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NXP Semiconductors OM5569/NT312D,699
- Part No.:
- OM5569/NT312D,699
- Manufacturer:
- NXP Semiconductors
- Category:
- RF, RFID, Wireless Evaluation Boards
- Package:
- Datasheet:
-
OM5569/NT312D,699.pdf
- Description:
- DEMO BOARD NTAG I2C
- Quantity:
- Payment:
- Shipping:
Inventory:4,490
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Product details
Overview
OM5569/NT312D,699 from NXP Semiconductors is an NFC Forum Type 2 Tag IC with integrated I²C interface, energy harvesting capability, and a configurable field detection pin. It features 888 bytes of user EEPROM memory, 64-byte SRAM buffer for pass-through mode, and supports 13.56 MHz RF communication at 106 kbit/s - enabling zero-power configuration and firmware updates in smart home appliances.
For engineers reviewing the OM5569/NT312D,699 datasheet, OM5569/NT312D,699 pinout, OM5569/NT312D,699 application, or OM5569/NT312D,699 equivalent, this device serves as a dual-interface (RF + I²C) secure tag for dynamic NDEF message handling, microcontroller wake-up triggering, and low-power peripheral powering in embedded consumer electronics.
Technical Context
The OM5569/NT312D,699 implements ISO/IEC 14443-3A-compliant RF interface with true anticollision and 7-byte UID, alongside a standard I²C slave interface supporting 100 kHz/400 kHz modes. Its arbitration logic enforces first-come-first-served access between RF and I²C interfaces, with status flags indicating EEPROM read/write busy states.
Energy harvesting delivers up to 3.3 V at ~5 mA from the RF field to power external microcontrollers; the FD pin provides open-drain wake-up signaling on RF field presence, first communication start, or tag selection only - all programmable via configuration registers.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| RF Standard | NFC Forum Type 2 Tag compliant per ISO/IEC 14443-3A; enables interoperability with all NFC smartphones and readers. |
| Memory Capacity | 888 bytes user EEPROM (222 pages × 4 bytes); sufficient for full NDEF messages in consumer appliance configuration profiles. |
| SRAM Buffer | 64 bytes volatile memory mapped at I²C addresses F8h–FBh; enables unlimited write cycles and fast RF↔I²C data transfer in pass-through mode. |
| Operating Frequency | 13.56 MHz RF carrier; ensures global regulatory compliance and stable coupling with standard NFC antennas. |
| I²C Speed | Supports Standard (100 kHz) and Fast Mode (400 kHz); allows efficient host-side firmware updates without bus contention delays. |
| Energy Harvesting | Delivers regulated output voltage (VOUT) up to 3.3 V; powers ultra-low-power MCUs or sensors without local battery. |
| Field Detection | Configurable open-drain FD pin triggers on RF field presence, first command, or selection only - reduces host polling overhead. |
Pinout & Package
OM5569/NT312D,699 is supplied in TSSOP8 package (SOT505-1), 3 mm body width, 8-pin leaded surface-mount format compatible with automated assembly.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | SDA | I²C bidirectional data line; connects directly to MCU SDA with pull-up resistor; supports standard/fast mode timing. |
| 2 | VCC | External power supply input (1.8–3.6 V); enables I²C operation and SRAM access independent of RF field. |
| 3 | VOUT | Energy harvesting output; supplies regulated voltage to external low-power devices (e.g., MCU sleep-mode circuitry). |
| 4 | LB | Antenna connection terminal B; forms resonant LC tank with LA; requires matching network per antenna design. |
| 5 | FD | Configurable field detection output; open-drain, active-low signal used to wake host MCU on RF activity events. |
| 6 | SCL | I²C clock input; synchronous timing reference for host-controlled memory reads/writes and configuration updates. |
| 7 | VSS | Ground reference for both I²C and RF sections; must be low-impedance common return path. |
| 8 | LA | Antenna connection terminal A; completes RF coil interface; layout symmetry with LB critical for impedance matching. |
