NXP Semiconductors NX5P2925CUKZ

Overview

NX5P2925CUKZ from NXP Semiconductors is a logic-controlled high-side load switch featuring an N-channel MOSFET with 18 mΩ typical ON resistance at 1.2 V–5.5 V supply, 2.5 A continuous current capability, and integrated reverse current protection (RCP) triggering at 25 mV VOUT–VIN differential. It operates across 0.8 V–5.5 V input range and delivers low ground current for battery-powered portable electronics.

For engineers reviewing the NX5P2925CUKZ datasheet, NX5P2925CUKZ pinout, NX5P2925CUKZ application, or NX5P2925CUKZ equivalent, key selection criteria include its WLCSP6 package footprint, slew-rate controlled turn-on for inrush current limiting, RCP threshold accuracy, thermal resistance (139 K/W), and compatibility with sub-1.2 V enable logic via integrated level translation.

Technical Context

The NX5P2925CUKZ implements a single high-side N-channel MOSFET switch with active gate drive and slew-rate control circuitry to limit dV/dt during turn-on, reducing system-level EMI and capacitor inrush stress. Its reverse current protection operates autonomously without external components, disabling conduction when VOUT exceeds VIN by ≥25 mV.

Integrated logic-level translation on the EN pin enables direct interfacing with processors operating as low as 0.8 V supply, while maintaining robust noise immunity and HBM ESD rating of >5000 V. The device is fully specified from −40 °C to +85 °C ambient and supports pulsed currents up to ±5 A (100 ms, 2% duty cycle).

Key Specifications

Pinout & Package

Package: WLCSP6 (Wafer-Level Chip-Scale Package), 0.87 mm × 1.37 mm × 0.5 mm, 6-bump layout with solder bumps on underside.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-side load switch applications.

Compared with TPS22919YZFT and BD65240GUL, the NX5P2925CUKZ uniquely combines sub-1 V enable compatibility, 2.5 A rating, and autonomous RCP in a 0.87 mm × 1.37 mm WLCSP6 footprint - making it optimal for ultra-compact, battery-critical portable systems demanding both efficiency and fault resilience.

Availability

NX5P2925CUKZ is available at Aetrix Electronics and suitable for smartphone power domain isolation, digital camera sensor supply, wireless headphone battery management, and portable medical monitor display applications requiring stable component supply across high-mix, low-volume production runs.

Supply support for NX5P2925CUKZ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and consumer markets.

The NX5P2925CUKZ belongs to NXP's logic-controlled high-side power switch product line, engineered specifically for ultra-low-power, space-constrained portable electronics requiring precise power sequencing, inrush control, and reverse current protection without external components.

FAQ

What is the maximum continuous current rating for the NX5P2925CUKZ?

The NX5P2925CUKZ supports 2.5 A of continuous current under recommended operating conditions (Tamb ≤ +85 °C, proper PCB thermal design). It also handles pulsed currents up to ±5 A for 100 ms at 2% duty cycle. Derating applies above +85 °C ambient or with inadequate copper pour; full 2.5 A operation requires adherence to the 139 K/W junction-to-ambient thermal resistance specification using a two-layer PCB.

Does the NX5P2925CUKZ require external components for reverse current protection?

No, the NX5P2925CUKZ includes fully integrated reverse current protection (RCP) circuitry. When VOUT exceeds VIN by 25 mV (typical), the internal circuit automatically disables the MOSFET to isolate the output from the input. This hardware-based function requires no external diodes, resistors, or configuration - it operates autonomously across the full −40 °C to +85 °C temperature range.

Can the NX5P2925CUKZ be used with a 0.9 V microcontroller I/O pin for enable control?

Yes, the NX5P2925CUKZ features integrated logic-level translation on the EN pin. At VIN = 0.8 V, VIH is specified at 0.6 V minimum, meaning a 0.9 V GPIO can reliably assert EN HIGH. This eliminates the need for external level shifters when interfacing with ultra-low-voltage processors or SoCs operating below 1.2 V.

What is the thermal resistance (Rth(j-a)) of the NX5P2925CUKZ in its WLCSP6 package?

The NX5P2925CUKZ has a typical junction-to-ambient thermal resistance of 139 K/W under standard test conditions (Tamb = 85 °C, two-layer PCB). This value assumes optimal board layout: all pins connected to large copper areas, second layer used as heat spreader, and no solder-stop varnish under the device. Actual Rth(j-a) will vary with PCB stack-up and copper area - refer to NXP AN10439 for WLCSP thermal design guidelines.

How does the slew-rate control in the NX5P2925CUKZ reduce inrush current?

The NX5P2925CUKZ incorporates internal slew-rate control that limits the dV/dt of VOUT during turn-on. This controlled ramp-up prevents instantaneous charging of large downstream capacitors (e.g., 10–100 µF), capping peak inrush current to levels compatible with upstream power sources. Measured turn-on times range from 500 µs to 1480 µs depending on VIN, directly correlating to reduced stress on source rails and elimination of voltage droop.