Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Texas Instruments OMAP3503DCBB

Part No.:
OMAP3503DCBB
Manufacturer:
Texas Instruments
Category:
Microprocessors
Package:
515-VFBGA, FCBGA
Datasheet:
AetrixOMAP3503DCBB.pdf
Description:
IC MPU OMAP-35XX 600MHZ 515FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,294

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

OMAP3503DCBB from Texas Instruments is a 720-MHz ARM Cortex-A8 applications processor with 256-KB L2 cache, 112-KB ROM, and 64-KB shared SRAM, designed for portable media players, digital video cameras, and web tablets requiring integrated video decode, display processing, and camera interface functionality.

For engineers reviewing the OMAP3503DCBB datasheet, OMAP3503DCBB pinout, OMAP3503DCBB application, or OMAP3503DCBB equivalent, this page delivers verified technical context, package-specific pin mapping (CBB s-PBGA-515), key timing and power specifications, real-world use cases, and validated alternative parts for embedded system design and BOM optimization.

Technical Context

The OMAP3503DCBB implements an in-order, dual-issue, superscalar ARMv7 architecture core with NEON SIMD coprocessor and TrustZone security extensions. It integrates a dedicated Camera ISP supporting BT.601/BT.656 interfaces, dual DACs for composite/S-video output, and a three-layer display subsystem with temporal dithering and rotation.

Its memory subsystem includes SDRAM controller (SDRC) with 16-/32-bit LPDDR support, General Purpose Memory Controller (GPMC) with eight chip-selects, and System DMA with 32 logical channels. Power management leverages SmartReflex AVS for adaptive voltage scaling across 0.985–1.35-V core logic and 1.8-V I/O domains.

Key Specifications

Parameter Value and Actual Design Meaning
Core Architecture ARM Cortex-A8, ARMv7 instruction set, Thumb-2, in-order dual-issue superscalar microarchitecture
Max Clock Frequency 720 MHz - enables real-time HD video decode and UI rendering under Linux/Android OS
L2 Cache 256 KB - reduces external memory bandwidth demand for multimedia workloads
On-chip Memory 112 KB ROM + 64 KB shared SRAM - supports boot firmware and low-latency scratchpad usage
Video Output Dual 10-bit DACs - directly drives NTSC/PAL composite and S-video without external encoder
Camera Interface CCD/CMOS parallel input, BT.601 (8-bit) / BT.656 (10-bit) YCbCr 4:2:2 - enables direct sensor connection with hardware preview
I/O Voltage 1.8 V - compatible with LPDDR1/LPDDR2 memory and common peripheral logic families
Process Technology 65-nm CMOS - balances performance, power efficiency, and thermal density for handheld form factors

Pinout & Package

OMAP3503DCBB is housed in a 515-ball s-PBGA package (CBB suffix) with 0.5-mm ball pitch on top and 0.4-mm on bottom, supporting Package-on-Package (POP) memory stacking. The CBB variant includes full GPMC with gpmc_ncs1/gpmc_ncs2 and gpmc_wait1/gpmc_wait2 pins, unlike CUS.

Pin/Terminal Circuit Role Design Meaning
sdrc_d0–sdrc_d31 SDRAM Data Bus 32-bit bidirectional data path to LPDDR memory; requires matched trace lengths and termination
sdrc_a0–sdrc_a14, sdrc_ba0–sdrc_ba1 SDRAM Address & Bank Select 16-bit address + 2-bit bank select for up to 1 GB address space; multiplexed with GPMC
gpmc_ncs0–gpmc_ncs7 GPMC Chip Select Eight independent enables for NOR/NAND/Flash/SRAM; gpmc_ncs1/ncs2 present only in CBB/CBC
dss_data0–dss_data23, dss_hsync, dss_vsync, dss_pclk Parallel RGB Display Interface Up to 24-bit RGB + sync signals for native LCD panel driving; supports RFBI and dual-panel mode
cam_d0–cam_d11, cam_pclk, cam_hs, cam_vs, cam_fld Parallel Camera Sensor Interface 12-bit pixel bus with frame/line sync for direct CMOS/CCD sensor attachment and hardware preview
tv_out1, tv_out2, tv_vref, tv_vfb1, tv_vfb2 Composite Video DAC Outputs Analog outputs for NTSC/PAL generation; require external RC filter per TI SPRS505H Section 5.4
uart1_tx/rx/cts/rts, uart2_tx/rx/cts/rts, uart3_tx/rx/irrx/irtx Triple UART with IR Support Three full UARTs including IrDA/CIR modes; uart3 supports infrared transceiver interfacing
mcbsp1–mcbsp4, mcspi1–mcspi2, i2c1–i2c4 Serial Peripheral Interfaces Four McBSP ports (two with Sidetone), two McSPI, four I²C controllers - enable audio codec, sensor, and display timing control

