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onsemi NZ8F3V9MX2WT5G
- Part No.:
- NZ8F3V9MX2WT5G
- Manufacturer:
- onsemi
- Category:
- Single Zener Diodes
- Package:
- 2-XDFN
- Datasheet:
-
NZ8F3V9MX2WT5G.pdf
- Description:
- DIODE ZENER 3.9V 250MW 2-X2DFNW
- Quantity:
- Payment:
- Shipping:
Inventory:7,760
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Product details
Overview
NZ8F3V9MX2WT5G from onsemi is a 3.65 V to 4.15 V standard-tolerance Zener diode in X2DFNW2 (0402) wettable flank package, rated for 250 mW dissipation on FR-4 with 1.5 mW/°C derating, designed for precision voltage clamping and ESD protection in space-constrained portable electronics.
For engineers reviewing the NZ8F3V9MX2WT5G datasheet, pinout, applications, or equivalent options, key selection criteria include its ±5% Zener tolerance, 5 Ω dynamic impedance at 5 mA, 5 µA leakage at 1 V reverse bias, 210 pF capacitance at 0 V, and AEC-Q101 qualification eligibility via SZ-prefix variants.
Technical Context
This unidirectional Zener diode operates in reverse breakdown to maintain stable reference voltage under transient overvoltage conditions. Its low 0.40 mm body height and wettable flank geometry support reliable automated optical inspection and high-density PCB assembly.
The device exhibits a nominal temperature coefficient of +9 mV/°C (typical for 3.9 V grade), forward voltage ≤0.9 V at 10 mA, and junction-to-ambient thermal resistance of 415 °C/W on minimum-pad FR-4 layout - enabling use in thermally constrained mobile and automotive control modules.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Zener Voltage (VZ) | 3.65 V min to 4.15 V max at IZT = 5 mA - defines clamping threshold for 3.3 V rail protection |
| Zener Impedance (ZZT) | 100 Ω max at IZT = 5 mA - ensures stable regulation under load transients |
| Reverse Leakage (IR) | 5 µA max at VR = 1 V - minimizes standby power loss in battery-powered systems |
| Capacitance (C) | 210 pF max at VR = 0 V, f = 1 MHz - impacts high-frequency noise filtering capability |
| Power Dissipation (PD) | 250 mW at TA = 25 °C on FR-4 (1 oz Cu, min pad) - sets thermal design margin for compact layouts |
| Package | X2DFNW2 (Case 711BG), 1.00 × 0.60 × 0.37 mm - enables 0402 footprint compatibility and AOI-ready solder joints |
| AEC-Q101 Eligibility | SZ-prefix variant available (SZNZ8F3V9MX2WT5G) - supports automotive control unit qualification paths |
Pinout & Package
X2DFNW2 surface-mount package with 0.65 mm pitch, 1.00 mm × 0.60 mm footprint, and 0.37 mm profile. Wettable flank side walls enable solder fillet inspection.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (Cathode) | Zener breakdown terminal | Connected to regulated voltage node; polarity must be observed to avoid forward conduction |
| 2 (Anode) | Reference/ground terminal | Tied to system ground or lower-potential rail; forms clamping path during overvoltage events |
Key Features
| Feature | Design Value |
|---|---|
| Wettable flank package | Enables 100% automated optical inspection of solder joints without x-ray, reducing post-reflow defect escapes |
| Low 0.40 mm height | Permits stacking under shields or placement near tall components in ultra-thin handheld enclosures |
| Pb-free, Halogen-free, RoHS-compliant | Meets IPC-J-STD-609 Category 1 material declarations and global environmental compliance requirements |
| 250 mW power rating with defined derating | Supports predictable thermal design on standard FR-4 with documented 1.5 mW/°C slope above 25 °C |
| Standard tolerance series (±5%) | Provides cost-optimized voltage clamping where tight regulation is not required, e.g., I/O rail protection |
Applications
| Smartphone Power Management | Automotive Body Control Module |
|---|---|
|
Use Scenario: Clamping 3.3 V I/O lines against ESD and load dump transients in LTE modem subsystems. IC Role / Device Role / Timing Role: Unidirectional voltage clamp protecting baseband processor GPIOs and PMIC communication interfaces. Use Value: 210 pF capacitance and 5 µA leakage preserve signal integrity and battery life while meeting IEC 61000-4-2 Level 4 immunity. |
Use Scenario: Regulating sensor supply rails in door module ECUs exposed to automotive battery fluctuations. IC Role / Device Role / Timing Role: Precision shunt regulator stabilizing 3.3 V analog front-end for Hall-effect position sensors. Use Value: ±5% VZ tolerance and +9 mV/°C TC ensure stable reference across −40 °C to +125 °C ambient range. |
| Wearable Health Monitor | Industrial IoT Sensor Node |
|
Use Scenario: Protecting ECG electrode inputs from electrostatic discharge during patient handling. IC Role / Device Role / Timing Role: Low-capacitance transient voltage suppressor placed directly at analog input connector. Use Value: 0.40 mm height allows placement within 2 mm of edge connector, minimizing trace inductance and improving ESD response. |
Use Scenario: Providing stable 3.3 V reference for ADCs measuring temperature and humidity in wireless sensor hubs. IC Role / Device Role / Timing Role: Shunt reference diode establishing accurate voltage threshold for analog comparators. Use Value: 100 Ω ZZT ensures <10 mV regulation error under 1 mA load variation, critical for 12-bit measurement accuracy. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Zener regulation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| BZX384-B3V9,115 (Nexperia) | Same 3.9 V nominal, ±5% tolerance, but SOD323 package (1.7 × 1.3 mm); 300 mW PD; 90 pF C | Larger footprint; higher power; lower capacitance - better for higher-energy transients, less suitable for 0402-constrained layouts | Select when board area permits larger package and lower capacitance is prioritized over miniaturization |
| MMSZ4685T1G (onsemi) | 3.9 V nominal, ±5%, SOD-123 package (2.7 × 1.6 mm); 500 mW PD; 30 pF C; no wettable flank | Higher power rating and lower capacitance, but incompatible with AOI and 0402 placement workflows | Choose for legacy designs using SOD-123 footprints or where thermal margin exceeds 250 mW requirement |
Compared with BZX384-B3V9,115 and MMSZ4685T1G, NZ8F3V9MX2WT5G uniquely combines 0402 footprint, wettable flank geometry, and AEC-Q101-qualified variant path - making it optimal for next-gen compact, inspectable, and automotive-capable designs.
