NXP Semiconductors NX5P2553GU6Z

Overview

NX5P2553GU6Z from NXP Semiconductors is a precision adjustable current-limited power switch featuring an HXSON6 package (2.0 × 2.0 × 0.5 mm), 2.5–5.5 V supply range, 1.5 A continuous switch current, 95–125 mΩ typical R_ON, and programmable current limit from 85 mA to 1.8 A via external ILIM resistor. It serves as a protected high-side power switch in USB port/hub power management.

For engineers reviewing the NX5P2553GU6Z datasheet, NX5P2553GU6Z pinout, NX5P2553GU6Z application, or NX5P2553GU6Z equivalent, key selection criteria include its ±6% current-limit accuracy at 1.8 A, 2.0 µs short-circuit response, reverse-voltage protection (140 mV trip), integrated soft-start, and thermal shutdown thresholds of 130 °C (current-limit mode) and 155 °C (normal mode).

Technical Context

The NX5P2553GU6Z integrates an N-channel MOSFET with precision current-sense feedback, deglitched overcurrent detection (8.7 ms typical deglitch time), and independent UVLO (2.35 V threshold, 25 mV hysteresis). Its fault-handling logic combines open-drain FAULT output with automatic recovery after thermal or reverse-voltage fault removal.

Control architecture includes active-HIGH EN with integrated level translation for compatibility with 1.8 V/3.3 V controllers, ILIM pin supporting resistor-programmed I_OCP across three decades (95–1800 mA), and dedicated reverse-voltage comparator with 4.4–6 ms deglitch window. OTP operates in two modes-155 °C shutdown with 30 °C hysteresis in normal operation, and 130 °C with 12 °C hysteresis during current limiting.

Key Specifications

Pinout & Package

Package: HXSON6 (SOT1348-1), plastic thermal-enhanced extremely thin small outline, no leads, 6 terminals, body size 2.0 × 2.0 × 0.5 mm. Exposed thermal pad (non-electrical) must be soldered to GND for optimal thermal performance.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar current-limited power switch applications.

Compared with TPS2051BDBVR and NCP45520MUTBG, the NX5P2553GU6Z uniquely combines programmable current limiting, reverse-voltage protection, sub-µs short-circuit response, and integrated soft-start in a thermally enhanced 2 mm × 2 mm package-making it optimal for space-constrained, multi-load USB and consumer electronics power domains requiring comprehensive fault coverage.

Availability

NX5P2553GU6Z is available at Aetrix Electronics and suitable for USB port/hubs, digital TV and set-top boxes, and VoIP phones requiring stable component supply, long-term lifecycle support, and guaranteed traceability.

Supply support for NX5P2553GU6Z includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and consumer applications.

The NX5P2553GU6Z belongs to NXP's precision power switch product line, designed specifically for fault-protected, current-limited power distribution in portable and embedded USB-compliant systems operating from 2.5 V to 5.5 V rails.

FAQ

What is the recommended external resistor value to set NX5P2553GU6Z current limit to 1.0 A?

Per Figure 8 and Table 10, a 33.2 kΩ resistor between ILIM and GND yields ~1.0 A typical overcurrent protection threshold at T_j = 25 °C. At full temperature range (−40 °C to +125 °C), this setting delivers 950–1050 mA due to ±6% accuracy and temperature drift. Use 1% tolerance metal-film resistors for best repeatability. The NX5P2553GU6Z datasheet specifies R_ILIM values from 15 kΩ to 232 kΩ for 1.8 A down to 85 mA.

Does NX5P2553GU6Z require an external pull-up resistor on the FAULT pin?

Yes, the FAULT pin is an open-drain output and requires an external pull-up resistor to a valid logic-high voltage (e.g., 3.3 V or 5 V). Typical values range from 4.7 kΩ to 10 kΩ. Without pull-up, FAULT cannot assert LOW during fault conditions, disabling system-level fault detection. This requirement applies to all operating modes of the NX5P2553GU6Z, including during UVLO or thermal shutdown.

Can NX5P2553GU6Z be used with a 1.8 V microcontroller GPIO driving the EN pin?

Yes. The NX5P2553GU6Z features integrated logic-level translation on the EN input, allowing direct interface with 1.8 V, 2.5 V, or 3.3 V controllers. VIH(min) is 1.3 V and VIL(max) is 0.56 V at V_IN = 2.5–5.5 V, ensuring reliable HIGH recognition from 1.8 V outputs. This eliminates level-shifters in low-voltage MCU designs using the NX5P2553GU6Z.

How does reverse-voltage protection (RVP) behave when VOUT is driven higher than VIN on NX5P2553GU6Z?

When VOUT exceeds VIN by >140 mV for ≥4.4 ms (deglitch time), the NX5P2553GU6Z disables the internal N-channel MOSFET and pulls FAULT LOW. Once VOUT falls below VIN −140 mV for ≥4.4 ms, the device automatically re-enables and FAULT returns to high-impedance. This protects upstream supplies from backfeed-critical in USB OTG or shared-rail systems-and is fully handled internally by the NX5P2553GU6Z without external components.

What thermal performance can be expected from NX5P2553GU6Z in a standard 2-layer PCB layout?

In a standard 2-layer PCB with 1 oz copper and recommended thermal pad layout (solid GND connection under device), the NX5P2553GU6Z exhibits R_th(j-a) = 93 K/W (typical), enabling 1.5 A continuous operation at +85 °C ambient if power dissipation remains ≤1.5 A² × 0.125 Ω ≈ 281 mW. For higher loads or elevated ambient, use internal thermal derating curves (Figure 7) and ensure ≥25 mm² GND copper area under the thermal pad. This thermal behavior is validated for the NX5P2553GU6Z SOT1348-1 package.