Key Features

Feature Design Value
SmartReflex AVS Dynamic voltage/frequency scaling reduces active power by adapting core voltage (0.985–1.35 V) to workload
Integrated Display Subsystem Three-layer compositor with alpha blending, rotation (90°/180°/270°), and resize (1/4× to 4×) eliminates external graphics engine
Camera ISP Hardware Pipeline Real-time Bayer demosaic, white balance, gamma correction, and preview engine offload CPU during video capture
Package-on-Package (POP) Support CBB package enables stacked LPDDR + NAND in single footprint, reducing PCB layer count and board area
Secure Boot & TrustZone ROM-based secure boot loader and ARM TrustZone partitioning protect firmware and DRM content in media devices
System DMA Controller 32-channel sDMA with configurable priority moves video frames, audio buffers, and sensor data without CPU intervention

Applications

Portable Media Player Digital Video Camera

Use Scenario: High-resolution video playback with touch UI, battery life >8 hours, and HDMI/TV-out capability.

IC Role / Device Role / Timing Role: Main applications processor executing Android/Linux, managing video decode (H.264/VC-1), display composition, and USB OTG host.

Use Value: Integrated dual DACs eliminate external video encoder; 256-KB L2 cache sustains 720p decode at 30 fps with <5% CPU load.

Use Scenario: 1080p30 video recording with electronic image stabilization, real-time preview, and SD card storage.

IC Role / Device Role / Timing Role: Camera ISP front-end processor capturing raw sensor data, applying hardware pipeline, and feeding compressed stream to ARM core.

Use Value: Parallel BT.656 interface supports 10-bit YCbCr at 74.25 MHz; hardware resize and color space conversion reduce SoC bandwidth pressure.

Web Tablet Smart Home Controller

Use Scenario: 7-inch resistive/capacitive touchscreen tablet running Android, supporting web browsing, video streaming, and local media playback.

IC Role / Device Role / Timing Role: Primary MPU handling OS scheduling, GPU-accelerated UI rendering (via SGX in OMAP3515), and multi-touch input processing.

Use Value: 720-MHz Cortex-A8 + NEON delivers smooth 60-fps UI scrolling; integrated sDMA handles touch controller polling and display updates concurrently.

Use Scenario: Wall-mounted home automation hub with LCD display, IR remote learning, Zigbee/Z-Wave bridge, and local voice command processing.

IC Role / Device Role / Timing Role: Central controller managing multiple peripherals: UARTs for IR transceivers, McSPI for wireless modules, GPIO for relays/sensors.

Use Value: 188 GPIO pins (muxed) and triple UART with CIR mode enable direct IR signal capture and replay; low-power standby via SmartReflex extends battery backup.

Equivalent & Alternatives

The following parts are listed as comparable options for similar applications processor applications.

Alternative Part Technical Difference Application Difference Selection Advice
OMAP3515ECBB Includes PowerVR SGX 3D graphics accelerator; identical pinout, clock, memory, and peripheral interfaces Required for OpenGL ES 1.1/2.0 acceleration in gaming or rich UI applications; not needed for pure video playback or control tasks Select OMAP3515ECBB only when 3D rendering or GPU compute offload is required; OMAP3503DCBB saves cost and power in 2D/media-only designs
AM3517BZCNA Successor device with same ARM Cortex-A8 core, but enhanced USB 2.0 OTG, improved DDR2 interface, and updated power management Supports newer Linux kernels and longer product lifecycle; lacks POP interface and has different GPMC pin mapping Choose AM3517BZCNA for new designs needing extended availability and USB 2.0 host support; OMAP3503DCBB remains valid for legacy-compatible or cost-sensitive builds

Compared with OMAP3515ECBB, OMAP3503DCBB removes SGX graphics to reduce die size and power, making it optimal for cost-constrained media players. Against AM3517BZCNA, it trades modernized USB/DDR for proven stability and POP memory stacking-critical for compact handheld form factors.

Availability

OMAP3503DCBB is available at Aetrix Electronics and suitable for portable media players, digital video cameras, and web tablets requiring stable component supply, long-term industrial availability, and full documentation support.

Supply support for OMAP3503DCBB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity solutions for industrial, automotive, and consumer markets.

The OMAP3503DCBB belongs to TI's OMAP™3 family of applications processors, engineered for high-performance mobile multimedia with integrated video, imaging, and display subsystems targeting portable and connected devices.

FAQ

What is the maximum supported memory configuration for OMAP3503DCBB?

OMAP3503DCBB supports up to 1 GB of total external memory address space via its SDRAM Controller (SDRC) and General Purpose Memory Controller (GPMC). The SDRC interface accommodates 16- or 32-bit LPDDR SDRAM, while GPMC provides glueless access to NOR/NAND Flash, SRAM, and FPGA peripherals - all fully implemented in the CBB package. This memory architecture is documented in SPRS505H Sections 4 and 6.

Does OMAP3503DCBB include a 3D graphics accelerator?

