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NXP Semiconductors OM13537UL
- Part No.:
- OM13537UL
- Manufacturer:
- NXP Semiconductors
- Category:
- RF, RFID, Wireless Evaluation Boards
- Package:
- Datasheet:
-
OM13537UL.pdf
- Description:
- SA630D DEMOBOARD
- Quantity:
- Payment:
- Shipping:
Inventory:4,986
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Product details
Overview
OM13537UL from NXP Semiconductors is a BiCMOS-based Single-Pole Double-Throw (SPDT) RF switch designed for signal routing in DC–1 GHz 50 Ω systems. It features CMOS/TTL-compatible enable control (ENCH1), 1 dB typical insertion loss at 200 MHz, 60 dB off-channel isolation at 100 MHz, and ultra-low 170 µA supply current at 5 V-making it ideal for portable digital transceiver front-ends and antenna switching applications.
For engineers reviewing the OM13537UL datasheet, OM13537UL pinout, OM13537UL application, or OM13537UL equivalent, key selection considerations include its bidirectional operation, internal 50 Ω OFF-channel termination, +18 dBm 1 dB compression point at 300 MHz, fast 20 ns switching, and SO8 surface-mount package compatibility with standard PCB layout practices for RF signal integrity.
Technical Context
The OM13537UL implements a monolithic SPDT switch architecture with integrated CMOS/TTL drivers and on-chip 50 Ω termination on the inactive path. Its BiCMOS process enables simultaneous low distortion (IP3 = +33 dBm), high linearity (+18 dBm P1dB), and low DC power consumption.
Control logic is level-sensitive: ENCH1 (pin 4) directly selects channel routing-logic HIGH activates OUT1 (pin 8), logic LOW activates OUT2 (pin 5). AC_GND (pin 7) requires external 0.01 µF bypassing to ground for optimal high-frequency isolation and return loss performance.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Frequency Range | DC to 1 GHz - supports broadband RF routing without external tuning across cellular, ISM, and short-range wireless bands. |
| Insertion Loss | 1 dB typical at 200 MHz - ensures minimal signal attenuation in active path, preserving SNR in receiver chains and transmitter output efficiency. |
| Off-Channel Isolation | 60 dB at 100 MHz - suppresses crosstalk between paths, critical for FSK/ASK modulation integrity and antenna diversity switching. |
| Supply Current | 170 µA at 5 V - enables multi-year battery life in handheld devices such as CT2 cordless phones and portable IoT transceivers. |
| Switching Speed | 20 ns typical turn-off delay - supports high-speed time-division duplex (TDD) and burst-mode communication protocols. |
| Input Power Handling | +20 dBm maximum input power - accommodates typical RF front-end signal levels without damage or compression. |
| Third-Order Intercept | +33 dBm - maintains signal fidelity under multi-tone conditions, essential for dense spectral environments like TDMA systems. |
Pinout & Package
OM13537UL is housed in an 8-pin SO (SO8, SOT96-1) surface-mount package with 3.9 mm body width and standard lead pitch. The package supports reflow soldering per J-STD-020D lead-free profiles and includes moisture sensitivity level (MSL) handling guidance.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD (pin 1) | Positive supply rail | Accepts 3.0–5.5 V; powers internal drivers and switch core; requires local 0.1 µF bypass capacitor. |
| GND (pins 2, 6) | Digital and RF ground reference | Provides return path for logic and RF currents; pins must be connected to low-inductance ground plane. |
| INPUT (pin 3) | Common RF input port | Bidirectional RF node; connects to antenna, filter bank, or modulator output; 50 Ω matched. |
| ENCH1 (pin 4) | CMOS/TTL enable input | Logic-controlled channel selector: HIGH → INPUT→OUT1; LOW → INPUT→OUT2; VIH ≥ 2.0 V, VIL ≤ 0.8 V. |
| OUT2 (pin 5) | Secondary RF output port | Active when ENCH1 = LOW; internally terminated to 50 Ω when inactive; requires AC_GND (pin 7) bypassing. |