Availability
NZ8F3V9MX2WT5G is available at Aetrix Electronics and suitable for smartphone power management, wearable health monitors, and industrial IoT sensor nodes requiring stable component supply with full traceability and lifecycle support.
Supply support for NZ8F3V9MX2WT5G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
onsemi (Semiconductor Components Industries, LLC) is a global semiconductor supplier delivering energy-efficient, intelligent power and sensing solutions for automotive, industrial, cloud, medical, and IoT applications.
NZ8F3V9MX2WT5G belongs to the NZ8F Series of miniature Zener diodes engineered specifically for high-density portable and automotive electronics where space, reliability, and manufacturability are critical.
FAQ
What is the Zener voltage tolerance of NZ8F3V9MX2WT5G?
The NZ8F3V9MX2WT5G has a standard tolerance of ±5%, resulting in a guaranteed Zener voltage range of 3.65 V to 4.15 V at test current IZT = 5 mA. This tolerance is specified per the NZ8FxxxMX2W series designation and confirmed in the Electrical Characteristics table on page 2 of the onsemi datasheet.
Does NZ8F3V9MX2WT5G support automotive qualification?
Yes - while NZ8F3V9MX2WT5G itself is the commercial-grade part, its SZ-prefix variant SZNZ8F3V9MX2WT5G is AEC-Q101 qualified and PPAP capable. The underlying die and X2DFNW2 package architecture are shared, enabling direct qualification path for automotive body control and infotainment modules.
What is the maximum reverse leakage current for NZ8F3V9MX2WT5G?
The maximum reverse leakage current (IR) for NZ8F3V9MX2WT5G is 5 µA at VR = 1 V and TA = 25 °C, as specified in the Electrical Characteristics table. This low leakage supports extended battery life in always-on wearable and sensor applications.
Can NZ8F3V9MX2WT5G be used for ESD protection?
Yes - NZ8F3V9MX2WT5G is routinely applied for I/O line ESD clamping due to its fast turn-on in reverse breakdown, 210 pF capacitance (suitable for low-speed digital and analog lines), and robust 40 W non-repetitive peak power rating, enabling effective suppression of IEC 61000-4-2 contact discharges.
What is the thermal resistance of NZ8F3V9MX2WT5G on a standard PCB?
The junction-to-ambient thermal resistance (RJA) of NZ8F3V9MX2WT5G is 415 °C/W when mounted on an FR-4 board with minimum pad (1 oz Cu), as stated in the Maximum Ratings table. Derating is 1.5 mW/°C above 25 °C ambient, defining safe operating limits for thermal design.
NZ8F3V9MX2WT5G Specifications
- Product attributes
- Attribute value
- Manufacturer:
- onsemi
- Series:
- NZ8F
- Package/Case:
- 2-XDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Voltage - Zener (Nom) (Vz):
- 3.9 V
- Tolerance:
- ±6.41%
- Power - Max:
- 250 mW
- Impedance (Max) (Zzt):
- 100 Ohms
- Current - Reverse Leakage @ Vr:
- 5 µA @ 1 V
- Voltage - Forward (Vf) (Max) @ If:
- 900 mV @ 10 mA
- Operating Temperature:
- -65°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 2-X2DFNW (1x0.6)
NZ8F3V9MX2WT5G FAQ
1.How can I place an order for NZ8F3V9MX2WT5G through Aetrix?
Please submit a Request for Quotation (RFQ) for NZ8F3V9MX2WT5G on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for NZ8F3V9MX2WT5G reliable?
The price and inventory of NZ8F3V9MX2WT5G are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for NZ8F3V9MX2WT5G is usually 5 days.
3.What payment methods are accepted for NZ8F3V9MX2WT5G?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for NZ8F3V9MX2WT5G transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for NZ8F3V9MX2WT5G?
NZ8F3V9MX2WT5G orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your NZ8F3V9MX2WT5G order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for NZ8F3V9MX2WT5G?
For technical support, including NZ8F3V9MX2WT5G datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your NZ8F3V9MX2WT5G requirements.
6.How does Aetrix verify that NZ8F3V9MX2WT5G is sourced from the original manufacturer or authorized distributors?
All NZ8F3V9MX2WT5G products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that NZ8F3V9MX2WT5G meets industry standards.
7.What is the process for return or replacement of NZ8F3V9MX2WT5G?
All NZ8F3V9MX2WT5G units undergo pre-shipment inspection (PSI). If there is an issue with NZ8F3V9MX2WT5G, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The NZ8F3V9MX2WT5G part is unused and in its original packaging.
Return procedure for NZ8F3V9MX2WT5G:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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