Key Features
| Feature | Design Value |
|---|---|
| Pass-through mode | 64-byte SRAM mirrored to fixed RF address range (240–255) when enabled - eliminates EEPROM write endurance limits during frequent NDEF updates. |
| FAST READ command | Reads up to 1024 bytes in single frame (max 9235 bits); accelerates host-side firmware or configuration retrieval vs. standard 16-byte reads. |
| Dynamic page locking | Three dynamic lock bytes protect extended memory (pages 10h+) in 16-page blocks (1k version); prevents accidental overwrites post-deployment. |
| Static lock byte control | Byte 2/3 of page 02h configure per-page (03h–0Fh) and block-level (CC, 04h–09h, 0Ah–0Fh) write protection - irreversible via RF, reconfigurable via I²C. |
| UID and capability container | Factory-programmed 7-byte UID (SN0 = 04h) and writable CC (page 03h) enable NDEF formatting and NFC Forum compliance verification. |
Applications
| Smart Home Appliance Setup | Healthcare Device Pairing |
|---|---|
|
Use Scenario: NFC-enabled smartphone taps refrigerator to load Wi-Fi credentials and usage preferences during initial setup. IC Role / Device Role / Timing Role: OM5569/NT312D,699 acts as dual-interface configuration store: RF receives encrypted SSID/password; I²C writes to appliance MCU flash via pass-through SRAM. Use Value: Eliminates manual entry and QR scanning; enables secure, one-tap provisioning without battery-powered BLE modules. |
Use Scenario: Patient taps NFC wristband against blood glucose meter to exchange calibration data and session keys. IC Role / Device Role / Timing Role: OM5569/NT312D,699 serves as trusted intermediary: RF reads encrypted calibration token; I²C delivers it to meter's secure element via FAST READ. Use Value: Prevents manual transcription errors; supports HIPAA-compliant data handoff without cloud dependency or pairing delays. |
| Printer Firmware Update | Industrial Sensor Node Configuration |
|
Use Scenario: Technician uses NFC-enabled tablet to push firmware patches to networked laser printer via embedded NTAG. IC Role / Device Role / Timing Role: OM5569/NT312D,699 buffers update payload in SRAM; I²C streams validated binary to printer SoC while RF remains available for status queries. Use Value: Enables field updates without opening enclosure or connecting cables; leverages existing NFC infrastructure for maintenance efficiency. |
Use Scenario: Engineer deploys wireless sensor node by tapping NFC programmer to configure sampling rate, thresholds, and LoRaWAN keys. IC Role / Device Role / Timing Role: OM5569/NT312D,699 stores configuration in locked EEPROM pages; FD pin wakes sensor MCU only when new settings arrive. Use Value: Reduces standby current by >90% vs. continuous I²C polling; ensures tamper-resistant parameter storage in harsh environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar NFC+I²C tag applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NT3H1101W0FHK | Same XQFN8 package (1.6×1.6×0.6 mm), identical 1k memory map and pinout; differs only in wafer-level bumping vs. leadframe packaging. | Preferred for space-constrained PCBs requiring minimal footprint; lacks TSSOP8's mechanical robustness for high-vibration environments. | Select NT3H1101W0FHK if board area is critical and reflow profile supports ultra-thin QFN; OM5569/NT312D,699 offers easier optical inspection and repair. |
| NT3H1201W0FTT | 2k EEPROM (1904 bytes) in same TSSOP8 package; shares identical I²C/RF timing, FD functionality, and energy harvesting specs. | Required when NDEF payloads exceed 888 bytes (e.g., multi-language UI strings or firmware manifests); no change to host driver stack. | Choose NT3H1201W0FTT for future-proofing or complex configuration sets; OM5569/NT312D,699 optimizes cost where 1k capacity suffices. |
Compared with NT3H1101W0FHK and NT3H1201W0FTT, OM5569/NT312D,699 provides identical functional behavior and pin compatibility in TSSOP8, but targets cost-sensitive volume production with optimized test and marking - making it ideal for high-yield consumer appliance manufacturing.
