NXP Semiconductors NX5P2924DUKZ
- Part No.:
- NX5P2924DUKZ
- Manufacturer:
- NXP Semiconductors
- Package:
- 6-XFBGA, WLCSP
- Datasheet:
-
NX5P2924DUKZ.pdf
- Description:
- LOGIC-CONTROLLED HIGH-SIDE POWER
- Quantity:
- Payment:

- Shipping:

Inventory:2,407
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
NX5P2924DUKZ from NXP Semiconductors is a logic-controlled high-side power switch featuring an N-channel MOSFET with 18 mΩ typical ON resistance at 1.2 V and 1.8 V supply, 2.5 A continuous current capability, slew-rate-controlled turn-on, and integrated output pull-down for fast capacitive load discharge. It operates from 0.8 V to 5.5 V and is used in power domain isolation for battery life extension in portable electronics.
For engineers reviewing the NX5P2924DUKZ datasheet, NX5P2924DUKZ pinout, NX5P2924DUKZ application, or NX5P2924DUKZ equivalent, key selection criteria include input voltage compatibility with low-voltage processors, thermal performance in WLCSP6 packaging, discharge resistance value (1.25 kΩ), enable logic level translation, and OFF-state leakage current (<7.5 μA at 5.5 V).
Technical Context
The NX5P2924DUKZ integrates a charge pump and slew rate control circuit to manage in-rush current during turn-on while maintaining precise timing control across its 0.8–5.5 V input range. Its enable input supports logic-level translation, allowing direct interface with sub-1.2 V controllers without external level shifters.
When disabled, the internal discharge transistor actively pulls VOUT to GND through a 1.25 kΩ resistor until VOUT drops below 10% of VIN, preventing floating outputs and ensuring predictable power sequencing. The device is specified over –40 °C to +85 °C ambient and features ESD protection exceeding 5000 V HBM and 1000 V CDM.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage Range | 0.8 V to 5.5 V - enables direct integration with modern ultra-low-voltage SoCs and PMICs |
| ON Resistance (RON) | 18 mΩ typical at 1.2 V/1.8 V - minimizes conduction loss and self-heating under 2.5 A load |
| Continuous Output Current | 2.5 A - supports high-current peripheral rails in smartphones and cameras |
| Enable Logic Threshold | VIH = 1.2 V min at VIN ≥ 2.5 V - ensures reliable activation with 1.8 V/3.3 V GPIOs |
| Discharge Resistance (Rdch) | 1.25 kΩ typical - provides controlled VOUT ramp-down without excessive ground current |
| OFF-State Leakage | ≤7.5 μA at VIN = 5.5 V - preserves battery energy during system sleep modes |
| Thermal Resistance Rth(j-a) | 139 K/W - requires PCB copper area optimization for sustained 2.5 A operation at +85 °C |
Pinout & Package
Package: WLCSP6 (SOT1381-2), wafer-level chip-scale package measuring 1.39 mm × 0.89 mm × 0.465 mm with 0.5 mm pitch and solder bumps on bottom side.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VIN (A2, B2) | Main power input | Accepts 0.8–5.5 V supply; connects to upstream battery or regulator rail |
| VOUT (A1, B1) | Switched output | Delivers regulated power to downstream load; includes integrated discharge path |
| EN (C2) | Active-HIGH enable input | Logic-level translated - accepts 0.6 V HIGH threshold even at 0.8 V VIN |
| GND (C1) | Ground reference | Common return for internal circuitry, charge pump, and discharge transistor |
Key Features
| Feature | Design Value |
|---|---|
| Slew-rate-controlled turn-on | Enables in-rush current limiting to protect source capacitance and avoid supply droop |
| Integrated VOUT discharge | 1.25 kΩ pull-down activates automatically on disable, eliminating need for external bleeder resistor |
| Logic-level translation on EN | Supports direct connection to 0.8 V–1.2 V I/O domains without external level-shifting circuitry |
| Ultra-low ground current | IDD ≤ 110 μA max at 5.5 V - extends battery runtime in always-on subsystems |
| Robust ESD protection | HBM >5000 V and CDM >1000 V - meets stringent requirements for handheld consumer devices |
Applications
| Smartphone Power Management | Digital Camera Module Rail Control |
|---|---|
Use Scenario: Isolating camera sensor or flash LED power domains during standby to reduce quiescent current. IC Role / Device Role / Timing Role: High-side switch enabling/disabling 1.8 V or 2.8 V camera rails with controlled slew and fast discharge. Use Value: Prevents residual current draw from unpowered modules and eliminates voltage glitches during hot-plug events. |
Use Scenario: Managing power to image signal processor (ISP) or autofocus motor driver ICs in compact digital cameras. IC Role / Device Role / Timing Role: Load switch providing sequenced power-up and rapid VOUT discharge upon shutdown. Use Value: Ensures clean power sequencing and avoids latch-up in sensitive analog front-end circuits. |
| Wireless Headphone Battery Optimization | Portable Medical Sensor Hub |
Use Scenario: Controlling power to Bluetooth radio or audio codec in true wireless stereo (TWS) earbuds. IC Role / Device Role / Timing Role: Low-voltage (1.2 V–3.3 V) high-side switch with sub-μA shutdown current and fast enable response. Use Value: Extends single-charge operating time by minimizing leakage and enabling microsecond-level rail activation. |
Use Scenario: Enabling/disabling ECG or SpO₂ sensor analog front-end during measurement cycles in wearable health monitors. IC Role / Device Role / Timing Role: Precision power gate with <7.5 μA OFF-state leakage and guaranteed operation down to 0.8 V supply. Use Value: Maintains regulatory-compliant battery longevity while supporting ultra-low-power sensing intervals. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-side load switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TI TPS22919DNYR | Higher RON (24 mΩ @ 1.8 V), no integrated discharge, 1.2 V min enable threshold | Lacks automatic VOUT discharge; requires external resistor for fast rail collapse | Choose when board space permits discrete discharge design and lower cost is prioritized over integration |
