My Inquiry
My Account
onsemi NZD3V6MUT5G
- Part No.:
- NZD3V6MUT5G
- Manufacturer:
- onsemi
- Category:
- Single Zener Diodes
- Package:
- 0201 (0603 Metric)
- Datasheet:
-
NZD3V6MUT5G.pdf
- Description:
- DIODE ZENER 3.6V 300MW 2-X3DFN
- Quantity:
- Payment:
- Shipping:
Inventory:9,915
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
NZD3V6MUT5G from onsemi is a 3.6 V ±4.5% Zener diode in X3DFN2 (Case 152AF) package, rated for 200 mW steady-state power dissipation at 25 °C, with 100 Ω max Zener impedance at 5 mA test current and 10 µA reverse leakage at 2.88 V, designed for compact voltage regulation and ESD protection in space-constrained mobile electronics.
For engineers reviewing the NZD3V6MUT5G datasheet, pinout, applications, or equivalent options, key selection criteria include its 3.42–3.78 V Zener voltage range, 0.60 mm × 0.30 mm footprint, Class 3 (>8 kV HBM) ESD rating, MSL 1 reflow compatibility, and low 0.30 mm body height for ultra-thin portable designs.
Technical Context
This discrete Zener diode operates in reverse breakdown to clamp voltage transients and stabilize reference nodes. Its 200 mW power rating and 400 °C/W junction-to-ambient thermal resistance define safe operating limits under ambient conditions up to +150 °C.
The device uses silicon planar construction with Pb-free, halogen-free packaging compliant with RoHS. It features a marked cathode (Pin 1) and anode (Pin 2), supports any mounting orientation, and meets JEDEC MSL 1 requirements with peak reflow tolerance up to 260 °C for 10 seconds.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Zener Voltage (VZ) | 3.42 V min to 3.78 V max @ IZT = 5 mA - defines clamping threshold for overvoltage protection circuits |
| Power Dissipation (PD) | 200 mW @ TA = 25 °C - sets maximum continuous power handling on FR-5 board |
| Zener Impedance (ZZT) | ≤100 Ω @ IZT = 5 mA - ensures stable regulation under dynamic load changes |
| Reverse Leakage (IR) | ≤10 µA @ VR = 2.88 V - minimizes standby current in battery-powered systems |
| ESD Rating | Class 3 (>8 kV) per HBM - provides robust electrostatic discharge immunity without external protection |
| Package Dimensions | 0.60 mm × 0.30 mm × 0.30 mm - enables integration into sub-1 mm² PCB footprints |
| Junction Temp Range | −55 °C to +150 °C - supports operation in automotive cabin and industrial edge environments |
Pinout & Package
X3DFN2 package (Case 152AF) with 2-terminal surface-mount configuration, 0.35 mm pitch, and exposed die pad not electrically connected. Body outline: 0.62 mm × 0.32 mm × 0.24 mm; marking includes "J***" code indicating NZD3V6MUT5G variant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (Marked) | Cathode | Connected to regulated output node; reverse-biased during Zener conduction |
| 2 | Anode | Connected to ground or lower-potential rail; completes current path during clamping |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-small footprint | 0.60 mm × 0.30 mm area - fits high-density mobile PCB layouts where board space is constrained |
| Low profile height | 0.30 mm max - enables use under thin metal shields or in stacked module assemblies |
| High ESD robustness | Class 3 (>8 kV HBM) - eliminates need for supplemental TVS in many consumer interface lines |
| Pb-free & RoHS compliant | Halogen-free/BFR-free construction - satisfies global environmental compliance requirements for end products |
| MSL 1 rating | No floor life limitation - allows indefinite storage and single-reflow assembly without baking |
Applications
| USB Data Line Protection | Smartphone Power Rail Clamp |
|---|---|
Use Scenario: Protecting USB 2.0 D+ and D− lines from ESD events and coupling transients in handheld devices. IC Role / Device Role / Timing Role: Zener clamping diode placed between data line and ground to limit voltage excursion to ≤3.78 V. Use Value: Prevents damage to USB PHY transceivers by diverting >8 kV HBM strikes while adding <210 pF capacitance. | Use Scenario: Stabilizing 3.3 V LDO output against load dump or hot-swap surges in smartphone PMIC subsystems. IC Role / Device Role / Timing Role: Shunt regulator maintaining voltage within ±4.5% of nominal during transient overloads. Use Value: Enables reliable operation of baseband processors and memory interfaces without requiring larger 0402/0603 alternatives. |
| Wearable Sensor Reference Clamp | Bluetooth LE Module ESD Guard |
Use Scenario: Providing stable 3.6 V reference for analog sensor signal conditioning in hearables and fitness trackers. IC Role / Device Role / Timing Role: Precision Zener used as voltage reference for ADC biasing and op-amp feedback networks. Use Value: Delivers 3.42–3.78 V regulation with <100 Ω dynamic impedance, minimizing reference drift across temperature. | Use Scenario: Shielding Bluetooth antenna feedline and matching network from ESD during button actuation or connector insertion. IC Role / Device Role / Timing Role: Low-capacitance (210 pF) shunt protector preserving RF impedance integrity up to 2.4 GHz. Use Value: Maintains antenna VSWR stability while passing >8 kV HBM pulses without latch-up or parametric shift. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Zener regulation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| BZX584-C3V6 | 3.6 V ±5%, 300 mW, SOD-523 package (1.2 × 0.8 mm) | Larger footprint and higher power; less suitable for sub-1 mm² layouts | Select when higher surge energy handling is required and board space permits |
| MMSZ4685T1G | 3.6 V ±5%, 500 mW, SOD-123 package (3.7 × 1.6 mm) | 3× larger area, 2.5× higher power rating, lower thermal resistance | Prefer for industrial control inputs needing higher reliability margin under sustained overvoltage |
Compared with BZX584-C3V6 and MMSZ4685T1G, NZD3V6MUT5G offers the smallest PCB footprint and lowest profile among 3.6 V Zeners, making it optimal for ultra-compact mobile designs where volume and thickness are critical constraints - but requires careful thermal design due to its 400 °C/W RJA.
