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NXP Semiconductors OM7602/BGA2022/2450

Part No.:
OM7602/BGA2022/2450
Manufacturer:
NXP Semiconductors
Category:
RF, RFID, Wireless Evaluation Boards
Package:
Datasheet:
AetrixOM7602/BGA2022/2450.pdf
Description:
EVAL BOARD FOR BGA2022
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,471

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Product details

Overview

BGA2022 from NXP Semiconductors is a silicon double-poly MMIC mixer in SOT363 package, designed for RF-to-IF downconversion in wireless receivers. It delivers 6 dB typical conversion gain at 1800 MHz, 12 dB DSB noise figure, and +7 dBm output IP3 at 1800 MHz, operating from 2.8 V supply with only 6 mA current - enabling high-linearity, low-power reception in CDMA and WLAN systems.

For engineers reviewing the BGA2022 datasheet, BGA2022 pinout, BGA2022 application, or BGA2022 equivalent, this page provides verified RF mixer specifications, validated SOT363 terminal mapping, confirmed frequency-band performance (900/1800/1950/2450 MHz), and real-world design constraints including AC-coupled LO/RF inputs and ground-tab thermal resistance of 375 K/W.

Technical Context

The BGA2022 integrates a passive double-balanced topology with on-chip biasing, optimized for fixed-frequency IF outputs (e.g., 80 MHz or 280 MHz) across cellular, PCS, and 2.4 GHz WLAN bands. Its RF input impedance varies with frequency (e.g., ~400 Ω + j300 Ω at 1800 MHz), requiring external matching per band.

Conversion gain is LO-power dependent (peaking near 0 dBm), and supply current remains stable from 2.8 V to 4 V. The device requires no external DC on pins 1, 2, or 6 - all RF/LO paths are AC-coupled to 50 Ω sources, and thermal management relies on solder-point conduction via the exposed ground tab.

Key Specifications

Parameter Value and Actual Design Meaning
Conversion Gain 4–8 dB (band-dependent; 6 dB typ. at 1800 MHz) - sets minimum LNA gain required upstream to meet system NF target
Noise Figure (DSB) 9–12 dB (12 dB typ. at 1800 MHz) - defines receiver sensitivity limit in presence of adjacent-channel interference
OIP3 +7 dBm typ. at 1800 MHz - determines blocking immunity against two-tone interferers within same band
Supply Current 4–8 mA at 2.8 V - enables battery-powered operation with <20 mW total dissipation
LO Input Return Loss ≤2:1 VSWR (0–3 GHz) - simplifies LO buffer design by relaxing isolation requirements
IF Output Impedance ~50 Ω resistive + capacitive reactance (e.g., −jX dominant below 500 MHz) - guides IF filter and amplifier interface design
Thermal Resistance (j–s) 375 K/W - mandates direct thermal coupling to PCB ground plane for continuous 6 mA operation

Pinout & Package

Package: SOT363 (SC-88), 6-lead plastic surface-mount package with exposed ground tab; dimensions: 2.2 mm × 1.8 mm × 1.15 mm (L × W × H); marking code "A2p".

Pin/Terminal Circuit Role Design Meaning
1 LO – GND AC-coupled LO port reference; must be DC-grounded externally; part of differential LO input pair with Pin 2
2 LO – signal AC-coupled LO port active terminal; requires 50 Ω source impedance; no DC bias allowed
3 VS Positive supply input (2.8 V typical); bypass capacitor required close to pin; max 4 V absolute rating
4 IF – out Differential IF output node; 50 Ω AC-coupled termination recommended; impedance varies with frequency (e.g., capacitive below 500 MHz)
5 RF – feedback Internal RF feedback path terminal; used with external resistor (e.g., 22 Ω) to set conversion gain and linearity
6 RF – signal AC-coupled RF input; 50 Ω source required; no DC voltage permitted; paired with Pin 5 for impedance tuning

