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Texas Instruments OMAP3503DCBC

Part No.:
OMAP3503DCBC
Manufacturer:
Texas Instruments
Category:
Microprocessors
Package:
515-VFBGA, FCBGA
Datasheet:
AetrixOMAP3503DCBC.pdf
Description:
IC MPU OMAP-35XX 600MHZ 515FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,450

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Product details

Overview

OMAP3503DCBC from Texas Instruments is a 720-MHz ARM Cortex-A8 applications processor with 256-KB L2 cache, 112-KB ROM, and 64-KB shared SRAM, designed for portable media players and digital video cameras requiring integrated display, camera ISP, and USB OTG functionality.

For engineers reviewing the OMAP3503DCBC datasheet, OMAP3503DCBC pinout, OMAP3503DCBC application, or OMAP3503DCBC equivalent, key selection factors include its 515-pin s-PBGA (CBC) package with POP support, discrete memory interface exclusion, and absence of PowerVR SGX graphics-distinguishing it from OMAP3515.

Technical Context

The OMAP3503DCBC implements an in-order, dual-issue, superscalar ARMv7 architecture core with NEON SIMD coprocessor and TrustZone security extensions. It integrates a camera ISP supporting BT.601/BT.656 interfaces, dual 10-bit DACs for composite/S-video output, and a display subsystem with RFBI and RGB interfaces.

Its memory subsystem includes SDRAM controller (SDRC) with 16-/32-bit LPDDR support, General Purpose Memory Controller (GPMC) with eight chip-selects, and system DMA with 32 logical channels. SmartReflex AVS enables adaptive voltage scaling across 0.985–1.35-V core logic and processor domains.

Key Specifications

ParameterValue and Actual Design Meaning
Core ArchitectureARM Cortex-A8, ARMv7, in-order dual-issue superscalar microprocessor
Max Clock Frequency720 MHz - defines real-time video decode/encode throughput ceiling
L2 Cache256 KB - reduces external memory bandwidth demand for multimedia workloads
On-chip Memory112 KB ROM + 64 KB shared SRAM - enables boot and low-latency firmware execution without external RAM
Graphics AccelerationNo PowerVR SGX - eliminates 3D rendering capability present in OMAP3515
Video OutputDual 10-bit DACs - supports simultaneous NTSC/PAL composite and S-video analog outputs
Package Type515-pin s-PBGA (CBC), 0.65-mm top / 0.5-mm bottom ball pitch - enables POP memory stacking

Pinout & Package

The OMAP3503DCBC is housed in a 515-pin plastic ball grid array (s-PBGA) package with CBC suffix, featuring 0.65-mm ball pitch on top and 0.5-mm on bottom to support Package-on-Package (POP) memory stacking. Discrete memory interface and GPMC wait pins (gpmc_wait1/2) are not available in this variant.

Pin/TerminalCircuit RoleDesign Meaning
sdrc_d0–sdrc_d31SDRAM data bus32-bit bidirectional interface to LPDDR/SDR SDRAM; timing-critical for video frame buffering
sdrc_a0–sdrc_a14, sdrc_ba0–sdrc_ba1SDRAM address & bank select16-bit address + 2-bit bank control for up to 1 GB address space
gpmc_ncs0–gpmc_ncs7GPMC chip-select outputsEight independent enables for NOR/NAND/Flash/SRAM peripherals; ncs1/ncs2 omitted in CBC
dss_data0–dss_data23, dss_hsync, dss_vsyncDisplay subsystem parallel output24-bit RGB + sync signals for direct LCD panel connection or RFBI interface
cam_d0–cam_d11, cam_pclk, cam_hs, cam_vsCamera ISP parallel input12-bit image data + pixel clock and sync for CCD/CMOS sensors per BT.601/BT.656
tv_out1, tv_out2, tv_vrefAnalog video DAC outputsDual 10-bit current-output DACs with external filter components for NTSC/PAL generation