| AC_GND (pin 7) | RF ground bypass node | Must connect to ground via 0.01 µF capacitor placed adjacent to package; critical for >100 MHz isolation and return loss. |
| OUT1 (pin 8) | Primary RF output port | Active when ENCH1 = HIGH; matches OUT2 in loss and return loss up to 1.2 GHz; symmetric routing recommended. |
Key Features
| Feature | Design Value |
|---|---|
| Wideband DC–1 GHz operation | Enables single-device replacement of PIN diode switches across multiple wireless standards without redesign. |
| Internal 50 Ω OFF-port termination | Eliminates need for external termination resistors, reducing BOM count and PCB area while stabilizing VSWR. |
| +33 dBm IP3 and +18 dBm P1dB | Supports high-dynamic-range FSK/ASK generation and robust front-end switching in crowded RF environments. |
| 20 ns switching with 5 ns rise/fall | Meets timing requirements for burst-mode TDMA, Bluetooth LE advertising, and narrow-pulse radar applications. |
| Full ESD protection | Withstands HBM ±2 kV, enabling reliable handling and assembly in standard manufacturing environments. |
Applications
| Digital Transceiver Front-End | Antenna Switching |
|---|---|
Use Scenario: Replacing bulky duplexers in TDMA/digital RF transceivers for CT2 cordless telephones and portable radios. IC Role / Device Role / Timing Role: SPDT RF switch routing IF or RF signals between TX and RX paths under microcontroller TTL control. Use Value: Reduces board space by >60% vs. discrete PIN diode solutions while maintaining 60 dB isolation and <1 dB loss at 100–500 MHz. |
Use Scenario: Selecting between primary and diversity antennas in handheld wireless devices. IC Role / Device Role / Timing Role: Bidirectional RF path selector with automatic 50 Ω OFF-port termination to prevent impedance mismatch reflections. Use Value: Improves receive sensitivity by 2–3 dB through consistent 50 Ω match on both ports and eliminates external termination components. |
| Filter Bank Selection | FSK Signal Generation |
Use Scenario: Dynamically routing RF signals through different bandpass filters (e.g., GSM 900/1800, LTE Band 1/3/7) in software-defined radios. IC Role / Device Role / Timing Role: Low-loss, high-isolation RF multiplexer controlled by baseband processor GPIOs. Use Value: Enables sub-100 ns filter reconfiguration with <0.5 dB path-to-path loss variation up to 900 MHz, supporting agile frequency hopping. |
Use Scenario: Generating Frequency Shift Keying (FSK) modulation by toggling between two VCO outputs in digital RF transmitters. IC Role / Device Role / Timing Role: High-linearity RF switch selecting between f1 and f2 carrier sources under TTL data stream control. Use Value: Delivers clean FSK output with <−60 dBc spurious content due to +33 dBm IP3 and 20 ns edge-controlled switching. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SPDT RF switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Qorvo QM11028 | Wider bandwidth (DC–3.5 GHz), higher P1dB (+27 dBm), but 3.3 V only and 1.2 mA supply current. | Better suited for 5G NR sub-6 GHz front-ends requiring extended frequency coverage and higher power handling. | Select QM11028 when operating above 1 GHz or requiring >+20 dBm output; OM13537UL remains optimal for cost-sensitive 5 V portable designs below 1 GHz. |
| Skyworks SKY13350-374LF | Lower insertion loss (0.6 dB typ. @ 900 MHz), same SO8 package, but no internal 50 Ω termination and higher 350 µA supply current. | Requires external 50 Ω shunt on OFF port; preferred where ultimate loss minimization outweighs BOM simplicity. | Choose SKY13350-374LF for ultra-low-loss receive paths; OM13537UL offers superior integration and lower quiescent power for battery-constrained systems. |
Compared with QM11028 and SKY13350-374LF, OM13537UL uniquely balances ultra-low 170 µA supply current, integrated 50 Ω OFF-port termination, and proven 1 GHz performance in a standard SO8 footprint-making it the most efficient choice for 5 V, size- and power-constrained digital transceivers.
