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NXP Semiconductors NXH3670UK/A1Z
- Part No.:
- NXH3670UK/A1Z
- Manufacturer:
- NXP Semiconductors
- Category:
- RF Transceiver ICs
- Package:
- 34-XFBGA, WLCSP
- Datasheet:
-
NXH3670UK/A1Z.pdf
- Description:
- IC RF TXRX+MCU BLE 34WLCSP
- Quantity:
- Payment:
- Shipping:
Inventory:1,394
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Product details
Overview
NXH3670UK/A1Z from NXP Semiconductors is a single-chip, ultra-low-power 2.4 GHz Bluetooth Low Energy transceiver with integrated ARM Cortex-M0 MCU, CoolFlux DSP, and G.722 audio codec accelerator - designed specifically for true wireless stereo (TWS) earbuds and low-latency audio streaming. It delivers −94 dBm RX sensitivity at 1 Mbps, programmable TX output from −10 to +4 dBm, and <63 μA sleep current in a 2.45 × 2.87 mm WLCSP34 package.
For engineers reviewing the NXH3670UK/A1Z datasheet, NXH3670UK/A1Z pinout, NXH3670UK/A1Z application, or NXH3670UK/A1Z equivalent, key selection considerations include its dual-mode BLE 1/2 Mbps PHY support, integrated audio processing pipeline (I2S/TDM, ASRC, latency control), certified Bluetooth 4.2 compliance, and ultra-low active current (<3.7 mA RX, <7.3 mA TX @ 0 dBm).
Technical Context
The NXH3670UK/A1Z integrates a fully self-contained BLE radio subsystem with on-die PLL synthesizer (no external loop filter), calibrated RF front end, and automatic gain control - enabling robust 2.4 GHz operation across 2402–2480 MHz with ±300 kHz frequency offset correction. Its RF MAC handles packet assembly/disassembly, CRC/whitening, and timing-critical link-layer functions offloading the Cortex-M0.
Audio processing is distributed across dedicated hardware: the G.722 codec supports dual-context encoding/decoding, the CoolFlux DSP runs at up to 84 MHz for equalization and mixing, and the asynchronous sample rate converter (ASRC) enables seamless clock domain bridging between host and RF domains - all coordinated by a latency control unit that guarantees deterministic end-to-end audio delay.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| RF Frequency Range | 2402–2480 MHz - covers full Bluetooth LE ISM band with 2 MHz channel spacing in both 1 Mbps and 2 Mbps modes. |
| RX Sensitivity | −94 dBm @ 1 Mbps - enables reliable connection at extended range in power-constrained hearables. |
| TX Output Power | −10 to +4 dBm in 2 dB steps - allows precise link budget tuning without external PA or matching network changes. |
| Sleep Current | <63 μA - extends battery life in TWS charging case storage and standby states. |
| DSP Clock Speed | Up to 84 MHz - delivers real-time audio processing for dual-channel G.722 decode + EQ + ASRC within 10 ms latency budget. |
| Audio Interface | I2S/TDM with 6.2 Mbps max bit rate - supports stereo/multi-channel streaming to DACs or companion codecs. |
| Supply Voltage | 1.2 V nominal - matches modern Li-ion/Li-poly battery discharge profiles and simplifies PMIC design. |
| Operating Temp | −20 °C to +85 °C - validated for consumer earbud thermal environments including skin-contact operation. |
Pinout & Package
Package: WLCSP34 (2.45 × 2.87 × 0.38 mm, 34 bumps, SOT1403-1). Pb-free, RoHS-compliant. Requires light shielding per NXP ESD/light-sensitivity cautions.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| ANT1 / ANT2 | RF Balanced Antenna Interface | Differential 50 Ω RF port - enables compact PCB antenna integration without balun; requires matched layout per reference design. |
| XIN / XOUT | Crystal Oscillator I/O | Supports 16 MHz or 32 MHz ±60 ppm crystals - internal trimming eliminates external load capacitors. |
| VDD,RX / VDD,TX / VDD,SYNTH | RF Power Supplies | Separate analog rails isolate noise-sensitive RX/TX/synthesizer blocks - each tied externally to VEXT via low-ESR decoupling. |
| VSS,RX1 / VSS,RX2 / VSS,TX / VSS,SYNTH | RF Ground Returns | Dedicated ground bumps per RF block - mandatory star grounding to minimize coupling and meet EMI limits. |
| SWM0–SWM11 | Configurable Digital I/O | Software-mapped pins supporting UART, SPI, GPIO, or debug - routed via switch matrix to reduce pin count without sacrificing flexibility. |
| POR_RESETN | Active-Low Reset Input | Asynchronous reset referenced to VEXT - must be held low during power ramp; debounced internally. |
| SRQ | Service Request Output | Open-drain signal alerts host MCU of state transitions (e.g., wake-up, packet ready) - enables event-driven power management. |
Key Features
| Feature | Design Value |