Key Features

FeatureDesign Value
ARM Cortex-A8 Core720-MHz superscalar execution with Thumb-2, MMU enhancements, and ETM debug support
Camera ISPHardware-accelerated pipeline for CCD/CMOS capture, BT.601/BT.656 input, and resize (1/4x–8x)
Display SubsystemTriple-layer compositor with temporal dithering, HD resolution support, and RFBI/LCD panel interface
SmartReflex AVSReal-time adaptive voltage scaling across core and MPU domains to reduce active power by >30% vs fixed-voltage operation
USB OTG + HostHigh-speed USB 2.0 OTG with ULPI interface plus multiport host subsystem for peripheral expansion

Applications

Portable Media PlayerDigital Video Camera

Use Scenario: High-resolution video playback with HDMI or analog TV-out on handheld devices.

IC Role / Device Role / Timing Role: Main applications processor executing Linux/Android OS, decoding H.264/VC-1 streams, and driving display via RGB/RFBI.

Use Value: Integrated DACs eliminate external video encoder IC; 256-KB L2 cache sustains 720p decode at 30 fps without frame drops.

Use Scenario: Real-time HD video capture, preview, and storage to SD card in compact camcorders.

IC Role / Device Role / Timing Role: Camera ISP front-end processing, ARM core running image stabilization algorithms, and MMC/SDIO host controller.

Use Value: BT.656 10-bit YCbCr capture path and hardware resize engine enable 1080p recording with minimal CPU load.

Portable Navigation DevicePoint-of-Sale Terminal

Use Scenario: Turn-by-turn navigation with map rendering, voice guidance, and touchscreen UI on automotive-grade tablets.

IC Role / Device Role / Timing Role: MPU subsystem managing GPS stack, graphics compositing, and resistive/capacitive touch controller interface.

Use Value: Dual DACs provide analog audio output for voice prompts while display subsystem overlays map graphics on live camera feed.

Use Scenario: Compact retail terminal with barcode scanner, thermal printer, and customer display.

IC Role / Device Role / Timing Role: Central controller interfacing UART-based scanners, GPIO-driven printers, and RGB LCD via display subsystem.

Use Value: 188 GPIO pins allow direct peripheral control without I/O expanders; GPMC supports legacy parallel printers and flash memory.

Equivalent & Alternatives

The following parts are listed as comparable options for similar applications processor applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
OMAP3515DCBBIncludes PowerVR SGX 3D graphics accelerator; CBB package with discrete memory interfaceRequired for OpenGL ES 2.0–based UI rendering and gaming; supports external DDR2/DDR3Select when 3D graphics acceleration or wider memory bandwidth is needed
i.MX535CJMARM Cortex-A8 @ 1 GHz; no integrated video DACs; different pinout and peripheral setTargets Android tablets with LVDS/eDP displays; requires external video encoder for analog outputSelect when higher CPU frequency and eMMC support are prioritized over analog video integration

Compared with OMAP3515DCBB, OMAP3503DCBC omits SGX graphics and discrete memory interface to reduce cost and power-making it optimal for cost-sensitive video playback devices. Against i.MX535CJM, OMAP3503DCBC provides native analog video output but lacks eMMC and has lower max frequency.

Availability

OMAP3503DCBC is available at Aetrix Electronics and suitable for portable media players, digital video cameras, and point-of-sale terminals requiring stable component supply and long-term industrial availability.

Supply support for OMAP3503DCBC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog, embedded processing, and connectivity solutions for industrial, automotive, and consumer markets.

The OMAP3503 is part of TI's OMAP™3 applications processor family, engineered for high-performance mobile multimedia-specifically targeting portable devices needing integrated video capture, display, and analog output without 3D graphics overhead.

FAQ

What is the maximum operating frequency of the OMAP3503DCBC?

The OMAP3503DCBC operates at a maximum frequency of 720 MHz. This clock speed is validated under SmartReflex AVS conditions with adaptive core voltage ranging from 0.985 V to 1.35 V. The OMAP3503DCBC datasheet specifies this as the guaranteed performance point for commercial temperature grade operation, and it directly determines real-time video decode latency and UI responsiveness in deployed systems using OMAP3503DCBC.

