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NXP Semiconductors OM7602/BGA2022/880
- Part No.:
- OM7602/BGA2022/880
- Manufacturer:
- NXP Semiconductors
- Category:
- RF, RFID, Wireless Evaluation Boards
- Package:
- Datasheet:
-
OM7602/BGA2022/880.pdf
- Description:
- EVAL BOARD FOR BGA2022
- Quantity:
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Inventory:1,019
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Product details
Overview
BGA2022 from NXP Semiconductors is a silicon double-poly MMIC mixer in SOT363 package, designed for RF-to-IF downconversion in wireless receivers. It delivers 6 dB typical conversion gain at 1800 MHz, 12 dB DSB noise figure, and +7 dBm output IP3 while operating at 2.8 V and 6 mA supply current - enabling high-linearity reception in CDMA baseband architectures.
For engineers reviewing the BGA2022 datasheet, BGA2022 pinout, BGA2022 application, or BGA2022 equivalent, this page provides verified RF mixer specifications including frequency-band-specific conversion gain (880–2450 MHz), LO/RF/IF port impedance behavior, thermal resistance (375 K/W), and bias-sensitive performance curves for supply voltage and oscillator power tuning.
Technical Context
The BGA2022 integrates passive and active elements in a monolithic silicon process to implement a single-balanced mixer topology with internal LO-RF isolation and feedback-controlled IF output. Its RF input uses AC coupling with no external DC bias, and the LO port exhibits ≤2:1 VSWR across 0–3 GHz.
It operates as a current-driven device with fixed VS = 2.8 V nominal supply and IS = 6 mA quiescent current; conversion gain varies with PLO (peaking near 0 dBm) and RF frequency, while noise figure remains ≤12 dB across cellular, PCS, and WLAN bands.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Conversion gain | 4–8 dB (TYP 6 dB @ 1800 MHz); determines signal amplification during RF-to-IF translation without external gain stages |
| Noise figure (DSB) | 12 dB TYP @ 1800 MHz; defines minimum detectable signal level in receiver front-end design |
| OIP3 | +7 dBm TYP @ 1800 MHz; sets upper RF input power limit before third-order intermodulation distortion dominates |
| Supply current | 4–8 mA @ VS = 2.8 V; enables low-power operation critical for battery-powered CDMA handsets |
| RF frequency range | 880–2450 MHz; supports multi-band operation across cellular (900 MHz), PCS (1900 MHz), and WLAN (2.4 GHz) |
| LO return loss | ≤2:1 VSWR (0–3 GHz); ensures stable oscillator interface without external matching networks |
| Thermal resistance | 375 K/W (junction-to-solder point); informs PCB copper area and thermal pad design for reliability at 40 mW max dissipation |
Pinout & Package
Package: SOT363 (6-lead plastic surface-mount), marking code A2p, dimensions per JEDEC SC-88 standard (2.2 × 1.35 × 1.15 mm).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | LO – GND | AC-coupled LO ground reference; no DC voltage allowed; connects to local LO ground plane |
| 2 | LO – signal | LO input port; requires 0 dBm drive at target frequency; 50 Ω source impedance assumed |
| 3 | VS | Positive supply rail; accepts 2.8 V nominal (max 4 V); bypass capacitor required per application note AN00059 |
| 4 | IF – out | Differential-capable IF output; 50 Ω load recommended; impedance varies with frequency (e.g., ~100 Ω + jX at 280 MHz) |
| 5 | RF – feedback | Internal feedback node; externally connected to RF input via L1/C1 network per Fig.2 for stability and bandwidth shaping |
| 6 | RF – signal | RF input port; AC-coupled; 50 Ω source; no DC bias applied; impedance varies with frequency (e.g., ~200 Ω – j150 Ω @ 1800 MHz) |
Key Features
| Feature | Design Value |
|---|---|
| Multi-band RF support | Validated conversion gain and noise figure across 880 MHz, 1800 MHz, 1950 MHz, and 2450 MHz bands - eliminates need for band-switched mixer solutions |
