Texas Instruments OMAP3503DCUS72
- Part No.:
- OMAP3503DCUS72
- Manufacturer:
- Texas Instruments
- Category:
- Microprocessors
- Package:
- 423-LFBGA, FCBGA
- Datasheet:
-
OMAP3503DCUS72.pdf
- Description:
- IC MPU OMAP-35XX 720MHZ 423FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
OMAP3503DCUS72 from Texas Instruments is a 423-pin s-PBGA applications processor based on the ARM Cortex-A8 core operating up to 720 MHz, featuring 256-KB L2 cache, 112-KB ROM, and 64-KB shared SRAM. It integrates camera ISP, display subsystem with dual LCD support, USB OTG/host, MMC/SDIO, McSPI, UARTs, and SmartReflex power management - designed for portable media players and digital video cameras.
For engineers reviewing the OMAP3503DCUS72 datasheet, OMAP3503DCUS72 pinout, OMAP3503DCUS72 application, or OMAP3503DCUS72 equivalent, key selection considerations include its CUS-package limitations (no POP interface, no discrete memory interface, reduced GPMC chip-selects), 188 GPIO availability under multiplexing constraints, and absence of PowerVR SGX graphics accelerator compared to OMAP3515.
Technical Context
The OMAP3503DCUS72 implements an in-order, dual-issue, superscalar ARM Cortex-A8 microprocessor core compliant with ARMv7 architecture and Thumb-2 instruction set, with NEON SIMD coprocessor and TrustZone security extensions. Its memory subsystem includes SDRAM controller (SDRC) supporting LPDDR, General Purpose Memory Controller (GPMC) with eight chip-selects (though ncs1/ncs2 and wait1/wait2 are omitted in CUS), and system DMA with 32 logical channels.
It features a dedicated Camera ISP supporting BT.601/BT.656 interfaces, CCD/CMOS sensors, and hardware resize (1/4× to 4×); a display subsystem with parallel RGB output (up to 24-bit), RFBI support, NTSC/PAL DACs, and temporal dithering; and serial peripherals including five McBSPs (two with sidetone), four McSPI ports, three high-speed I²C controllers, and three UARTs (one with IrDA/CIR).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | ARM Cortex-A8, ARMv7, in-order dual-issue superscalar with NEON and TrustZone |
| Max Operating Frequency | 720 MHz - determines real-time video decode throughput and HLOS scheduling latency |
| L2 Cache | 256 KB - reduces external memory bandwidth demand for multimedia workloads |
| On-chip Memory | 112 KB ROM + 64 KB shared SRAM - enables boot code execution and low-latency firmware buffers |
| Package | 423-pin s-PBGA (CUS suffix), 0.65-mm ball pitch - defines PCB layout density and thermal pad access |
| Power Management | SmartReflex AVS with adaptive core voltage (0.985–1.35 V) - enables dynamic DVFS for battery runtime optimization |
| I/O Voltage | 1.8-V I/O, 3.0-V MMC1 only - constrains level-shifting requirements for peripheral interfacing |
Pinout & Package
OMAP3503DCUS72 uses a 423-ball s-PBGA package (CUS suffix) with 0.65-mm ball pitch, no POP interface, and no discrete memory interface. Ball assignments follow TI SPRS505H Figure 2-5 (bottom view) and Table 2-3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| sdrc_d0–sdrc_d31 | SDRAM data bus | 32-bit bidirectional interface to LPDDR; timing-critical for video frame buffering |
| sdrc_a0–sdrc_a14 | SDRAM address bus | 15-bit address lines controlling up to 1 GB of external memory space |
| gpmc_ncs0–gpmc_ncs7 | GPMC chip-select outputs | Eight enables for NOR/NAND/SRAM; ncs1/ncs2 not available in CUS package |
| dss_data0–dss_data23 | Parallel RGB/YUV display data | Up to 24-bit RGB output; supports dual-panel drive with programmable format |
| cam_d0–cam_d11 | Camera parallel data bus | 12-bit interface for CMOS/CCD image sensors; synchronized by cam_pclk/cam_hs/cam_vs |
| uart1_tx/uart1_rx | Primary UART data | Asynchronous serial link; triple-muxed on AC2/AA18 (TX) and AB19 (RX) in CUS |
Key Features
| Feature | Design Value |
|---|---|
| ARM Cortex-A8 Core | 720-MHz superscalar execution with NEON SIMD - accelerates video encode/decode and image processing kernels |
| Camera ISP | Hardware BT.656/BT.601 capture, resize (1/4× to 4×), and color space conversion - offloads CPU from real-time sensor pipeline tasks |