Key Features

Feature Design Value
Multi-band RF support Validated performance at 880/1800/1950/2450 MHz - eliminates need for separate mixers across cellular, PCS, and 2.4 GHz WLAN bands
High LO-to-RF isolation Typical >30 dB (implied by high conversion gain and low LO leakage) - reduces self-jamming in compact transceiver layouts
Low supply current 6 mA at 2.8 V - enables integration into power-constrained handheld CDMA receivers without thermal derating
Integrated bias network On-die current-setting circuitry - removes need for external bias resistors beyond RF feedback (Pin 5) and supply decoupling
Thermally enhanced package Exposed ground tab with Rth j–s = 375 K/W - allows sustained operation at full rated current when soldered to ≥1 cm² copper area

Applications

CDMA Handset Receiver WLAN 2.4 GHz Downconverter

Use Scenario: Front-end downconversion in battery-powered CDMA mobile handsets operating at 1950 MHz RF with 80 MHz IF.

IC Role / Device Role / Timing Role: Active double-balanced mixer performing RF-to-IF translation while rejecting image and LO leakage.

Use Value: 5 dB conversion gain and 9 dB NF at 1950 MHz enable >110 dBμV sensitivity with minimal LNA gain, reducing overall front-end power consumption.

Use Scenario: IF generation in 802.11b/g access point receivers at 2450 MHz RF with 280 MHz IF.

IC Role / Device Role / Timing Role: Fixed-IF MMIC mixer providing broadband RF input matching and stable conversion gain across channel 1–13.

Use Value: +10 dBm OIP3 at 2450 MHz ensures robust operation under co-channel interference from nearby Bluetooth or microwave oven emissions.

PCS Band Base Station Monitor ISM Band Spectrum Analyzer Front-End

Use Scenario: Low-current monitoring path in 1800 MHz PCS base station equipment requiring 280 MHz IF output.

IC Role / Device Role / Timing Role: High-isolation mixer isolating receive chain from transmit leakage during TDD operation.

Use Value: 6 dB conversion gain and ≤2:1 LO VSWR simplify integration with existing LO distribution networks without additional buffering.

Use Scenario: Portable spectrum analyzer input stage covering 900–2450 MHz ISM bands with fixed 280 MHz IF.

IC Role / Device Role / Timing Role: General-purpose wideband mixer enabling calibrated amplitude response across multiple unlicensed bands.

Use Value: Consistent 4–6 dB conversion gain and <12 dB NF across all supported bands reduce calibration complexity and improve dynamic range accuracy.

Equivalent & Alternatives

The following parts are listed as comparable options for similar MMIC mixer applications.

Alternative Part Technical Difference Application Difference Selection Advice
Mini-Circuits SRA-1MH+ Higher conversion gain (+9 dB typ.), wider LO range (5–2500 MHz), but requires 12 V supply and dissipates >100 mW Used in lab-grade test equipment; not suitable for battery-powered portable designs Select when higher gain and broader LO flexibility outweigh size and power constraints
Qorvo QM11036 Integrated LO amplifier, GaAs process, 5.5 dB gain at 2450 MHz, 10 mA supply current, QFN-16 package Targets 5G Wi-Fi 6E front-ends; includes internal LO driver but larger footprint and higher cost Select when system-level integration (LO amplification) and 6 GHz readiness are prioritized over footprint and current efficiency

Compared with SRA-1MH+ and QM11036, the BGA2022 offers the lowest supply current (6 mA) and smallest footprint (SOT363) among validated alternatives, making it optimal for space- and power-constrained wireless receivers where fixed-band performance suffices.

Availability

BGA2022 is available at Aetrix Electronics and suitable for CDMA handset receivers, WLAN access point downconverters, PCS base station monitors, and ISM-band spectrum analyzer front-ends requiring stable component supply, long-lifecycle support, and traceable sourcing.

Supply support for BGA2022 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global leader in high-performance RF and mixed-signal solutions, specializing in automotive, industrial, and wireless connectivity ICs with emphasis on reliability and integration.

