mA analog paths; critical for precision instrumentation.
ON Resistance Flatness 0.1 Ω - Minimal RON variation across signal swing preserves THD <0.01% at 2.3 V+ supplies.
Switch Current ±500 mA continuous - Supports high-drive applications like speaker switching or battery path control without derating.
ESD Robustness 6 kV IEC61000-4-2 contact discharge on Y/Z ports - Eliminates need for external TVS in handheld device front-end interfaces.
Operating Temperature −40 °C to +125 °C - Qualified for extended industrial and automotive cabin-adjacent environments.
Disable Time 5 ns max at VCC ≥ 2.7 V - Enables fast channel blanking in time-division multiplexed systems (e.g., ADC sampling guards).

Pinout & Package

XSON6 (SOT886) package: plastic extremely thin small outline, no leads, 6-terminal, body size 1.0 × 1.45 × 0.5 mm, thermal pad exposed on bottom (non-electrical), pin 1 indicator in lower-left corner below marking code "eL".

Pin/Terminal Circuit Role Design Meaning
1 (Y) Switch terminal A Bidirectional analog I/O; connects to signal source or load; voltage range: 0 V to VCC.
2 (Z) Switch terminal B Bidirectional analog I/O; complements Y; same voltage and current ratings as Y.
3 (GND) Ground reference 0 V return for internal circuitry and ESD protection network; must be low-impedance.
4 (E) Enable input (active LOW) Schmitt-triggered control; HIGH = switch OFF, LOW = switch ON; accepts voltages > VCC.
5 (n.c.) No connect Internally unconnected; must be left floating or tied to GND per layout best practice.
6 (VCC) Positive supply Power rail for analog switch core and enable logic; decoupling capacitor required within 2 mm.

Key Features

Feature Design Value
Rail-to-rail analog switching Supports signals from GND to VCC without clipping - essential for full-scale audio and sensor outputs.
Ultra-low charge injection 6.5 pC at VCC ≤ 3.3 V - Minimizes glitch-induced offset in precision sample-and-hold and mux-based ADC front-ends.
High OFF-isolation −90 dB at 100 kHz - Prevents crosstalk between adjacent channels in multi-input audio codecs or sensor arrays.
Wide supply compatibility Operates down to 1.4 V - Enables integration into ultra-low-power wearable SoC subsystems with single-cell Li-ion or coin-cell supplies.
Robust ESD on switch ports 6 kV IEC61000-4-2 contact discharge - Allows direct PCB-level connection to USB, headphone, or antenna interfaces without guard traces.

Applications

Smartphone Audio Routing Portable Media Player Signal Mux

Use Scenario: Switching stereo audio paths between headset jack, speaker amplifier, and microphone preamp in space-constrained smartphone PCBs.

IC Role / Device Role / Timing Role: Bidirectional analog switch controlling signal flow between CODEC outputs and transducers; enabled/disabled synchronously with audio subsystem power states.

Use Value: 0.25 Ω RON ensures <0.05% THD at 2 VPP, while 5 ns disable time prevents pop/click during hot-plug detection.

Use Scenario: Multiplexing line-in, FM radio IF, and DAC output to shared headphone driver in MP3 players.

IC Role / Device Role / Timing Role: Low-distortion SPST switch enabling dynamic reconfiguration of analog signal chains under firmware control.

Use Value: 0.1 Ω RON flatness maintains channel matching across 20 Hz–20 kHz, preserving stereo imaging fidelity.

Industrial Sensor Data Acquisition USB-C Accessory Detection

Use Scenario: Scanning multiple thermistor or RTD inputs into a single precision ADC in handheld test equipment.

IC Role / Device Role / Timing Role: Precision analog multiplexer front-end; switched synchronously with ADC conversion trigger to minimize settling error.

Use Value: 6.5 pC charge injection prevents baseline shift in 16-bit+ measurements; −90 dB isolation avoids inter-channel crosstalk.

Use Scenario: Detecting accessory type (audio adapter, dock) by routing CC-line voltage levels to microcontroller GPIO in USB-C devices.

IC Role / Device Role / Timing Role: Low-leakage signal switch isolating CC logic from VCONN and VBUS domains during plug insertion/removal.

Use Value: ±500 nA max OFF-leakage ensures accurate voltage threshold detection; 6 kV ESD protects against user-handling events.

Equivalent & Alternatives

The following parts are listed as comparable options for similar analog switch applications.

Alternative Part Technical Difference Application Difference Selection Advice
TS5A23157DCUR 0.9 Ω typical RON at 3.3 V; 0.5 Ω flatness; no Schmitt trigger on enable; 5-pin SOT-23 package. Limited to ≤85 °C ambient; lower ESD rating (2 kV HBM); unsuitable for 125 °C industrial use cases. Prefer NX3V1T384GM,115 when RON flatness <0.2 Ω and extended temperature are required.
ADG849YKSZ-REEL7 0.35 Ω typical RON at 3 V; 0.15 Ω flatness; 6-pin LFCSP package; higher ICC (2 µA typical). Higher cost; requires solder paste volume control due to thermal pad; no IEC61000-4-2 certification on switch pins. Choose NX3V1T384GM,115 for cost-sensitive, high-volume portable designs needing certified ESD robustness.