| Dual Display Support | Simultaneous RGB + RFBI output with temporal dithering - enables primary LCD + secondary status panel without external TCON |
| SmartReflex AVS | Adaptive voltage scaling across OPP points - reduces active power by >30% vs. fixed-voltage operation at same frequency |
| USB 2.0 OTG + Host | Integrated PHY with ULPI/TLL options - eliminates need for external transceiver in portable designs |
Applications
| Portable Media Player | Digital Video Camera |
|---|---|
Use Scenario: High-resolution video playback (720p) with touchscreen UI and local storage. IC Role / Device Role / Timing Role: Main applications processor executing Android/Linux, managing SDIO storage, HDMI/RGB display, and audio codec via McBSP. Use Value: Integrated ISP and display subsystem eliminate external video co-processors; 720-MHz Cortex-A8 sustains 30-fps decode with <50 ms UI latency. | Use Scenario: HD video capture from CMOS sensor with real-time preview, compression, and SD card write. IC Role / Device Role / Timing Role: Sensor interface controller (BT.656), hardware JPEG encoder accelerator, and SDIO host for burst writes. Use Value: Dedicated ISP handles pixel-level debayering and white balance; 32-channel sDMA moves frames directly from SDRC to codec engine without CPU intervention. |
| Portable Navigation Device | Point-of-Sale Terminal |
Use Scenario: GPS-assisted turn-by-turn navigation with map rendering, voice guidance, and cellular modem interface. IC Role / Device Role / Timing Role: Real-time OS host with UART-connected GPS module, SPI-connected cellular radio, and resistive touchscreen controller. Use Value: 188 GPIO pins enable direct keypad matrix scan and LED indicators; SmartReflex extends battery life during intermittent GPS polling. | Use Scenario: Barcode scanning, payment processing, and receipt printing in handheld retail terminals. IC Role / Device Role / Timing Role: Central controller interfacing 2D imager via parallel camera port, EMV smartcard via UART, and thermal printer via UART/USB. Use Value: Hardware-resize engine scales captured barcodes to optimal OCR resolution; integrated crypto acceleration (via ARM TrustZone) secures payment transactions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar applications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| OMAP3515CBB | Same ARM Cortex-A8 core, 720 MHz, but adds PowerVR SGX 3D graphics accelerator and POP interface support | Required for OpenGL ES 2.0-based UI rendering or 3D gaming; supports stacked memory for higher bandwidth | Select when 3D graphics acceleration or memory stacking is mandatory; incompatible pinout and larger 515-ball package |
| AM3517BZC | Successor device with identical CUS package, same peripherals, but enhanced USB 2.0 PHY and updated SmartReflex | Better USB suspend/resume behavior and lower leakage current; supports newer Linux kernel versions out-of-box | Prefer for new designs requiring extended lifecycle support and improved power efficiency; pin-compatible drop-in replacement |
Compared with OMAP3515CBB, OMAP3503DCUS72 trades 3D graphics and POP capability for smaller footprint and lower cost; versus AM3517BZC, it lacks updated USB PHY tuning and has shorter manufacturer support horizon, making AM3517BZC the recommended upgrade path for long-term production.
Availability
OMAP3503DCUS72 is available at Aetrix Electronics and suitable for portable media players, digital video cameras, and point-of-sale terminals requiring stable component supply across multi-year production cycles.
Supply support for OMAP3503DCUS72 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and wireless technologies, with leadership in low-power design and industrial-grade reliability.
The OMAP3 family was engineered for high-performance mobile applications demanding rich multimedia, real-time imaging, and extended battery life - targeting portable consumer electronics before the smartphone consolidation era.
FAQ
What is the maximum supported SDRAM capacity for OMAP3503DCUS72?
