NXP Semiconductors NX3V1T66GW,125
- Part No.:
- NX3V1T66GW,125
- Manufacturer:
- NXP Semiconductors
- Package:
- 5-TSSOP, SC-70-5, SOT-353
- Datasheet:
-
NX3V1T66GW,125.pdf
- Description:
- IC SW SPST-NOX1 450MOHM 5TSSOP
- Quantity:
- Payment:

- Shipping:

Inventory:4,216
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
NX3V1T66GW,125 from NXP Semiconductors is a low-ohmic SPST analog switch in TSSOP5 package, operating from 1.4 V to 4.3 V supply, featuring 0.25 Ω typical ON resistance at 4.3 V, Schmitt-trigger enable input (E), and bidirectional Y–Z signal routing up to VCC amplitude. It enables 1.8 V logic control of 4.3 V analog signals in portable audio paths.
For engineers reviewing the NX3V1T66GW,125 datasheet, NX3V1T66GW,125 pinout, NX3V1T66GW,125 application, or NX3V1T66GW,125 equivalent, key selection criteria include ultra-low RON flatness (0.1 Ω), −40 °C to +125 °C operation, ESD robustness (6 kV IEC61000-4-2), and 500 mA continuous current handling without level translation.
Technical Context
The NX3V1T66GW,125 implements a CMOS transmission gate architecture with Schmitt-trigger enable input for noise immunity and slow-edge tolerance. Its voltage-tolerant enable accepts inputs up to 4.6 V independent of VCC, enabling direct interfacing with higher-voltage controllers while powered from 1.4 V–4.3 V.
Signal path supports bidirectional analog switching between Y and Z terminals with minimal distortion: THD ≤0.01% at 20 kHz (VCC ≥2.3 V), −3 dB bandwidth ≥25 MHz, and charge injection ≤12 pC (VCC = 4.3 V). OFF-state isolation exceeds −90 dB at 100 kHz.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage Range | 1.4 V to 4.3 V - Enables single-supply operation across battery-powered systems from Li-ion (3.0–4.2 V) down to 1.4 V coin-cell or low-VDD logic rails. |
| Typical ON Resistance | 0.25 Ω at VCC = 4.3 V - Ensures <0.1% signal attenuation for 500 mA loads; flatness of 0.1 Ω minimizes harmonic distortion in audio/RF paths. |
| Enable Input Threshold | VIL ≤0.6 V, VIH ≥1.4 V (VCC = 4.3 V) - Guarantees reliable 1.8 V logic compatibility without level shifters, even under worst-case process/voltage/temperature corners. |
| ESD Robustness | 6 kV IEC61000-4-2 contact discharge on switch ports - Eliminates need for external TVS diodes in handheld device I/O protection schemes. |
| Operating Temperature | −40 °C to +125 °C - Qualified for extended industrial and automotive cabin applications where ambient thermal stress exceeds standard commercial grade. |
| Switch Current Rating | ±500 mA continuous - Supports high-fidelity audio line driving, sensor multiplexing, and power-path switching without derating at full temperature range. |
| Dynamic Performance | ten ≤28 ns, tdis ≤20 ns (VCC ≥2.7 V) - Meets timing requirements for fast-switching applications like USB 2.0 data path selection and burst-mode sensor readout. |
Pinout & Package
TSSOP5 (SOT353-1) plastic thin shrink small outline package, 5-lead, body width 1.25 mm, 0.65 mm pitch, exposed pad not present.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (Y) | Independent I/O terminal | Bidirectional analog signal port; connects to source or load depending on system topology; referenced to GND and VCC. |
| 2 (Z) | Independent I/O terminal | Complementary bidirectional analog signal port; forms low-RON path with Y when E = HIGH; no polarity dependency. |
| 3 (GND) | Ground reference | 0 V return path for supply and signal currents; must be low-impedance to maintain RON stability and THD performance. |
| 4 (E) | Active-HIGH enable input | Schmitt-triggered digital control; tolerant to slow edges; accepts voltages up to 4.6 V regardless of VCC level. |
| 5 (VCC) | Positive supply rail | Power input for internal circuitry and switch channel; sets maximum signal swing (up to VCC) and defines RON vs. VCC curve. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low RON flatness | 0.1 Ω (VCC = 2.7–4.3 V) - Maintains consistent signal integrity across full input voltage range, critical for precision audio and sensor front-ends. |
| Voltage-tolerant enable | E accepts 0–4.6 V regardless of VCC - Enables direct connection to 3.3 V or 5 V microcontrollers while operating from 1.8 V supply, eliminating level translators. |
| High-current capability | 500 mA continuous, 750 mA pulsed - Supports high-drive applications such as speaker click-pop suppression and multi-channel audio routing without thermal shutdown. |
