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NXP Semiconductors NXH3675UK/A2Z
- Part No.:
- NXH3675UK/A2Z
- Manufacturer:
- NXP Semiconductors
- Category:
- DSP (Digital Signal Processors)
- Package:
- -
- Datasheet:
-
NXH3675UK/A2Z.pdf
- Description:
- NXH3675UK/A2Z
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Product details
Overview
NXH3675UK/A2Z from NXP Semiconductors is a Bluetooth® 5.3 LE Audio certified SoC enabling Auracast™ broadcast, supporting LC3/LC3plus codecs at up to 96 kHz, delivering ~20 ms ultra-low latency, and integrating dual CoolFlux® DSPs for real-time audio processing - ideal for gaming headsets requiring bi-directional streaming with <22 mW total power consumption.
For engineers reviewing the NXH3675UK/A2Z datasheet, NXH3675UK/A2Z pinout, NXH3675UK/A2Z application, or NXH3675UK/A2Z equivalent, key selection criteria include LE Audio compliance, dual-Cortex-M0+ architecture, PDM microphone interface support, proprietary low-latency protocol, and integration of radio + DSP + memory in a single chip optimized for battery-constrained hearables and wireless audio endpoints.
Technical Context
The NXH3675UK/A2Z implements a dual-core architecture: one Cortex-M0+ handles application control and BLE host stack, while a second dedicated Cortex-M0+ executes full software link-layer protocol up to HCI level. Its dual CoolFlux DSP subsystem processes LC3/LC3plus encoding/decoding, EQ, compression, gain control, and mixing in real time.
It supports simultaneous unicast topologies (up to 7 streams), 48/96 kHz sample rates, TMAP-compliant HQ audio, and proprietary ultra-low-latency streaming (~20 ms) with forward stereo (48 kHz/24-bit) and return mono (32 kHz/24-bit) paths - all within a single 2.4 GHz radio subsystem.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Bluetooth Version | 5.3 LE Audio certified - enables Auracast™ broadcast and multi-stream unicast per Bluetooth SIG specification |
| Audio Codecs | LC3 and LC3plus - supports 48 kHz and 96 kHz sampling, enabling high-fidelity audio under low power |
| Latency | ~20 ms - achieved via NXP's proprietary protocol, critical for real-time gaming headset synchronization |
| DSP Architecture | Dual CoolFlux® DSP - hardware-accelerated audio processing for encoder/decoder, EQ, compression, mixing |
| Microphone Interface | Two digital PDM inputs - enables direct connection of MEMS microphones without external ADC |
| Power Consumption | 22 mW during active audio streaming - enables >20-hour battery life in compact hearables |
| CPU Cores | Dual Cortex-M0+ - one for host stack/application, one for full link-layer implementation up to HCI |
Pinout & Package
Package: 7 mm × 7 mm × 1.0 mm 64-pin QFN with exposed thermal pad (RoHS-compliant, lead-free).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VIO | I/O supply | 1.8 V digital I/O rail - powers GPIO, I2C, I2S interfaces |
| VEXT | External analog supply | 1.1 V supply for RF and analog front-end - requires low-noise regulation |
| VMEM | Memory supply | 1.1 V supply for embedded SRAM and DSP memory subsystem |
| ANT1 / ANT2 | RF antenna terminals | Differential 2.4 GHz RF outputs - designed for direct connection to balun or matching network |
| PDM_IN0 / PDM_IN1 | Digital microphone inputs | Two PDM serial data inputs - support 1-bit pulse-density modulated MEMS microphones |
| I2S_SDIN / I2S_SDOUT | Audio data lines | Full-duplex I2S interface - enables connection to external DAC/ADC or codec |
| I2C_SCL / I2C_SDA | Control interface | Standard-mode I2C bus - used for configuring PMIC (e.g., PCA9420) and peripherals |
Key Features
| Feature | Design Value |
|---|---|
| LE Audio & Auracast™ certification | Enables standardized broadcast audio sharing and multi-recipient streaming without pairing |
| Dual Cortex-M0+ cores | Hardware-isolated processing domains - one for BLE stack, one for link-layer offload, improving determinism and security |
| Dual CoolFlux DSP subsystem | Real-time LC3/LC3plus encode/decode at 96 kHz with voice enhancement - eliminates need for external DSP |
| Integrated 16/32 MHz crystal oscillator | Auto-tuned frequency selection with integrated caps - reduces BOM count and layout sensitivity |
| Ultra-low power operation | 22 mW streaming power - extends battery life in compact form-factor devices like earbuds and microphones |
Applications
| Gaming Headset | Wireless Conference Speakerphone |
|---|---|
Use Scenario: Real-time bidirectional audio streaming between mobile/console and headset during competitive gaming. IC Role / Device Role / Timing Role: Primary audio SoC handling forward stereo (48 kHz/24-bit) and return mono (32 kHz/24-bit) paths with ~20 ms end-to-end latency. Use Value: Enables lip-sync–accurate audio and responsive voice chat without perceptible delay or battery penalty. | Use Scenario: Multi-microphone beamforming and speaker output in office conference systems with Auracast™ broadcast capability. IC Role / Device Role / Timing Role: Central audio processor managing PDM mic array input, LC3plus decode, echo cancellation, and I2S speaker output. Use Value: Supports simultaneous local playback and broadcast to multiple listeners while maintaining sub-30 ms group latency. |
| Hearing Aid | TV Audio Transmitter Dongle |
Use Scenario: Discreet, rechargeable hearing aid with direct LE Audio streaming from TV or smartphone. IC Role / Device Role / Timing Role: Low-power endpoint SoC receiving LC3 audio over unicast, applying real-time EQ and compression for hearing compensation. Use Value: Delivers medical-grade audio fidelity with >24-hour battery life using only on-chip DSP and no external codec. | Use Scenario: Plug-and-play USB dongle converting TV optical/ARC audio into Auracast™ broadcast stream. IC Role / Device Role / Timing Role: Audio gateway SoC performing A-to-D conversion, LC3plus encoding, and 2.4 GHz broadcast transmission. Use Value: Enables legacy TVs to serve as Auracast™ transmitters without firmware modification or HDMI-CEC dependency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Bluetooth LE Audio SoC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Qualcomm QCC5171 | Single-CPU architecture with integrated RF and DSP; supports LE Audio but lacks dual-Cortex-M0+ isolation and proprietary ~20 ms latency mode | Targeted at premium consumer headphones with higher power budget; less optimized for miniaturized hearables | Prefer NXH3675UK/A2Z when ultra-low latency and sub-22 mW streaming are mandatory |
| Infineon AIROC™ CYW20829 | BLE 5.3 + LE Audio compliant; uses Arm Cortex-M33 and proprietary audio engine; no dual-CoolFlux DSP or PDM mic inputs | Focused on industrial and smart-home audio gateways; requires external PDM-to-I2S bridge for mic support | Prefer NXH3675UK/A2Z when native PDM mic interface and integrated DSP-based voice enhancement are required |
Compared with QCC5171 and CYW20829, the NXH3675UK/A2Z uniquely combines dual isolated Cortex-M0+ cores, dual CoolFlux DSPs, native PDM input, and a verified ~20 ms latency profile - making it the only option qualified for battery-sensitive, latency-critical gaming and medical hearable designs without external signal chain components.
