Texas Instruments OMAP3503DCUS

Overview

OMAP3503DCUS from Texas Instruments is a 423-pin s-PBGA applications processor based on the ARM Cortex-A8 core, operating up to 720 MHz with 256-KB L2 cache, 112-KB ROM, and 64-KB shared SRAM. It integrates camera ISP, display subsystem with dual LCD support, SD/SDIO/MMC interfaces, and USB OTG/host - designed for portable media players and digital video cameras requiring high-resolution imaging and low-power operation.

For engineers reviewing the OMAP3503DCUS datasheet, OMAP3503DCUS pinout, OMAP3503DCUS application, or OMAP3503DCUS equivalent, key selection considerations include its CUS-package limitations (no POP interface, no discrete memory interface, reduced GPMC chip-selects), absence of PowerVR SGX graphics (vs. OMAP3515), and confirmed support for Linux, Android, and Windows CE in commercial/extended temperature grades.

Technical Context

The OMAP3503DCUS implements an ARMv7-compliant Cortex-A8 superscalar microprocessor with Thumb-2, NEON SIMD, TrustZone security, and dynamic branch prediction. Its memory subsystem includes SDRAM controller (SDRC) supporting LPDDR, General Purpose Memory Controller (GPMC) with eight chip-selects (though gpmc_ncs1/ncs2 and wait1/wait2 are omitted in CUS package), and SmartReflex AVS for adaptive voltage scaling between 0.985 V–1.35 V core logic.

It integrates dedicated hardware accelerators: Camera ISP with BT.601/BT.656 interface, resize engine (1/4× to 4×), color space converter, and dual 10-bit DACs for composite NTSC/PAL output. The display subsystem supports parallel RGB up to HD resolution, RFBI panels, and remote frame buffer interface - all without PowerVR SGX graphics (a key differentiator from OMAP3515).

Key Specifications

Pinout & Package

The OMAP3503DCUS is housed in a 423-ball s-PBGA package (CUS suffix) with 0.65-mm ball pitch, no POP interface, and no discrete memory interface. Ball assignments follow TI's SPRS505H datasheet Section 2.2.1 (Figure 2-5 and Quadrant D maps), with key functional groups including SDRC, GPMC, DSS, ISP, MMC/SDIO, USB, UART, McSPI, McBSP, I²C, timers, and GPIO.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar applications processor applications.

Compared with OMAP3515CBB, OMAP3503DCUS omits PowerVR SGX and POP capability to reduce cost and size, making it optimal for imaging-centric but graphics-light applications; versus i.MX535CJM, it offers tighter integration with TI's DaVinci software stack and legacy Linux BSPs but lacks DDR3 and newer security features.

Availability

OMAP3503DCUS is available at Aetrix Electronics and suitable for portable media players, digital video cameras, and point-of-sale terminals requiring stable component supply, long-lifecycle support, and qualified industrial-grade silicon.

Supply support for OMAP3503DCUS includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies with over 90 years of innovation in industrial, automotive, and consumer electronics.

The OMAP3503 belongs to TI's OMAP™3 family of applications processors, engineered specifically for portable multimedia devices demanding high-performance video processing, low-power operation, and rich peripheral integration - without requiring 3D graphics acceleration.

FAQ

What is the maximum supported SDRAM capacity for OMAP3503DCUS?

The OMAP3503DCUS supports up to 1 GB of total external memory address space via its SDRAM Controller (SDRC), configured across LPDDR or mobile SDRAM devices. This capacity is achieved using 15-bit row/column addressing and two bank address bits (BA0/BA1), enabling configurations such as 128M×8 or 64M×16 devices. The CUS package retains full SDRC functionality despite omitting POP and discrete memory interfaces.

Does OMAP3503DCUS include PowerVR SGX graphics hardware?

No, OMAP3503DCUS does not include PowerVR SGX graphics acceleration. That feature is exclusive to the OMAP3515 variant. The OMAP3503DCUS shares the same ARM Cortex-A8 core, ISP, display subsystem, and peripheral set but omits the SGX engine - confirmed in Section 1.3 of SPRS505H and functional block diagram (Figure 1-1). Graphics rendering relies solely on CPU-based libraries or optional third-party IP.

Which operating systems are officially supported on OMAP3503DCUS?

OMAP3503DCUS officially supports Linux®, Windows® CE, and Android™, as documented in Section 1.3 of the SPRS505H datasheet. TI provided validated BSPs and kernel patches for these OSes during the product's active lifecycle. No official support exists for QNX, FreeRTOS, or bare-metal RTOSes beyond community ports.

What are the key package-level differences between OMAP3503DCUS and OMAP3515CBB?

OMAP3503DCUS uses a 423-pin s-PBGA (CUS) package with 0.65-mm pitch and no POP interface, while OMAP3515CBB uses a 515-pin s-PBGA (CBB) with 0.5-mm top/0.4-mm bottom pitch and full POP support. Per Table 1-1, CUS omits gpmc_ncs1/ncs2, gpmc_wait1/wait2, HSUSB3_TLL, MM_FSUSB3, and McSPI1 CS1/CS2 - reducing pin count and cost for non-POP designs.

Can OMAP3503DCUS drive dual independent displays simultaneously?

Yes, OMAP3503DCUS supports dual independent displays: one via its parallel RGB interface (up to 24-bit HD resolution) and a second via composite NTSC/PAL output using its two integrated 10-bit DACs. The display subsystem includes three overlay layers and temporal dithering, enabling simultaneous UI rendering on LCD and video playback on TV - confirmed in Section 1.1 and Figure 1-1 of SPRS505H.