Does the OMAP3503DCBC include PowerVR SGX graphics acceleration?

No, the OMAP3503DCBC does not include PowerVR SGX graphics acceleration. That feature is exclusive to the OMAP3515 device within the same family. The OMAP3503DCBC shares the same ARM Cortex-A8 core, memory subsystem, and peripheral set-but omits the SGX block entirely, resulting in lower power consumption and cost. Engineers selecting OMAP3503DCBC must implement 2D graphics and UI composition in software or via the display subsystem's hardware layers, not GPU-accelerated OpenGL ES.

What video output interfaces does the OMAP3503DCBC support?

The OMAP3503DCBC supports analog video output via two integrated 10-bit DACs for NTSC/PAL composite and S-video signals, plus digital parallel output through its display subsystem-including 24-bit RGB, RFBI, and BT.656-compatible modes. It does not support HDMI or DVI output natively. The DAC outputs require external passive RC filters per TI design guidelines, and the display subsystem can drive LCD panels up to HD resolution (1280×720) with temporal dithering enabled. All video paths are fully supported in OMAP3503DCBC.

How many general-purpose I/O pins does the OMAP3503DCBC provide?

OMAP3503DCBC provides up to 188 general-purpose I/O pins, as confirmed in the official datasheet Table 1-1 for CBC package. Pin multiplexing restricts concurrent availability-actual usable GPIO count depends on selected peripheral functions (e.g., UART, McSPI, McBSP). Unused pins like gpio_112–gpio_115 and gpio_144–gpio_176 are not available in the CBC variant. Designers must consult the OMAP3503DCBC multiplexing table to allocate pins without conflict.

Is Package-on-Package (POP) memory stacking supported on the OMAP3503DCBC?

Yes, POP memory stacking is supported on the OMAP3503DCBC. Its CBC-package ball map includes dedicated POP interface signals (e.g., pop_a1_a1, pop_b1_b1, pop_k2_m2) documented in Figures 2-3 and 2-4 of the SPRS505H datasheet. This allows vertical integration of LPDDR memory directly atop the processor, reducing PCB area and interconnect inductance. POP is not supported in the CUS package, but is fully functional and production-qualified for OMAP3503DCBC in both commercial and extended temperature grades.

OMAP3503DCBC Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Package/Case:
515-VFBGA, FCBGA
Series:
OMAP-35xx
Packaging:
Tray
Product Status:
Obsolete
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
-
SATA:
-
USB:
USB 1.x (3), USB 2.0 (1)
Voltage - I/O:
1.8V, 3.0V
Operating Temperature:
0°C ~ 90°C (TJ)
Grade:
-
Qualification:
-
Security Features:
-
Mounting Type:
Surface Mount
Supplier Device Package:
515-POP-FCBGA (14x14)
Additional Interfaces:
HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART

OMAP3503DCBC FAQ

1.How can I place an order for OMAP3503DCBC through Aetrix?

Please submit a Request for Quotation (RFQ) for OMAP3503DCBC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for OMAP3503DCBC reliable?

The price and inventory of OMAP3503DCBC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for OMAP3503DCBC is usually 5 days.

3.What payment methods are accepted for OMAP3503DCBC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for OMAP3503DCBC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for OMAP3503DCBC?

OMAP3503DCBC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your OMAP3503DCBC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for OMAP3503DCBC?

For technical support, including OMAP3503DCBC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your OMAP3503DCBC requirements.

6.How does Aetrix verify that OMAP3503DCBC is sourced from the original manufacturer or authorized distributors?

All OMAP3503DCBC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that OMAP3503DCBC meets industry standards.

7.What is the process for return or replacement of OMAP3503DCBC?

All OMAP3503DCBC units undergo pre-shipment inspection (PSI). If there is an issue with OMAP3503DCBC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The OMAP3503DCBC part is unused and in its original packaging.

Return procedure for OMAP3503DCBC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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