| High LO-to-RF isolation | Enables clean RF path in shared-antenna transceivers by minimizing LO leakage into RF front-end filters and LNAs |
| Low supply current | 6 mA at 2.8 V allows integration into power-constrained CDMA handset IF chains without compromising linearity or gain |
| Integrated feedback architecture | On-die RF feedback (pin 5) simplifies external matching and improves wideband stability versus passive-mixer alternatives |
| Thermally optimized package | SOT363 ground tab enables direct thermal conduction to PCB copper; Rth j-s = 375 K/W supports continuous operation at full rated dissipation |
Applications
| CDMA Handset Receiver | PCS Band Base Station Front-End |
|---|---|
Use Scenario: Downconverting 1950 MHz PCS band RF signals to 80 MHz IF in compact mobile handset designs. IC Role / Device Role / Timing Role: Active RF mixer providing gain, isolation, and linearity in first IF stage of superheterodyne receiver. Use Value: Delivers 5 dB typical conversion gain and 9 dB noise figure at 1950 MHz, enabling sensitivity < –105 dBm without additional LNA stages. |
Use Scenario: Translating 1800 MHz uplink signals to 280 MHz IF in distributed antenna system (DAS) remote units. IC Role / Device Role / Timing Role: High-isolation mixer in receive path where LO feedthrough must not desensitize adjacent channel receivers. Use Value: Achieves ≥20 dB LO-to-RF isolation and +7 dBm OIP3, supporting multi-carrier operation with minimal intermodulation. |
| WLAN 2.4 GHz Client Radio | Cellular Band 900 MHz IoT Gateway |
Use Scenario: Converting 2450 MHz WLAN signals to 280 MHz IF in low-cost Wi-Fi client modules with minimal BOM count. IC Role / Device Role / Timing Role: Single-ended MMIC mixer replacing discrete transistor-based mixers to reduce layout complexity and calibration effort. Use Value: Provides 6 dB conversion gain and 10 dBm OIP3 at 2450 MHz, allowing direct connection to SAW filter and IF amplifier without intermediate buffering. |
Use Scenario: Enabling sub-1 GHz LPWAN gateway receivers handling multiple narrowband IoT protocols (e.g., NB-IoT, LTE-M) at 880 MHz. IC Role / Device Role / Timing Role: Low-current mixer in battery-backed or energy-harvested gateways requiring <10 mA total RX chain consumption. Use Value: Draws only 6 mA at 2.8 V while delivering 5 dB gain and 9 dB noise figure - extends operational lifetime without sacrificing link budget. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar MMIC mixer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Mini-Circuits SRA-1MH+ | Higher conversion gain (10 dB), wider LO range (5–2000 MHz), but larger SOT-23-6 package and higher 12 mA supply current | Preferred for lab test setups and broadband instrumentation where size and power are secondary to dynamic range | Select when >8 dB gain and extended LO flexibility outweigh PCB area and current constraints |
| Qorvo QM11036 | Integrated LO buffer and 2.4 GHz optimized; 5.5 dB gain, 11 dB NF, 3.3 V operation; QFN-16 package with thermal pad | Targeted for Wi-Fi 6E access points requiring integrated LO drive and thermal robustness at 6 GHz | Select for new 2.4/5/6 GHz dual-band designs needing co-packaged LO support and higher thermal margin |
Compared with SRA-1MH+ and QM11036, the BGA2022 offers the lowest supply current (6 mA) and smallest footprint (SOT363) among these three, making it optimal for space- and power-constrained 880–2450 MHz receiver channels where external LO buffering is already available.
Availability
BGA2022 is available at Aetrix Electronics and suitable for CDMA handset receivers, PCS base station front-ends, and WLAN 2.4 GHz client radios requiring stable component supply across multi-year production cycles.
Supply support for BGA2022 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in high-performance RF, analog, and mixed-signal solutions for wireless infrastructure, automotive, and consumer applications.