|---|---|
| Bluetooth 4.2 Certification | Fully qualified stack - eliminates qualification effort for end-product FCC/CE/ISED submissions in audio accessories. |
| CoolFlux DSP + G.722 Codec | Dual-context hardware-accelerated encoding/decoding - enables simultaneous left/right channel processing with sub-20 ms round-trip latency. |
| Integrated Audio Latency Control | Hardware-managed NCO and timers - maintains fixed end-to-end delay across variable RF conditions and host clock drift. |
| Ultra-Low-Power RF MAC | Dedicated accelerator handles packet framing, CRC, whitening, and timing-critical BLE link layer - frees Cortex-M0 for application logic. |
| AES-128 Security Coprocessor | On-die encryption engine - secures over-the-air firmware updates and pairing data without CPU overhead or memory exposure. |
| Flexible Clock Shop | Glitch-free dynamic clock switching between 16 MHz (low-power) and 84 MHz (high-performance) modes - adapts processing speed to real-time audio load. |
Applications
| Gaming Headsets | True Wireless Stereo Earbuds |
|---|---|
|
Use Scenario: Low-latency bidirectional audio and voice communication during competitive gaming with synchronized left/right channel rendering. IC Role / Device Role / Timing Role: Primary BLE transceiver and audio processor - handles RF link, G.722 encode/decode, ASRC, and latency-controlled playback via I2S to DACs. Use Value: Achieves <20 ms end-to-end latency with jitter compensation, enabling lip-sync alignment and responsive voice chat without perceptible delay. |
Use Scenario: Compact, battery-efficient stereo streaming from smartphone to left/right earpieces with independent control and battery telemetry. IC Role / Device Role / Timing Role: System-on-chip audio SoC - integrates RF, MCU, DSP, and audio interfaces in one die to eliminate inter-chip routing and reduce BOM count. Use Value: Enables 4+ hour playback on 40 mAh batteries via <63 μA sleep current and optimized 1.2 V supply architecture. |
| Wireless Headphones | Mobile Phone Accessories |
|
Use Scenario: High-fidelity stereo streaming with adaptive noise cancellation and touch control feedback in over-ear form factors. IC Role / Device Role / Timing Role: Central audio hub - processes ANC error signals on CoolFlux DSP, streams music via TDM, and manages BLE HID controls through Cortex-M0. Use Value: Supports 8-channel TDM for multi-mic beamforming and ANC while maintaining <100 μs inter-channel skew for coherent processing. |
Use Scenario: Compact Bluetooth adapters for legacy audio devices (e.g., 3.5 mm aux dongles, USB-C headphones) requiring minimal footprint and fast boot. IC Role / Device Role / Timing Role: Self-contained BLE audio bridge - boots via SPI-hosted firmware, configures I2S/TDM interface, and handles protocol translation without external memory. Use Value: Reduces bill-of-materials to only passive components and antenna - no external flash, RAM, or codec required for basic streaming functionality. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Bluetooth Low Energy audio transceiver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DA14531MOD-00F02002 | Lacks integrated audio DSP and G.722 codec; relies on host MCU for audio processing; smaller ROM/RAM (48 kB/16 kB); no ASRC or latency control hardware. | Better suited for simple HID peripherals or sensor nodes - not viable for standalone TWS earbud audio processing without external DSP. | Select when cost and size are primary constraints and audio processing is handled externally. |
| CC2642R1F | Higher TX power (+5 dBm), larger QFN48 package (6 × 6 mm), no CoolFlux DSP or G.722 acceleration; requires external codec and SRAM for comparable audio features. | Targets industrial BLE gateways and higher-range applications - lacks the ultra-low-power audio pipeline needed for hearables. | Select when extended RF range or multi-protocol (BLE + Zigbee) is required, and board space permits larger packaging. |
Compared with DA14531MOD-00F02002 and CC2642R1F, the NXH3670UK/A1Z uniquely integrates certified BLE 4.2, dual-context G.722, CoolFlux DSP, and hardware latency control in a sub-7.25 mm² WLCSP - delivering a complete, power-optimized audio SoC solution where others require multi-chip architectures.
Availability
NXH3670UK/A1Z is available at Aetrix Electronics and suitable for true wireless stereo earbuds, gaming headsets, and Bluetooth audio dongles requiring stable component supply, long-term lifecycle support, and certified Bluetooth interoperability.