| Low-THD audio switching | ≤0.01% THD at 20 kHz (VCC ≥2.3 V) - Preserves fidelity in portable media player headphone outputs and microphone preamp signal paths. |
| Robust ESD protection | 6 kV IEC61000-4-2 on Y/Z ports - Reduces BOM count by removing discrete ESD diodes in consumer handheld interfaces. |
Applications
| Smartphone Audio Routing | Portable Media Player Headphone Output |
|---|---|
Use Scenario: Switching between stereo DAC output and mono headset jack while maintaining click-and-pop suppression. IC Role / Device Role / Timing Role: Bidirectional analog switch controlling signal path between codec and jack; enable timing synchronized to audio mute sequence. Use Value: 0.25 Ω RON ensures <0.05 dB insertion loss; 125 °C rating supports compact PCB layouts near battery or RF modules. |
Use Scenario: Multiplexing left/right audio channels to shared headphone amplifier with automatic detection of 3-pole vs. 4-pole jacks. IC Role / Device Role / Timing Role: Low-distortion SPST switch isolating unused channel during jack insertion; controlled by GPIO with Schmitt trigger for debounce. Use Value: THD ≤0.01% preserves CD-quality playback; 25 MHz bandwidth supports ultrasonic feedback cancellation tones. |
| PDA Touchscreen Signal Conditioning | Industrial Handheld Data Logger Sensor Interface |
Use Scenario: Routing analog touch panel voltage references and sense lines through EMI-filtered traces while minimizing parasitic capacitance. IC Role / Device Role / Timing Role: Low-capacitance (CS(ON) = 205 pF) analog switch isolating reference path during ADC sampling cycles. Use Value: 70 pF OFF-state capacitance prevents crosstalk between adjacent digitizer layers; 1.4 V min VCC supports ultra-low-power sleep modes. |
Use Scenario: Selecting between multiple thermistor, RTD, or strain gauge inputs into a single precision ADC front-end. IC Role / Device Role / Timing Role: Precision analog multiplexer with matched RON flatness ensuring consistent gain calibration across channels. Use Value: 0.1 Ω RON flatness eliminates channel-to-channel offset drift; −40 °C to +125 °C rating ensures field reliability in uncontrolled environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar analog switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TS5A23157DCUR | RON = 0.9 Ω (typ) at 3.3 V; 6-pin VSSOP; no Schmitt trigger on EN; max VCC = 3.6 V | Limited to ≤3.6 V systems; requires external RC filtering on EN for noisy environments; lower ESD rating (2 kV HBM) | Choose for cost-sensitive 3.3 V-only designs where Schmitt trigger and 4.3 V operation are unnecessary. |
| ADG801BRMZ | RON = 0.3 Ω (typ) at 3 V; 8-pin MSOP; single-channel but includes complementary enable; max VCC = 5.5 V | Higher pin count and larger footprint; lacks integrated ESD protection on switch ports (requires external diodes) | Prefer when 5.5 V operation or complementary logic interface is required, and board space allows MSOP package. |
Compared with TS5A23157DCUR and ADG801BRMZ, the NX3V1T66GW,125 delivers superior RON flatness (0.1 Ω vs. ≥0.4 Ω), integrated 6 kV ESD protection eliminating external components, and guaranteed 1.8 V logic compatibility at 4.3 V VCC - making it optimal for space-constrained, high-reliability portable designs.
Availability
NX3V1T66GW,125 is available at Aetrix Electronics and suitable for smartphone audio routing, portable media player headphone output, PDA touchscreen signal conditioning, and industrial handheld data logger sensor interface requiring stable component supply across extended temperature ranges.
Supply support for NX3V1T66GW,125 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and consumer markets.
The NX3V1T66 series was designed specifically for low-voltage, high-fidelity analog signal routing in battery-powered portable electronics, emphasizing ultra-low RON, logic-level compatibility, and robust ESD performance in miniature packages.
FAQ
What is the maximum signal voltage the NX3V1T66GW,125 can pass?
The NX3V1T66GW,125 supports bidirectional analog signal transmission with amplitude up to VCC. When VCC = 4.3 V, the device passes signals from 0 V to 4.3 V on both Y and Z terminals. Absolute maximum switch voltage is VCC + 0.5 V (4.8 V), but operation beyond VCC is not recommended for signal integrity. The NX3V1T66GW,125 does not support rail-to-rail operation above its supply rail.
Can the NX3V1T66GW,125 be used with a 1.8 V microcontroller controlling a 3.3 V analog signal path?