Availability
OM13537UL is available at Aetrix Electronics and suitable for digital transceiver front-ends, antenna switching modules, and FSK/ASK modulation circuits requiring stable component supply, long-term lifecycle support, and traceable sourcing for production ramp.
Supply support for OM13537UL includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and consumer applications, with deep expertise in RF analog and mixed-signal IC design.
The OM13537UL belongs to NXP's legacy RF switch product line, engineered specifically for low-power, high-isolation signal routing in portable digital wireless equipment-emphasizing integration, ESD robustness, and ease of RF layout.
FAQ
What is the absolute maximum supply voltage for OM13537UL?
The OM13537UL has an absolute maximum supply voltage (VDD) of +5.5 V. Operation beyond this rating risks permanent damage. The recommended operating range is 3.0 V to 5.5 V, with typical performance characterized at +5 V. Exceeding the 5.5 V limit-even momentarily-may degrade internal BiCMOS junctions or compromise ESD protection structures in the OM13537UL.
Does OM13537UL require external termination resistors on its OFF port?
No, OM13537UL does not require external termination resistors on its OFF port. It integrates a precise 50 Ω resistor internally on the inactive path, eliminating the need for external components and simplifying PCB layout. This feature is confirmed in the datasheet's "Features and benefits" section and validated in Figure 3 (equivalent circuit) and Section 14 (application information) of the OM13537UL documentation.
What is the role of the AC_GND pin (pin 7) on OM13537UL?
The AC_GND pin (pin 7) on OM13537UL serves as a dedicated RF ground bypass node that must be connected to system ground via a 0.01 µF capacitor placed as close as possible to the package. This connection is critical for achieving specified isolation (>60 dB at 100 MHz) and return loss (>17 dB at 400 MHz); omitting or misplacing this capacitor degrades high-frequency performance significantly in the OM13537UL.
Can OM13537UL operate with 3.3 V logic control signals?
Yes, OM13537UL accepts 3.3 V logic control signals on ENCH1 (pin 4). Its VIH threshold is specified as ≥2.0 V, and VIL as ≤0.8 V, making it fully compatible with 3.3 V CMOS/TTL logic families. The OM13537UL's enable input is voltage-level compatible-not current-driven-so no level-shifting circuitry is required when interfacing with 3.3 V microcontrollers or FPGAs.
Is OM13537UL suitable for automotive applications?
No, OM13537UL is not automotive-qualified. Per NXP's legal disclaimers in the datasheet, it is classified as a non-automotive qualified product-neither tested nor warranted for AEC-Q100 compliance, extended temperature operation beyond −40 °C to +85 °C, or safety-critical use. For automotive applications, designers must select explicitly qualified alternatives; OM13537UL is intended for industrial, consumer, and portable wireless equipment only.
OM13537UL Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Type:
- Switch, SPDT
- Frequency:
- 0Hz ~ 1GHz
- Contents:
- Board(s)
- Utilized IC / Part:
- SA630
OM13537UL FAQ
1.How can I place an order for OM13537UL through Aetrix?
Please submit a Request for Quotation (RFQ) for OM13537UL on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for OM13537UL reliable?
The price and inventory of OM13537UL are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for OM13537UL is usually 5 days.
3.What payment methods are accepted for OM13537UL?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for OM13537UL transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for OM13537UL?
OM13537UL orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your OM13537UL order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for OM13537UL?
For technical support, including OM13537UL datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your OM13537UL requirements.
6.How does Aetrix verify that OM13537UL is sourced from the original manufacturer or authorized distributors?
All OM13537UL products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that OM13537UL meets industry standards.
7.What is the process for return or replacement of OM13537UL?
All OM13537UL units undergo pre-shipment inspection (PSI). If there is an issue with OM13537UL, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The OM13537UL part is unused and in its original packaging.
Return procedure for OM13537UL:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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