| ROHM BD65240GUL | Wider VIN range (0.5–6.0 V), higher ICONT (3.0 A), but larger 1.6 × 1.6 mm DFN package | Better thermal margin at high ambient, but occupies ~2.5× more PCB area than WLCSP6 | Prefer when sustained 3 A loads or extended temperature range (+105 °C) is required |
Compared with TPS22919DNYR and BD65240GUL, the NX5P2924DUKZ delivers superior integration in minimal footprint (1.39 × 0.89 mm), native low-voltage enable compatibility, and autonomous discharge-making it optimal for space-constrained, battery-sensitive portable designs where layout simplicity and leakage minimization are critical.
Availability
NX5P2924DUKZ is available at Aetrix Electronics and suitable for smartphone power management, digital camera module control, wireless headphone battery optimization, and portable medical sensor hub applications requiring stable component supply and long-term lifecycle support.
Supply support for NX5P2924DUKZ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and consumer markets.
The NX5P2924DUKZ belongs to NXP's NX5P family of ultra-small, low-voltage load switches designed specifically for power domain isolation in space- and energy-constrained portable electronics.
FAQ
What is the maximum continuous current rating for the NX5P2924DUKZ?
The NX5P2924DUKZ supports 2.5 A of continuous output current under recommended operating conditions (Tamb ≤ +85 °C, proper PCB copper layout). This rating assumes adequate thermal dissipation via the WLCSP6 package's solder bumps and underlying PCB copper layers, as specified in the thermal characteristics section of the datasheet.
Does the NX5P2924DUKZ require an external pull-down resistor on the EN pin?
No, the NX5P2924DUKZ does not require an external pull-down on EN. Its enable input has defined logic thresholds (VIL ≤ 0.6 V, VIH ≥ 1.2 V) and internal biasing that ensures predictable HIGH/LOW interpretation without external components. However, a weak external pull-down may be added for robustness in noisy environments.
How does the NX5P2924DUKZ handle output discharge when disabled?
When the EN pin is driven LOW, the NX5P2924DUKZ automatically activates an internal discharge transistor connecting VOUT to GND through a 1.25 kΩ typical resistance. This discharges capacitive loads rapidly and disconnects once VOUT falls below 10% of VIN, eliminating the need for external discharge circuitry.
Can the NX5P2924DUKZ operate with a 0.9 V input supply?
Yes, the NX5P2924DUKZ is fully specified for operation from 0.8 V to 5.5 V. At 0.9 V input, its ON resistance is 19 mΩ typical, enable threshold remains functional (VIH = 0.9 V min), and supply current stays within datasheet limits - making it suitable for emerging ultra-low-voltage subsystems.
What is the thermal resistance (Rth(j-a)) of the NX5P2924DUKZ in standard PCB layout?
The NX5P2924DUKZ has a typical junction-to-ambient thermal resistance of 139 K/W under standard two-layer PCB conditions (Tamb = 85 °C). This value assumes all pins are solidly connected to large copper areas; reducing Rth(j-a) further requires multi-layer board design with internal ground/power planes acting as heat spreaders.
NX5P2924DUKZ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 6-XFBGA, WLCSP
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Switch Type:
- General Purpose
- Number of Outputs:
- 1
- Ratio - Input:Output:
- 1:1
- Output Configuration:
- High Side
- Output Type:
- N-Channel
- Interface:
- On/Off
- Voltage - Load:
- 0.8V ~ 5.5V
- Voltage - Supply (Vcc/Vdd):
- Not Required
- Current - Output (Max):
- 2.5A
- Rds On (Typ):
- 18mOhm
- Input Type:
- Inverting
- Features:
- -
- Fault Protection:
- -
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 6-WLCSP (1.39x0.89)
NX5P2924DUKZ FAQ
1.How can I place an order for NX5P2924DUKZ through Aetrix?
Please submit a Request for Quotation (RFQ) for NX5P2924DUKZ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for NX5P2924DUKZ reliable?
The price and inventory of NX5P2924DUKZ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for NX5P2924DUKZ is usually 5 days.
3.What payment methods are accepted for NX5P2924DUKZ?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for NX5P2924DUKZ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for NX5P2924DUKZ?
NX5P2924DUKZ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your NX5P2924DUKZ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for NX5P2924DUKZ?
For technical support, including NX5P2924DUKZ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your NX5P2924DUKZ requirements.
6.How does Aetrix verify that NX5P2924DUKZ is sourced from the original manufacturer or authorized distributors?
All NX5P2924DUKZ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that NX5P2924DUKZ meets industry standards.
7.What is the process for return or replacement of NX5P2924DUKZ?
All NX5P2924DUKZ units undergo pre-shipment inspection (PSI). If there is an issue with NX5P2924DUKZ, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The NX5P2924DUKZ part is unused and in its original packaging.
Return procedure for NX5P2924DUKZ:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
NX5P2924DUKZ Tags

-
TPS22919DCKR
Texas Instruments

-
MIC2091-1YM5-TR
Microchip Technology

-
MIC2090-1YM5-TR
Microchip Technology

-
TPS22995RZFR
Texas Instruments

-
TPS22975DSGR
Texas Instruments

-
SIP32510DT-T1-GE3
Vishay Siliconix

-
ULN2003D1013TR
STMicroelectronics

-
MIC2005A-1YM5-TR
Microchip Technology

-
MIC2005A-1YM6-TR
Microchip Technology

-
TPS22916BYFPR
Texas Instruments

-
TPS22917DBVR
Texas Instruments
-
ULN2003APWR
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