Availability
NXH3675UK/A2Z is available at Aetrix Electronics and suitable for gaming headsets, wireless conference speakerphones, hearing aids, and TV audio transmitter dongles requiring stable component supply, long-term lifecycle support, and full LE Audio 5.3 compliance.
Supply support for NXH3675UK/A2Z includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The NXH3675UK/A2Z belongs to NXP's EdgeVerse™ ultra-low-power audio SoC portfolio, engineered specifically for next-generation LE Audio endpoints where latency, power, and integration density are non-negotiable design constraints.
FAQ
What Bluetooth standard does the NXH3675UK/A2Z implement?
The NXH3675UK/A2Z implements Bluetooth 5.3 LE Audio with full certification, including support for the LC3 and LC3plus codecs, Auracast™ broadcast, and multi-stream unicast topologies. It complies with the Bluetooth SIG's LE Audio specification and is qualified for use in commercial products requiring interoperability with certified receivers and transmitters.
Does the NXH3675UK/A2Z support native PDM microphone inputs?
Yes, the NXH3675UK/A2Z integrates two dedicated digital PDM input terminals (PDM_IN0 and PDM_IN1), enabling direct connection of MEMS microphones without external PDM-to-I2S converters or ADCs. This reduces system BOM cost and PCB area while preserving signal integrity in noise-sensitive applications like hearing aids and conferencing devices.
What is the measured end-to-end latency of the NXH3675UK/A2Z in gaming mode?
The NXH3675UK/A2Z achieves ~20 ms end-to-end latency in its proprietary gaming profile, verified under simultaneous forward stereo (48 kHz/24-bit) and return mono (32 kHz/24-bit) streaming. This latency value is measured from source PCM input to speaker output and includes encoding, RF transmission, decoding, and analog output stages - all enabled by on-chip dual DSP and optimized protocol stack.
Is an external crystal required for the NXH3675UK/A2Z?
No, the NXH3675UK/A2Z includes an integrated low-power 16 MHz/32 MHz crystal oscillator with auto-tuning capacitors and automatic frequency selection. This eliminates the need for external crystal load capacitors and simplifies layout, while maintaining ±20 ppm frequency stability across temperature and voltage ranges specified in the NXH3675UK/A2Z datasheet.
Which development kits are officially supported for the NXH3675UK/A2Z?
NXP officially supports two starter kits for the NXH3675UK/A2Z: the NXH3675 EVK with LPC55 host MCU (for USB-audio applications) and the NXH3675 SDK with KL27 host MCU (for general-purpose evaluation). Both include PDM mic interfaces, I2S audio paths, SWD debug connectors, micro-USB for power/audio, and battery-powered operation - fully compatible with the NXH3675UK/A2Z silicon.
NXH3675UK/A2Z Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- -
- Interface:
- -
- Clock Rate:
- -
- Non-Volatile Memory:
- -
- On-Chip RAM:
- -
- Voltage - I/O:
- -
- Voltage - Core:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
NXH3675UK/A2Z FAQ
1.How can I place an order for NXH3675UK/A2Z through Aetrix?
Please submit a Request for Quotation (RFQ) for NXH3675UK/A2Z on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for NXH3675UK/A2Z reliable?
The price and inventory of NXH3675UK/A2Z are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for NXH3675UK/A2Z is usually 5 days.
3.What payment methods are accepted for NXH3675UK/A2Z?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for NXH3675UK/A2Z transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for NXH3675UK/A2Z?
NXH3675UK/A2Z orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your NXH3675UK/A2Z order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for NXH3675UK/A2Z?
For technical support, including NXH3675UK/A2Z datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your NXH3675UK/A2Z requirements.
6.How does Aetrix verify that NXH3675UK/A2Z is sourced from the original manufacturer or authorized distributors?
All NXH3675UK/A2Z products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that NXH3675UK/A2Z meets industry standards.
7.What is the process for return or replacement of NXH3675UK/A2Z?
All NXH3675UK/A2Z units undergo pre-shipment inspection (PSI). If there is an issue with NXH3675UK/A2Z, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The NXH3675UK/A2Z part is unused and in its original packaging.
Return procedure for NXH3675UK/A2Z:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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