Yes. The NX3V1T66GW,125's Schmitt-trigger enable input accepts 1.8 V logic levels directly at VCC = 3.3 V, with VIH = 1.3 V (min) and VIL = 0.5 V (max). Its voltage-tolerant enable allows 1.8 V GPIO to reliably turn on/off the switch without level translation, and the 0.25 Ω RON ensures minimal attenuation of the 3.3 V analog signal. This capability is explicitly validated in the NX3V1T66GW,125 datasheet.
Does the NX3V1T66GW,125 require external ESD protection on its Y and Z pins?
No. The NX3V1T66GW,125 integrates IEC61000-4-2 contact discharge ESD protection rated at 6000 V on its Y and Z switch terminals, exceeding typical system-level requirements for handheld devices. External TVS diodes are unnecessary unless the application demands >6 kV protection or involves unusual transient waveforms not covered by the IEC standard. The NX3V1T66GW,125's built-in protection is verified per industry-standard test methods.
What is the thermal performance of the NX3V1T66GW,125 in TSSOP5 package at +125 °C ambient?
In the TSSOP5 (SOT353-1) package, the NX3V1T66GW,125 has a total power dissipation limit of 250 mW at Tamb = −40 °C to +125 °C, with linear derating above 87.5 °C at 4.0 mW/K. At +125 °C ambient and 500 mA load, self-heating remains within safe limits due to its ultra-low RON (0.25 Ω), resulting in only ~62.5 mW conduction loss. The NX3V1T66GW,125 is fully specified and tested across this full temperature range.
How does the NX3V1T66GW,125 achieve low THD in audio applications?
The NX3V1T66GW,125 achieves ≤0.01% THD at 20 kHz via ultra-low and flat ON resistance (0.25 Ω typical, 0.1 Ω flatness), symmetric CMOS transmission gate design, and optimized charge injection (<12 pC). These features minimize nonlinear distortion and intermodulation when switching audio signals up to VCC. THD performance is measured and guaranteed per Figure 17 in the NX3V1T66GW,125 datasheet under defined load and frequency conditions.
NX3V1T66GW,125 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Switch Circuit:
- SPST - NO
- Multiplexer/Demultiplexer Circuit:
- 1:1
- Number of Circuits:
- 1
- On-State Resistance (Max):
- 450mOhm
- Channel-to-Channel Matching (ΔRon):
- -
- Voltage - Supply, Single (V+):
- 1.4V ~ 4.3V
- Voltage - Supply, Dual (V±):
- -
- Switch Time (Ton, Toff) (Max):
- 28ns, 20ns
- -3db Bandwidth:
- 25MHz
- Charge Injection:
- 12pC
- Channel Capacitance (CS(off), CD(off)):
- 70pF
- Current - Leakage (IS(off)) (Max):
- 10nA
- Crosstalk:
- -
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 5-TSSOP
NX3V1T66GW,125 FAQ
1.How can I place an order for NX3V1T66GW,125 through Aetrix?
Please submit a Request for Quotation (RFQ) for NX3V1T66GW,125 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for NX3V1T66GW,125 reliable?
The price and inventory of NX3V1T66GW,125 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for NX3V1T66GW,125 is usually 5 days.
3.What payment methods are accepted for NX3V1T66GW,125?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for NX3V1T66GW,125 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for NX3V1T66GW,125?
NX3V1T66GW,125 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your NX3V1T66GW,125 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for NX3V1T66GW,125?
For technical support, including NX3V1T66GW,125 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your NX3V1T66GW,125 requirements.
6.How does Aetrix verify that NX3V1T66GW,125 is sourced from the original manufacturer or authorized distributors?
All NX3V1T66GW,125 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that NX3V1T66GW,125 meets industry standards.
7.What is the process for return or replacement of NX3V1T66GW,125?
All NX3V1T66GW,125 units undergo pre-shipment inspection (PSI). If there is an issue with NX3V1T66GW,125, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The NX3V1T66GW,125 part is unused and in its original packaging.
Return procedure for NX3V1T66GW,125:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
NX3V1T66GW,125 Tags

-
SN74LVC1G3157DBVR
Texas Instruments
-
SN74LVC1G66DBVR
Texas Instruments
-
SN74LVC1G66DCKR
Texas Instruments

-
SN74LVC1G3157DSFR
Texas Instruments

-
1P1G3157QDCKRQ1
Texas Instruments

-
SN74LVC2G66DCUR
Texas Instruments
-
SN74LV4052APWR
Texas Instruments

-
74HC4051D,653
Nexperia USA Inc.
-
SN74LV4051APWR
Texas Instruments
-
CD74HC4052PWR
Texas Instruments
-
CD74HC4051PWR
Texas Instruments
-
TS5A3166DBVR
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