The BGA2022 belongs to NXP's legacy MMIC mixer product line, engineered specifically for low-power, high-linearity downconversion in cellular and short-range wireless receivers - emphasizing integration, thermal efficiency, and multi-band interoperability.
FAQ
What is the recommended supply voltage and current for stable operation of the BGA2022?
The BGA2022 is characterized at VS = 2.8 V with typical supply current IS = 6 mA. The datasheet specifies absolute maximum VS = 4 V and IS = 10 mA. Operation within VS = 2.5–3.3 V maintains specified conversion gain and noise figure; exceeding 4 V risks permanent damage per IEC 60134 limiting values. For BGA2022, consistent 2.8 V regulation with local 100 nF ceramic bypassing is essential to avoid gain compression or thermal drift.
Can the BGA2022 be used at 2.45 GHz for WLAN applications, and what performance can be expected?
Yes, the BGA2022 is validated for 2450 MHz operation per its Quick Reference Data and Characteristics tables. At this frequency, it delivers 6 dB typical conversion gain, 9 dB DSB noise figure, and +10 dBm output IP3. The RF input impedance shifts to ~100 Ω – j50 Ω, requiring minor L/C tuning per application note AN00059 - confirming BGA2022 suitability for 2.4 GHz ISM band receivers without redesign.
What is the function of Pin 5 (RF-feedback) on the BGA2022, and how should it be connected?
Pin 5 is an internal RF feedback node used to stabilize the mixer's wideband response and improve port match. As shown in Figure 2 of the datasheet, it must be connected to the RF input (Pin 6) through an external series inductor (L1) and shunt capacitor (C1). For 1800 MHz operation, L1 = 2.7 nH and C1 = 1.2 pF; omitting or misconfiguring this network causes gain ripple and potential oscillation - a critical design requirement for BGA2022 implementation.
Does the BGA2022 require external DC blocking capacitors on LO and RF ports?
Yes - Notes 1 in the Limiting Values section explicitly state that LO and RF signals must be AC coupled with 50 Ω source impedance and no external DC voltage applied to Pins 1, 2, and 6. Standard 100 pF NP0 capacitors are used in reference designs (e.g., C3/C4 on LO, C1/C5 on RF) to prevent DC injection, ensure proper biasing of internal transistors, and maintain specified conversion gain and isolation for BGA2022.
Is the BGA2022 automotive qualified, and what is its temperature rating?
No, the BGA2022 is not automotive qualified. The datasheet states "Non-automotive qualified products" and specifies storage temperature Tstg = –65 to +150 °C and junction temperature Tj ≤ 150 °C. It is intended for commercial and industrial wireless applications only. For BGA2022, use in automotive environments voids warranty and requires customer validation per AEC-Q100 - NXP provides no qualification data or automotive-grade screening for this part.
OM7602/BGA2022/880 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Type:
- Mixer
- Frequency:
- -
- Contents:
- Board(s)
- Utilized IC / Part:
- BGA2022
OM7602/BGA2022/880 FAQ
1.How can I place an order for OM7602/BGA2022/880 through Aetrix?
Please submit a Request for Quotation (RFQ) for OM7602/BGA2022/880 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for OM7602/BGA2022/880 reliable?
The price and inventory of OM7602/BGA2022/880 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for OM7602/BGA2022/880 is usually 5 days.
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Once your OM7602/BGA2022/880 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for OM7602/BGA2022/880?
For technical support, including OM7602/BGA2022/880 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your OM7602/BGA2022/880 requirements.
6.How does Aetrix verify that OM7602/BGA2022/880 is sourced from the original manufacturer or authorized distributors?
All OM7602/BGA2022/880 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that OM7602/BGA2022/880 meets industry standards.
7.What is the process for return or replacement of OM7602/BGA2022/880?
All OM7602/BGA2022/880 units undergo pre-shipment inspection (PSI). If there is an issue with OM7602/BGA2022/880, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The OM7602/BGA2022/880 part is unused and in its original packaging.
Return procedure for OM7602/BGA2022/880:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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