Supply support for NXH3670UK/A1Z includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and consumer markets, with deep expertise in RF, MCU, and audio processing IP.
The NXH3670UK/A1Z belongs to NXP's Hearables Platform family - engineered specifically to consolidate RF, processing, and audio functions into a single ultra-low-power die for next-generation wireless audio wearables.
FAQ
What Bluetooth specification version does the NXH3670UK/A1Z support?
The NXH3670UK/A1Z is certified for Bluetooth specification version 4.2. It implements the Bluetooth Low Energy 1 Mbps and 2 Mbps PHY layers with GFSK modulation, supports the Link Layer, and provides hardware acceleration for packet handling, CRC, and whitening - all verified against the Bluetooth SIG test specifications.
Does the NXH3670UK/A1Z include an integrated microcontroller?
Yes, the NXH3670UK/A1Z integrates an ARM Cortex-M0 subsystem running up to 84 MHz in high-performance mode and 16 MHz in low-power mode. It includes 128 kB ROM for boot code and firmware, 96 kB RAM for runtime data, and a flexible DMA engine - enabling full-stack BLE protocol handling and application logic without external MCU dependency.
How does the NXH3670UK/A1Z achieve ultra-low power consumption in audio applications?
The NXH3670UK/A1Z achieves ultra-low power via multiple hardware optimizations: <63 μA sleep current, separate regulated supplies for RF/digital blocks, ultralow-power crystal oscillator, dynamic clock scaling (16–84 MHz), and hardware-accelerated audio functions that minimize CPU wake-ups. Continuous RX current is <3.7 mA and TX current is <7.3 mA at 0 dBm - measured at 1.2 V supply.
What audio interfaces does the NXH3670UK/A1Z support?
The NXH3670UK/A1Z supports configurable I2S and TDM audio interfaces on the same four-pin dataport (I2S_WS, I2S_CLK, I2S_SI, I2S_SO). It operates in I2S slave/master modes (up to 50 kHz) and TDM slave mode (2/4/8 channels), with maximum bit rate of 6.2 Mbps and support for 16- or 32-bit word lengths - enabling direct connection to DACs, ADCs, or companion codecs.
Is the NXH3670UK/A1Z pin-compatible with other NXP hearables chips like the NXH3671?
No, the NXH3670UK/A1Z is not pin-compatible with the NXH3671 or other variants in the family. The NXH3670UK/A1Z uses a 34-bump WLCSP package (SOT1403-1) with specific bump assignments for ANT1/ANT2, XIN/XOUT, and SWM-configurable I/Os. Pin compatibility is not claimed in the official documentation, and layout reuse requires verification against the NXH3670UK/A1Z-specific bump map and thermal/mechanical constraints.
NXH3670UK/A1Z Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 34-XFBGA, WLCSP
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Type:
- TxRx + MCU
- RF Family/Standard:
- Bluetooth
- Protocol:
- Bluetooth v4.1
- Modulation:
- GFSK
- Frequency:
- 2.36GHz ~ 2.5GHz
- Data Rate (Max):
- 2Mbps
- Power - Output:
- 4dBm
- Sensitivity:
- -94dBm
- Memory Size:
- 96kB RAM, 128kB ROM
- Serial Interfaces:
- GPIO, I2S, SPI, UART
- GPIO:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Current - Receiving:
- 7mA
- Current - Transmitting:
- 10mA
- Operating Temperature:
- -20°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 34-WLCSP (2.87x2.45)
NXH3670UK/A1Z FAQ
1.How can I place an order for NXH3670UK/A1Z through Aetrix?
Please submit a Request for Quotation (RFQ) for NXH3670UK/A1Z on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for NXH3670UK/A1Z reliable?
The price and inventory of NXH3670UK/A1Z are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for NXH3670UK/A1Z is usually 5 days.
3.What payment methods are accepted for NXH3670UK/A1Z?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for NXH3670UK/A1Z transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for NXH3670UK/A1Z?
NXH3670UK/A1Z orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your NXH3670UK/A1Z order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for NXH3670UK/A1Z?
For technical support, including NXH3670UK/A1Z datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your NXH3670UK/A1Z requirements.
6.How does Aetrix verify that NXH3670UK/A1Z is sourced from the original manufacturer or authorized distributors?
All NXH3670UK/A1Z products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that NXH3670UK/A1Z meets industry standards.
7.What is the process for return or replacement of NXH3670UK/A1Z?
All NXH3670UK/A1Z units undergo pre-shipment inspection (PSI). If there is an issue with NXH3670UK/A1Z, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The NXH3670UK/A1Z part is unused and in its original packaging.
Return procedure for NXH3670UK/A1Z:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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