Compared with TS5A23157DCUR and ADG849YKSZ-REEL7, the NX3V1T384GM,115 delivers superior RON flatness (0.1 Ω), guaranteed 125 °C operation, and switch-port ESD certification - making it optimal for compact, high-reliability consumer and industrial analog routing where signal integrity and ruggedness are non-negotiable.

Availability

NX3V1T384GM,115 is available at Aetrix Electronics and suitable for smartphone audio routing, portable media player signal multiplexing, industrial sensor data acquisition, and USB-C accessory detection requiring stable component supply across high-mix production runs.

Supply support for NX3V1T384GM,115 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and mobile applications.

The NX3V1G384 family was designed for ultra-low-RON, high-speed analog signal routing in battery-powered portable electronics - prioritizing rail-to-rail operation, minimal distortion, and robust ESD tolerance in sub-2 mm² packages.

FAQ

What is the maximum continuous current rating for the NX3V1T384GM,115?

The NX3V1T384GM,115 supports ±500 mA continuous current through its Y–Z switch path when supplied at 3.3 V, as specified in Table 5 (Limiting Values) of the NXP datasheet Rev. 6. This rating applies across the full −40 °C to +125 °C operating range and enables use in speaker switching and power-path applications without external current limiting.

Does the NX3V1T384GM,115 require external pull-up or pull-down resistors on the enable (E) pin?

No, the NX3V1T384GM,115 does not require external biasing on the E pin because it integrates a Schmitt-trigger input with defined VIH/VIL thresholds across all supply voltages (e.g., VIH = 2.0 V min at VCC = 2.7–3.6 V). The internal hysteresis ensures clean switching even with slow-rising control signals, eliminating need for external RC networks.

Can the NX3V1T384GM,115 pass signals exceeding the VCC rail?

No, the NX3V1T384GM,115 cannot pass signals exceeding VCC or going below GND. Its absolute maximum switch voltage is VCC + 0.5 V (per Table 5), and recommended operating conditions limit VSW to 0 V to VCC. Exceeding this risks latch-up or permanent damage; rail-to-rail operation is supported only within the supply bounds.

What is the thermal pad on the NX3V1T384GM,115 XSON6 package used for?

The exposed thermal pad on the NX3V1T384GM,115 XSON6 (SOT886) package is electrically isolated and intended solely for thermal conduction to the PCB ground plane. It must be soldered to a thermal copper pour using standard reflow profiles; no electrical connection is required or recommended, and it is not internally tied to GND or any other pin.

How does the NX3V1T384GM,115 achieve −90 dB OFF-isolation at 100 kHz?

The NX3V1T384GM,115 achieves −90 dB OFF-isolation at 100 kHz through optimized CMOS transistor sizing, guard-ring layout, and low parasitic capacitance (CS(OFF) = 70 pF). This performance is measured per Figure 19 in the datasheet with RL = 50 Ω and confirms effective signal blocking between Y and Z when the switch is disabled - critical for noise-sensitive audio and RF-adjacent circuits.

NX3V1T384GM,115 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
-
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Switch Circuit:
SPST - NC
Multiplexer/Demultiplexer Circuit:
1:1
Number of Circuits:
1
On-State Resistance (Max):
450mOhm
Channel-to-Channel Matching (ΔRon):
-
Voltage - Supply, Single (V+):
1.4V ~ 4.3V
Voltage - Supply, Dual (V±):
-
Switch Time (Ton, Toff) (Max):
26ns, 10ns
-3db Bandwidth:
25MHz
Charge Injection:
12pC
Channel Capacitance (CS(off), CD(off)):
70pF
Current - Leakage (IS(off)) (Max):
10nA
Crosstalk:
-
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
6-XSON, SOT886 (1.45x1)

NX3V1T384GM,115 FAQ

1.How can I place an order for NX3V1T384GM,115 through Aetrix?

Please submit a Request for Quotation (RFQ) for NX3V1T384GM,115 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for NX3V1T384GM,115 reliable?

The price and inventory of NX3V1T384GM,115 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for NX3V1T384GM,115 is usually 5 days.

3.What payment methods are accepted for NX3V1T384GM,115?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for NX3V1T384GM,115 transactions.

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4.How is shipping managed for NX3V1T384GM,115?

NX3V1T384GM,115 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your NX3V1T384GM,115 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for NX3V1T384GM,115?

For technical support, including NX3V1T384GM,115 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your NX3V1T384GM,115 requirements.

6.How does Aetrix verify that NX3V1T384GM,115 is sourced from the original manufacturer or authorized distributors?

All NX3V1T384GM,115 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that NX3V1T384GM,115 meets industry standards.

7.What is the process for return or replacement of NX3V1T384GM,115?

All NX3V1T384GM,115 units undergo pre-shipment inspection (PSI). If there is an issue with NX3V1T384GM,115, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The NX3V1T384GM,115 part is unused and in its original packaging.

Return procedure for NX3V1T384GM,115:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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