Nexperia USA Inc. NXU0104GU12X

Overview

NXU0104GU12X from Nexperia is a 4-bit unidirectional dual-supply voltage level translating buffer with Schmitt-trigger inputs, 3-state outputs, and IOFF partial power-down protection. It translates data from A-side (VCCA) to B-side (VCCB) across independent 0.9 V–5.5 V supply domains, supports 250 Mbps max data rate at ≥1.8 V translation, features integrated 6.5 MΩ input pull-down resistors, and operates from –40 °C to +125 °C. It enables robust I/O bridging in mixed-voltage microcontroller interfaces.

For engineers reviewing the NXU0104GU12X datasheet, NXU0104GU12X pinout, NXU0104GU12X application, or NXU0104GU12X equivalent, key selection considerations include its dual-rail voltage flexibility (e.g., 1.2 V ↔ 3.3 V), Schmitt-trigger noise immunity for slow/noisy signals, OE pin compatibility with either VCCA or VCCB domain, suspend-mode behavior during supply loss, and XQFN12 package thermal performance (Rth(j-a) = 172 °C/W).

Technical Context

The NXU0104GU12X implements asynchronous unidirectional level translation using separate VCCA (input-side) and VCCB (output-side) supplies, each independently configurable from 0.9 V to 5.5 V. Its Schmitt-trigger inputs provide hysteresis (e.g., 0.96 V typical at 5.5 V) and tolerate slow edges, while integrated 6.5 MΩ pull-down resistors prevent floating states without external biasing.

Output enable (OE) is referenced to VCC(MIN) circuitry, allowing direct connection to either supply domain; when OE is LOW, all YBn outputs enter high-impedance state. The IOFF protection activates when either VCCA or VCCB drops below 100 mV or floats, blocking backflow current and enabling safe partial power-down without sequencing constraints.

Key Specifications

Pinout & Package

XQFN12 package (SOT1174-1): 1.70 mm × 2.0 mm × 0.50 mm body, 12-terminal leadless quad flat, thermal pad (GND) exposed on bottom, pin 1 index in lower-left corner.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-supply level translation applications.

Compared with NXU0204GU12 and NXU0304GU12, the NXU0104GU12X delivers optimal balance of channel count, speed, and unidirectional simplicity for fixed-data-path applications like microcontroller-to-peripheral bridging - avoiding unnecessary bidirectional overhead or underutilized pins.

Availability

NXU0104GU12X is available at Aetrix Electronics and suitable for industrial automation, automotive electronics, and portable medical devices requiring stable component supply across extended temperature ranges and mixed-voltage architectures.

Supply support for NXU0104GU12X includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert delivering high-performance, reliable components for automotive, industrial, and consumer markets, with leadership in logic, MOSFETs, and ESD protection.

The NXU0104 series belongs to Nexperia's advanced level translation product line, engineered specifically for robust, low-power, mixed-voltage system interconnect in space- and power-constrained designs.

FAQ

Can NXU0104GU12X translate from a higher voltage to a lower voltage (e.g., 5.0 V → 1.2 V)?

Yes - it supports both up-translation (e.g., 1.2 V → 3.3 V) and down-translation (e.g., 5.0 V → 1.2 V) with verified maximum data rates of 250 Mbps and 30 Mbps respectively under those conditions. Input voltage tolerance up to 5.5 V allows safe 5.0 V signals into 1.2 V VCCA domains without external clamping.

What happens to outputs when VCCA is powered but VCCB is disconnected?

When VCCB is disconnected (floating) or drops below 100 mV, the device enters suspend mode: all YBn outputs transition to high-impedance state, and IOFF circuitry blocks backflow current. This behavior is guaranteed per datasheet Section 8.4 and requires no external intervention.

Is the thermal pad on the XQFN12 package electrically connected?

Yes - the exposed thermal pad (pin 1 index area) is internally connected to GND and must be soldered to a PCB ground plane. Per SOT1174-1 mechanical drawing, it serves both thermal dissipation (Rth(j-c) = 82 °C/W) and electrical grounding; leaving it unconnected degrades thermal performance and may compromise ESD robustness.

Does OE require a pull-up resistor for reliable power-up behavior?

No - OE has no internal pull-up; however, the datasheet explicitly permits leaving OE floating or pulling it LOW to ensure outputs remain in high-impedance state during power-up/down. An external pull-down (e.g., 100 kΩ to GND) is recommended for deterministic startup in systems where OE is not actively driven.