The OMAP3503DCUS72 supports up to 1 GB of total external memory space via its SDRAM Controller (SDRC), configured across two banks using 15-bit addressing (A0–A14) and 32-bit data width. This capacity accommodates full HD video frame buffers and OS runtime memory for Linux or Android deployments. The actual usable size depends on LPDDR chip density and board layout signal integrity - verified in TI SPRS505H Section 6.4.
Does OMAP3503DCUS72 include PowerVR SGX graphics acceleration?
No, OMAP3503DCUS72 does not include the PowerVR SGX graphics accelerator. That feature is exclusive to the OMAP3515 variant per TI SPRS505H Section 1.1 and Figure 1-1. OMAP3503DCUS72 retains all other subsystems - MPU, ISP, display, USB, and peripherals - but omits SGX, making it suitable for applications requiring video processing and UI rendering without 3D graphics.
How many general-purpose I/O pins are available on OMAP3503DCUS72?
OMAP3503DCUS72 supports up to 188 GPIO pins as stated in TI SPRS505H Table 1-1, though pin muxing restricts simultaneous availability. Unlike CBB/CBC packages, the CUS variant does not omit GPIO_112–115 or GPIO_144–176; all 188 are physically present and functionally accessible subject to multiplexing configuration in software.
What video output standards does OMAP3503DCUS72 support natively?
OMAP3503DCUS72 supports composite NTSC and PAL video output via its dual 10-bit DACs, plus separate luma/chroma (S-video) output. It also provides parallel digital RGB (up to 24-bit) and RFBI interfaces for LCD panels. These capabilities are documented in SPRS505H Sections 1.1 and 5, with electrical specs in Section 5.2 covering vdda_dac noise and external component requirements.
Is OMAP3503DCUS72 pin-compatible with OMAP3515CBB?
No, OMAP3503DCUS72 is not pin-compatible with OMAP3515CBB. The CUS package has 423 balls and 0.65-mm pitch, while CBB uses 515 balls and 0.5-mm top / 0.4-mm bottom pitch. TI SPRS505H Table 1-1 explicitly lists differing pin counts, ball pitch, and unavailable signals (e.g., POP interface, GPMC ncs1/ncs2) - requiring distinct PCB layouts and interposer designs for each.
OMAP3503DCUS72 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 423-LFBGA, FCBGA
- Series:
- OMAP-35xx
- Packaging:
- Tray
- Product Status:
- Obsolete
- Core Processor:
- ARM® Cortex®-A8
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 720MHz
- Co-Processors/DSP:
- Multimedia; NEON™ SIMD
- RAM Controllers:
- LPDDR
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- LCD
- Ethernet:
- -
- SATA:
- -
- USB:
- USB 1.x (3), USB 2.0 (1)
- Voltage - I/O:
- 1.8V, 3.0V
- Operating Temperature:
- 0°C ~ 90°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 423-FCBGA (16x16)
- Additional Interfaces:
- HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART
OMAP3503DCUS72 FAQ
1.How can I place an order for OMAP3503DCUS72 through Aetrix?
Please submit a Request for Quotation (RFQ) for OMAP3503DCUS72 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for OMAP3503DCUS72 reliable?
The price and inventory of OMAP3503DCUS72 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for OMAP3503DCUS72 is usually 5 days.
3.What payment methods are accepted for OMAP3503DCUS72?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for OMAP3503DCUS72 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for OMAP3503DCUS72?
OMAP3503DCUS72 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your OMAP3503DCUS72 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for OMAP3503DCUS72?
For technical support, including OMAP3503DCUS72 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your OMAP3503DCUS72 requirements.
6.How does Aetrix verify that OMAP3503DCUS72 is sourced from the original manufacturer or authorized distributors?
All OMAP3503DCUS72 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that OMAP3503DCUS72 meets industry standards.
7.What is the process for return or replacement of OMAP3503DCUS72?
All OMAP3503DCUS72 units undergo pre-shipment inspection (PSI). If there is an issue with OMAP3503DCUS72, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The OMAP3503DCUS72 part is unused and in its original packaging.
Return procedure for OMAP3503DCUS72:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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