Availability
NZD3V6MUT5G is available at Aetrix Electronics and suitable for USB interface protection, smartphone power rail clamping, and wearable sensor reference applications requiring stable component supply with full traceability and long-term lifecycle support.
Supply support for NZD3V6MUT5G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
onsemi (formerly ON Semiconductor) is a global semiconductor supplier delivering energy-efficient, intelligent power and sensing solutions for automotive, industrial, cloud, medical, and IoT applications.
NZD3V6MUT5G belongs to the NZDxxxMU Series of micro-packaged Zener regulators, engineered specifically for space-constrained mobile and portable electronics requiring precision voltage clamping in minimal board area.
FAQ
What is the Zener voltage tolerance of NZD3V6MUT5G?
The NZD3V6MUT5G has a specified Zener voltage range of 3.42 V minimum to 3.78 V maximum at 5 mA test current (IZT), corresponding to a ±4.5% tolerance about the nominal 3.6 V rating. This tolerance is guaranteed across production lots and verified per onsemi's Electrical Characteristics table on page 3 of the official datasheet.
Does NZD3V6MUT5G have a built-in ESD protection rating?
Yes, NZD3V6MUT5G is rated Class 3 for Human Body Model (HBM) ESD with >8 kV withstand capability, as stated in the Specification Features section of the onsemi datasheet. This eliminates the need for additional discrete ESD protection in many low-speed signal paths such as I²C, GPIO, or USB data lines.
What is the thermal resistance of NZD3V6MUT5G and how does it affect layout?
NZD3V6MUT5G has a junction-to-ambient thermal resistance (RJA) of 400 °C/W on FR-5 board at 25 °C ambient. Due to this relatively high value, designers must avoid routing high-power traces near the device and consider localized copper relief or thermal vias only if operating continuously above 100 mW to prevent exceeding the +150 °C max junction temperature.
Is NZD3V6MUT5G compatible with lead-free reflow processes?
Yes, NZD3V6MUT5G is qualified for lead-free reflow with a maximum solder temperature of 260 °C for 10 seconds and meets JEDEC MSL 1 requirements. No floor life limitation applies, and no pre-baking is required prior to assembly - enabling direct placement into standard SMT lines without process modification.
What package type and marking identify NZD3V6MUT5G on the board?
NZD3V6MUT5G uses the X3DFN2 package (Case 152AF), measuring 0.62 mm × 0.32 mm × 0.24 mm. It is marked with "J***" on the top surface, where the asterisks denote date and lot codes; Pin 1 (cathode) is identified by the marking orientation per the generic diagram in the datasheet's mechanical section.
NZD3V6MUT5G Specifications
- Product attributes
- Attribute value
- Manufacturer:
- onsemi
- Series:
- -
- Package/Case:
- 0201 (0603 Metric)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Voltage - Zener (Nom) (Vz):
- 3.6 V
- Tolerance:
- ±5%
- Power - Max:
- 300 mW
- Impedance (Max) (Zzt):
- 100 Ohms
- Current - Reverse Leakage @ Vr:
- 10 µA @ 1 V
- Voltage - Forward (Vf) (Max) @ If:
- 1.1 V @ 10 mA
- Operating Temperature:
- -55°C ~ 150°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 2-X3DFN (0.6x0.3) (0201)
NZD3V6MUT5G FAQ
1.How can I place an order for NZD3V6MUT5G through Aetrix?
Please submit a Request for Quotation (RFQ) for NZD3V6MUT5G on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for NZD3V6MUT5G reliable?
The price and inventory of NZD3V6MUT5G are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for NZD3V6MUT5G is usually 5 days.
3.What payment methods are accepted for NZD3V6MUT5G?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for NZD3V6MUT5G transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for NZD3V6MUT5G?
NZD3V6MUT5G orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your NZD3V6MUT5G order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for NZD3V6MUT5G?
For technical support, including NZD3V6MUT5G datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your NZD3V6MUT5G requirements.
6.How does Aetrix verify that NZD3V6MUT5G is sourced from the original manufacturer or authorized distributors?
All NZD3V6MUT5G products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that NZD3V6MUT5G meets industry standards.
7.What is the process for return or replacement of NZD3V6MUT5G?
All NZD3V6MUT5G units undergo pre-shipment inspection (PSI). If there is an issue with NZD3V6MUT5G, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The NZD3V6MUT5G part is unused and in its original packaging.
Return procedure for NZD3V6MUT5G:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
NZD3V6MUT5G Tags
-
MMBZ5240B-7-F
Diodes Incorporated
-
BZT52C5V6T-7
Diodes Incorporated
-
MMSZ5231B-7-F
Diodes Incorporated
-
BZT52C15-7-F
Diodes Incorporated
-
BZX84C3V3LT1G
onsemi
-
MMSZ5245BS-7-F
Diodes Incorporated
-
MMSZ4682T1G
onsemi
-
BZT52C15S-7-F
Diodes Incorporated
-
MM5Z5V1ST1G
onsemi
-
SMAJ4744A-TP
Micro Commercial Co
-
BZT52C3V6LP-7
Diodes Incorporated
-
SMAZ12-13-F
Diodes Incorporated
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