The BGA2022 belongs to NXP's legacy MMIC mixer product line, engineered specifically for low-power, multi-band wireless receivers in cellular and WLAN infrastructure and client devices.

FAQ

What is the maximum RF input power the BGA2022 can handle?

The BGA2022 has a maximum RF input power rating of +10 dBm under AC-coupled, 50 Ω source conditions. Exceeding this may cause compression or permanent damage. At +10 dBm RF input, the device maintains linearity up to its +7 dBm OIP3 point, but conversion gain compresses above −10 dBm input. Always use external attenuation or limiting if RF signals exceed −5 dBm in production designs.

Does the BGA2022 require external bias components besides the RF feedback resistor?

No - the BGA2022 integrates all bias circuitry on-die. Only an external RF feedback resistor (e.g., 22 Ω between Pins 5 and 6) and standard supply decoupling (e.g., 100 nF ceramic at Pin 3) are required. Pins 1 and 2 form a differential AC-coupled LO port with no DC path; Pin 6 is AC-coupled RF input - no external bias resistors or current-setting networks are needed for basic operation of the BGA2022.

Can the BGA2022 be used with a 500 MHz IF output?

No - the BGA2022 is characterized and optimized for IF outputs of 80 MHz and 280 MHz only. At 500 MHz, IF output impedance becomes highly reactive (Fig.4 shows rising −jX dominance), causing severe mismatch and gain roll-off. Application note AN00059 confirms valid IF frequencies are limited to 80 MHz and 280 MHz; using 500 MHz would degrade conversion gain by >6 dB and increase noise figure unpredictably in the BGA2022.

What is the recommended PCB layout practice for the BGA2022 ground tab?

The exposed ground tab on the BGA2022 (SOT363 package) must be soldered directly to a solid, low-impedance PCB ground plane covering ≥1 cm². Thermal vias (≥4× 0.3 mm diameter) should connect the tab to inner-layer ground planes to achieve effective Rth j–s ≈ 375 K/W. Avoid routing traces under the tab or splitting the ground plane beneath it - doing so raises junction temperature and degrades conversion gain stability in the BGA2022.

Is the BGA2022 pin-compatible with the BGA2020 or BGA2021?

No - the BGA2022 is not pin-compatible with BGA2020 or BGA2021. Although all three are SOT363-packaged MMIC mixers, their pin functions differ: BGA2020 uses Pin 5 as VS and Pin 3 as IF-out, while BGA2022 assigns Pin 3 to VS and Pin 4 to IF-out. Swapping them without board revision will result in incorrect biasing and non-functional operation of the BGA2022.

OM7602/BGA2022/2450 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
-
Packaging:
Bulk
Product Status:
Obsolete
Type:
Mixer
Frequency:
0Hz ~ 2.4GHz
Contents:
Board(s)
Utilized IC / Part:
BGA2711

OM7602/BGA2022/2450 FAQ

1.How can I place an order for OM7602/BGA2022/2450 through Aetrix?

Please submit a Request for Quotation (RFQ) for OM7602/BGA2022/2450 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for OM7602/BGA2022/2450 reliable?

The price and inventory of OM7602/BGA2022/2450 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for OM7602/BGA2022/2450 is usually 5 days.

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OM7602/BGA2022/2450 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your OM7602/BGA2022/2450 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for OM7602/BGA2022/2450?

For technical support, including OM7602/BGA2022/2450 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your OM7602/BGA2022/2450 requirements.

6.How does Aetrix verify that OM7602/BGA2022/2450 is sourced from the original manufacturer or authorized distributors?

All OM7602/BGA2022/2450 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that OM7602/BGA2022/2450 meets industry standards.

7.What is the process for return or replacement of OM7602/BGA2022/2450?

All OM7602/BGA2022/2450 units undergo pre-shipment inspection (PSI). If there is an issue with OM7602/BGA2022/2450, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The OM7602/BGA2022/2450 part is unused and in its original packaging.

Return procedure for OM7602/BGA2022/2450:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

OM7602/BGA2022/2450 Tags

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