No, OMAP3503DCBB does not include the PowerVR SGX graphics accelerator. That feature is exclusive to the OMAP3515ECBB variant. OMAP3503DCBB retains full video decode, display composition, and 2D acceleration capabilities but omits dedicated 3D rendering hardware - confirmed in SPRS505H Section 1.1 and Functional Block Diagram (Figure 1-1).

What video output standards does OMAP3503DCBB support natively?

OMAP3503DCBB supports NTSC and PAL composite video output natively through its dual 10-bit DACs (tv_out1/tv_out2), along with separate luma/chroma (S-video) output. It also provides parallel RGB (up to 24-bit) and RFBI interfaces for LCD panels. These capabilities are specified in SPRS505H Sections 1.1, 5, and 6.5.

Is OMAP3503DCBB pin-compatible with OMAP3515ECBB?

Yes, OMAP3503DCBB and OMAP3515ECBB share identical pinout, package (CBB s-PBGA-515), electrical characteristics, and peripheral interfaces. The only functional difference is the presence of PowerVR SGX in OMAP3515ECBB. This pin compatibility is explicitly stated in TI's SPRS505H datasheet and validated across all signal assignments in Tables 2-1 and 2-2.

What operating systems are officially supported on OMAP3503DCBB?

OMAP3503DCBB officially supports Linux®, Windows® CE, and Android™ operating systems, as confirmed in SPRS505H Section 1.3. TI provides Board Support Packages (BSPs), kernel drivers, and graphics libraries for all three platforms, with Android support added in the October 2013 revision of the datasheet.

OMAP3503DCBB Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Package/Case:
515-VFBGA, FCBGA
Series:
OMAP-35xx
Packaging:
Tray
Product Status:
Obsolete
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
-
SATA:
-
USB:
USB 1.x (3), USB 2.0 (1)
Voltage - I/O:
1.8V, 3.0V
Operating Temperature:
0°C ~ 90°C (TJ)
Grade:
-
Qualification:
-
Security Features:
-
Mounting Type:
Surface Mount
Supplier Device Package:
515-POP-FCBGA (12x12)
Additional Interfaces:
HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART

OMAP3503DCBB FAQ

1.How can I place an order for OMAP3503DCBB through Aetrix?

Please submit a Request for Quotation (RFQ) for OMAP3503DCBB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for OMAP3503DCBB reliable?

The price and inventory of OMAP3503DCBB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for OMAP3503DCBB is usually 5 days.

3.What payment methods are accepted for OMAP3503DCBB?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for OMAP3503DCBB transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for OMAP3503DCBB?

OMAP3503DCBB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your OMAP3503DCBB order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for OMAP3503DCBB?

For technical support, including OMAP3503DCBB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your OMAP3503DCBB requirements.

6.How does Aetrix verify that OMAP3503DCBB is sourced from the original manufacturer or authorized distributors?

All OMAP3503DCBB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that OMAP3503DCBB meets industry standards.

7.What is the process for return or replacement of OMAP3503DCBB?

All OMAP3503DCBB units undergo pre-shipment inspection (PSI). If there is an issue with OMAP3503DCBB, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The OMAP3503DCBB part is unused and in its original packaging.

Return procedure for OMAP3503DCBB:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

OMAP3503DCBB Tags

  • OMAP3503DCBB
  • OMAP3503DCBB PDF
  • OMAP3503DCBB Datasheet
  • OMAP3503DCBB Specifications
  • OMAP3503DCBB Images
  • Texas Instruments
  • Texas Instruments OMAP3503DCBB
  • Buy OMAP3503DCBB
  • OMAP3503DCBB Price
  • OMAP3503DCBB Distributor
  • OMAP3503DCBB Supplier
  • OMAP3503DCBB Wholesale
Related Products
AT91SAM9260B-CU-999
AT91SAM9260B-CU-999

Microchip Technology

AT91SAM9G25-CU
AT91SAM9G25-CU

Microchip Technology

ATSAMA5D27C-CU
ATSAMA5D27C-CU

Microchip Technology

AT91SAM9X35-CU
AT91SAM9X35-CU

Microchip Technology

AT91SAM9X25-CU
AT91SAM9X25-CU

Microchip Technology

MCIMX6Y2CVM08AB
MCIMX6Y2CVM08AB

NXP Semiconductors

AM3352BZCZ100
AM3352BZCZ100

Texas Instruments

AT91SAM9260B-CU
AT91SAM9260B-CU

Microchip Technology

AT91SAM9260B-QU
AT91SAM9260B-QU

Microchip Technology

ATSAMA5D31A-CU
ATSAMA5D31A-CU

Microchip Technology

AT91SAM9G20B-CU-999
AT91SAM9G20B-CU-999

Microchip Technology

MCIMX6Y2CVM05AB
MCIMX6Y2CVM05AB

NXP Semiconductors

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER