NXP Semiconductors OM7602/BGA2022/2450
- Part No.:
- OM7602/BGA2022/2450
- Manufacturer:
- NXP Semiconductors
- Category:
- RF, RFID, Wireless Evaluation Boards
- Package:
- Datasheet:
-
OM7602/BGA2022/2450.pdf
- Description:
- EVAL BOARD FOR BGA2022
- Quantity:
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Product details
Overview
BGA2022 from NXP Semiconductors is a silicon double-poly MMIC mixer in SOT363 package, designed for RF-to-IF downconversion in wireless receivers. It delivers 6 dB typical conversion gain at 1800 MHz, 12 dB DSB noise figure, and +7 dBm output IP3 at 1800 MHz, operating from 2.8 V supply with only 6 mA current - enabling high-linearity, low-power reception in CDMA and WLAN systems.
For engineers reviewing the BGA2022 datasheet, BGA2022 pinout, BGA2022 application, or BGA2022 equivalent, this page provides verified RF mixer specifications, validated SOT363 terminal mapping, confirmed frequency-band performance (900/1800/1950/2450 MHz), and real-world design constraints including AC-coupled LO/RF inputs and ground-tab thermal resistance of 375 K/W.
Technical Context
The BGA2022 integrates a passive double-balanced topology with on-chip biasing, optimized for fixed-frequency IF outputs (e.g., 80 MHz or 280 MHz) across cellular, PCS, and 2.4 GHz WLAN bands. Its RF input impedance varies with frequency (e.g., ~400 Ω + j300 Ω at 1800 MHz), requiring external matching per band.
Conversion gain is LO-power dependent (peaking near 0 dBm), and supply current remains stable from 2.8 V to 4 V. The device requires no external DC on pins 1, 2, or 6 - all RF/LO paths are AC-coupled to 50 Ω sources, and thermal management relies on solder-point conduction via the exposed ground tab.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Conversion Gain | 4–8 dB (band-dependent; 6 dB typ. at 1800 MHz) - sets minimum LNA gain required upstream to meet system NF target |
| Noise Figure (DSB) | 9–12 dB (12 dB typ. at 1800 MHz) - defines receiver sensitivity limit in presence of adjacent-channel interference |
| OIP3 | +7 dBm typ. at 1800 MHz - determines blocking immunity against two-tone interferers within same band |
| Supply Current | 4–8 mA at 2.8 V - enables battery-powered operation with <20 mW total dissipation |
| LO Input Return Loss | ≤2:1 VSWR (0–3 GHz) - simplifies LO buffer design by relaxing isolation requirements |
| IF Output Impedance | ~50 Ω resistive + capacitive reactance (e.g., −jX dominant below 500 MHz) - guides IF filter and amplifier interface design |
| Thermal Resistance (j–s) | 375 K/W - mandates direct thermal coupling to PCB ground plane for continuous 6 mA operation |
Pinout & Package
Package: SOT363 (SC-88), 6-lead plastic surface-mount package with exposed ground tab; dimensions: 2.2 mm × 1.8 mm × 1.15 mm (L × W × H); marking code "A2p".
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | LO – GND | AC-coupled LO port reference; must be DC-grounded externally; part of differential LO input pair with Pin 2 |
| 2 | LO – signal | AC-coupled LO port active terminal; requires 50 Ω source impedance; no DC bias allowed |
| 3 | VS | Positive supply input (2.8 V typical); bypass capacitor required close to pin; max 4 V absolute rating |
| 4 | IF – out | Differential IF output node; 50 Ω AC-coupled termination recommended; impedance varies with frequency (e.g., capacitive below 500 MHz) |
| 5 | RF – feedback | Internal RF feedback path terminal; used with external resistor (e.g., 22 Ω) to set conversion gain and linearity |
| 6 | RF – signal | AC-coupled RF input; 50 Ω source required; no DC voltage permitted; paired with Pin 5 for impedance tuning |
Key Features
| Feature | Design Value |
|---|---|
| Multi-band RF support | Validated performance at 880/1800/1950/2450 MHz - eliminates need for separate mixers across cellular, PCS, and 2.4 GHz WLAN bands |
| High LO-to-RF isolation | Typical >30 dB (implied by high conversion gain and low LO leakage) - reduces self-jamming in compact transceiver layouts |
| Low supply current | 6 mA at 2.8 V - enables integration into power-constrained handheld CDMA receivers without thermal derating |
| Integrated bias network | On-die current-setting circuitry - removes need for external bias resistors beyond RF feedback (Pin 5) and supply decoupling |
| Thermally enhanced package | Exposed ground tab with Rth j–s = 375 K/W - allows sustained operation at full rated current when soldered to ≥1 cm² copper area |
Applications
| CDMA Handset Receiver | WLAN 2.4 GHz Downconverter |
|---|---|
|
Use Scenario: Front-end downconversion in battery-powered CDMA mobile handsets operating at 1950 MHz RF with 80 MHz IF. IC Role / Device Role / Timing Role: Active double-balanced mixer performing RF-to-IF translation while rejecting image and LO leakage. Use Value: 5 dB conversion gain and 9 dB NF at 1950 MHz enable >110 dBμV sensitivity with minimal LNA gain, reducing overall front-end power consumption. |
Use Scenario: IF generation in 802.11b/g access point receivers at 2450 MHz RF with 280 MHz IF. IC Role / Device Role / Timing Role: Fixed-IF MMIC mixer providing broadband RF input matching and stable conversion gain across channel 1–13. Use Value: +10 dBm OIP3 at 2450 MHz ensures robust operation under co-channel interference from nearby Bluetooth or microwave oven emissions. |
| PCS Band Base Station Monitor | ISM Band Spectrum Analyzer Front-End |
|
Use Scenario: Low-current monitoring path in 1800 MHz PCS base station equipment requiring 280 MHz IF output. IC Role / Device Role / Timing Role: High-isolation mixer isolating receive chain from transmit leakage during TDD operation. Use Value: 6 dB conversion gain and ≤2:1 LO VSWR simplify integration with existing LO distribution networks without additional buffering. |
Use Scenario: Portable spectrum analyzer input stage covering 900–2450 MHz ISM bands with fixed 280 MHz IF. IC Role / Device Role / Timing Role: General-purpose wideband mixer enabling calibrated amplitude response across multiple unlicensed bands. Use Value: Consistent 4–6 dB conversion gain and <12 dB NF across all supported bands reduce calibration complexity and improve dynamic range accuracy. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar MMIC mixer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Mini-Circuits SRA-1MH+ | Higher conversion gain (+9 dB typ.), wider LO range (5–2500 MHz), but requires 12 V supply and dissipates >100 mW | Used in lab-grade test equipment; not suitable for battery-powered portable designs | Select when higher gain and broader LO flexibility outweigh size and power constraints |
| Qorvo QM11036 | Integrated LO amplifier, GaAs process, 5.5 dB gain at 2450 MHz, 10 mA supply current, QFN-16 package | Targets 5G Wi-Fi 6E front-ends; includes internal LO driver but larger footprint and higher cost | Select when system-level integration (LO amplification) and 6 GHz readiness are prioritized over footprint and current efficiency |
Compared with SRA-1MH+ and QM11036, the BGA2022 offers the lowest supply current (6 mA) and smallest footprint (SOT363) among validated alternatives, making it optimal for space- and power-constrained wireless receivers where fixed-band performance suffices.
Availability
BGA2022 is available at Aetrix Electronics and suitable for CDMA handset receivers, WLAN access point downconverters, PCS base station monitors, and ISM-band spectrum analyzer front-ends requiring stable component supply, long-lifecycle support, and traceable sourcing.
Supply support for BGA2022 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global leader in high-performance RF and mixed-signal solutions, specializing in automotive, industrial, and wireless connectivity ICs with emphasis on reliability and integration.
The BGA2022 belongs to NXP's legacy MMIC mixer product line, engineered specifically for low-power, multi-band wireless receivers in cellular and WLAN infrastructure and client devices.
FAQ
What is the maximum RF input power the BGA2022 can handle?
The BGA2022 has a maximum RF input power rating of +10 dBm under AC-coupled, 50 Ω source conditions. Exceeding this may cause compression or permanent damage. At +10 dBm RF input, the device maintains linearity up to its +7 dBm OIP3 point, but conversion gain compresses above −10 dBm input. Always use external attenuation or limiting if RF signals exceed −5 dBm in production designs.
Does the BGA2022 require external bias components besides the RF feedback resistor?
No - the BGA2022 integrates all bias circuitry on-die. Only an external RF feedback resistor (e.g., 22 Ω between Pins 5 and 6) and standard supply decoupling (e.g., 100 nF ceramic at Pin 3) are required. Pins 1 and 2 form a differential AC-coupled LO port with no DC path; Pin 6 is AC-coupled RF input - no external bias resistors or current-setting networks are needed for basic operation of the BGA2022.
Can the BGA2022 be used with a 500 MHz IF output?
No - the BGA2022 is characterized and optimized for IF outputs of 80 MHz and 280 MHz only. At 500 MHz, IF output impedance becomes highly reactive (Fig.4 shows rising −jX dominance), causing severe mismatch and gain roll-off. Application note AN00059 confirms valid IF frequencies are limited to 80 MHz and 280 MHz; using 500 MHz would degrade conversion gain by >6 dB and increase noise figure unpredictably in the BGA2022.
What is the recommended PCB layout practice for the BGA2022 ground tab?
The exposed ground tab on the BGA2022 (SOT363 package) must be soldered directly to a solid, low-impedance PCB ground plane covering ≥1 cm². Thermal vias (≥4× 0.3 mm diameter) should connect the tab to inner-layer ground planes to achieve effective Rth j–s ≈ 375 K/W. Avoid routing traces under the tab or splitting the ground plane beneath it - doing so raises junction temperature and degrades conversion gain stability in the BGA2022.
Is the BGA2022 pin-compatible with the BGA2020 or BGA2021?
No - the BGA2022 is not pin-compatible with BGA2020 or BGA2021. Although all three are SOT363-packaged MMIC mixers, their pin functions differ: BGA2020 uses Pin 5 as VS and Pin 3 as IF-out, while BGA2022 assigns Pin 3 to VS and Pin 4 to IF-out. Swapping them without board revision will result in incorrect biasing and non-functional operation of the BGA2022.
OM7602/BGA2022/2450 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Type:
- Mixer
- Frequency:
- 0Hz ~ 2.4GHz
- Contents:
- Board(s)
- Utilized IC / Part:
- BGA2711
OM7602/BGA2022/2450 FAQ
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7.What is the process for return or replacement of OM7602/BGA2022/2450?
All OM7602/BGA2022/2450 units undergo pre-shipment inspection (PSI). If there is an issue with OM7602/BGA2022/2450, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The OM7602/BGA2022/2450 part is unused and in its original packaging.
Return procedure for OM7602/BGA2022/2450:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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