Availability
OM5569/NT312D,699 is available at Aetrix Electronics and suitable for smart home appliances, healthcare devices, industrial sensor nodes, and printer firmware updates requiring stable component supply across multi-year production cycles.
Supply support for OM5569/NT312D,699 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with core expertise in NFC, RFID, and embedded security.
The NTAG I²C product line - including OM5569/NT312D,699 - was designed specifically to bridge contactless and wired interfaces in battery-free or ultra-low-power edge devices, enabling seamless smartphone-driven configuration and maintenance.
FAQ
What is the memory configuration of OM5569/NT312D,699?
OM5569/NT312D,699 contains 888 bytes of user-accessible EEPROM (222 pages × 4 bytes), plus 64 bytes of SRAM for volatile high-speed buffering. The EEPROM retains data for 20 years with 500,000 write cycles, while the SRAM supports unlimited writes and is accessible only when VCC is applied.
Does OM5569/NT312D,699 support energy harvesting for external devices?
Yes, OM5569/NT312D,699 integrates energy harvesting circuitry that delivers a regulated output voltage (VOUT) up to 3.3 V. This can power low-power microcontrollers or sensors directly from the RF field - eliminating the need for local batteries in applications like smart tags or maintenance-free sensors.
How does the field detection (FD) pin function on OM5569/NT312D,699?
The FD pin on OM5569/NT312D,699 is a configurable open-drain output that signals RF activity events - including RF field presence, first communication start, or tag selection only. It wakes host microcontrollers efficiently, reducing polling overhead and system power consumption in always-on designs.
Can OM5569/NT312D,699 operate using only RF power, or does it require VCC?
OM5569/NT312D,699 operates in passive RF-only mode for basic NFC tag functions (e.g., reading NDEF messages). However, I²C communication, SRAM access, and energy harvesting output require external VCC (1.8–3.6 V) - enabling hybrid operation where RF initiates and I²C handles high-bandwidth data transfer.
Is OM5569/NT312D,699 pin-compatible with other NTAG I²C variants?
Yes, OM5569/NT312D,699 uses the TSSOP8 package (SOT505-1) with identical pinout to NT3H1101W0FTT and NT3H1201W0FTT. All share the same LA/LB antenna connections, SDA/SCL/I²C interface, FD trigger, VCC, VSS, and VOUT assignments - allowing direct substitution in existing layouts.
OM5569/NT312D,699 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Packaging:
- Box
- Product Status:
- Obsolete
- Type:
- Near Field Communication (NFC)
- Frequency:
- 13.56MHz
- Contents:
- Board(s)
- Utilized IC / Part:
- NT3H1101
OM5569/NT312D,699 FAQ
1.How can I place an order for OM5569/NT312D,699 through Aetrix?
Please submit a Request for Quotation (RFQ) for OM5569/NT312D,699 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for OM5569/NT312D,699 reliable?
The price and inventory of OM5569/NT312D,699 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for OM5569/NT312D,699 is usually 5 days.
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OM5569/NT312D,699 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your OM5569/NT312D,699 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for OM5569/NT312D,699?
For technical support, including OM5569/NT312D,699 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your OM5569/NT312D,699 requirements.
6.How does Aetrix verify that OM5569/NT312D,699 is sourced from the original manufacturer or authorized distributors?
All OM5569/NT312D,699 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that OM5569/NT312D,699 meets industry standards.
7.What is the process for return or replacement of OM5569/NT312D,699?
All OM5569/NT312D,699 units undergo pre-shipment inspection (PSI). If there is an issue with OM5569/NT312D,699, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The OM5569/NT312D,699 part is unused and in its original packaging.
Return procedure for OM5569/NT312D,699:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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