My Inquiry
My Account
Texas Instruments OMAP3503ECBB
- Part No.:
- OMAP3503ECBB
- Manufacturer:
- Texas Instruments
- Category:
- Microprocessors
- Package:
- 515-VFBGA, FCBGA
- Datasheet:
-
OMAP3503ECBB.pdf
- Description:
- IC MPU OMAP-35XX 600MHZ 515FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:130
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
OMAP3503ECBB from Texas Instruments is a 720-MHz ARM Cortex-A8 applications processor with 256-KB L2 cache, 112-KB ROM, and 64-KB shared SRAM, designed for portable media players, digital video cameras, and web tablets requiring high-performance video/image processing and Linux/Android OS support.
For engineers reviewing the OMAP3503ECBB datasheet, OMAP3503ECBB pinout, OMAP3503ECBB application, or OMAP3503ECBB equivalent, key selection criteria include its 515-pin s-PBGA (CBB) package with POP interface, discrete memory support, absence of PowerVR SGX graphics (vs. OMAP3515), and 170-GPIO capability with defined multiplexing constraints.
Technical Context
The OMAP3503ECBB implements an in-order, dual-issue, superscalar ARMv7 architecture core with NEON SIMD coprocessor and TrustZone security extensions, paired with SmartReflex dynamic voltage/frequency scaling for mobile power efficiency. Its MPU subsystem integrates a 16-KB/16-KB L1 instruction/data cache and MMU enhancements for HLOS virtualization.
It features a dedicated Camera ISP supporting BT.601/BT.656 interfaces, dual-display subsystem with RFBI and parallel RGB output up to HD resolution, and comprehensive peripheral connectivity including three high-speed I²C controllers, five McBSP audio ports (two with sidetone), and three MMC/SDIO interfaces - all routed through hierarchical L3/L4 interconnects.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | ARM Cortex-A8, ARMv7, in-order dual-issue superscalar with NEON SIMD and TrustZone |
| Clock Speed | Up to 720 MHz - enables real-time video decode/encode and responsive UI on Android/Linux |
| L2 Cache | 256 KB - reduces external memory bandwidth pressure during multimedia workloads |
| On-chip Memory | 112 KB ROM + 64 KB shared SRAM - provides boot firmware storage and low-latency scratchpad for critical tasks |
| Package | 515-pin s-PBGA (CBB suffix), 0.5-mm top / 0.4-mm bottom ball pitch - supports POP memory stacking |
| Graphics | No PowerVR SGX - distinguishes OMAP3503 from OMAP3515; relies on CPU/GPU-offload via software rendering or external GPU |
| I/O Voltage | 1.8-V I/O, 0.985–1.35-V adaptive core voltage - enables dynamic DVFS for battery life optimization |
Pinout & Package
OMAP3503ECBB uses a 515-ball, 0.5-mm (top)/0.4-mm (bottom) pitch s-PBGA package (CBB suffix) with Package-on-Package (POP) interface support and discrete memory interface. Ball assignments follow TI's CBB-specific layout across four quadrants (A–D), with unused balls at A1/A2/A22/A23/AB1/AB2/AB22/AB23/AC1/AC2/AC22/AC23/B1/B2/B22/B23.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| sdrc_d0–sdrc_d31 | SDRAM Data Bus | 32-bit bidirectional data path for LPDDR/DDR2 memory; requires matched trace lengths for signal integrity |
| sdrc_a0–sdrc_a14, sdrc_ba0–sdrc_ba1 | SDRAM Address & Bank Select | 15-bit address + 2-bit bank select for up to 1 GB address space; controlled by SDRC subsystem |
| gpmc_ncs0–gpmc_ncs7 | GPMC Chip Select | Eight chip-select outputs (CBB supports all eight); enables glueless interface to NAND/NOR/PSRAM |
| dss_data0–dss_data23, dss_hsync, dss_vsync, dss_pclk | Display Subsystem Parallel Output | 24-bit RGB + sync signals for direct LCD panel drive; supports dual-panel configuration |
| cam_d0–cam_d11, cam_pclk, cam_hs, cam_vs | Camera ISP Parallel Interface | 12-bit parallel image sensor input with pixel clock and frame/line sync; supports CCD/CMOS sensors |
| mcbsp1_dx–mcbsp1_dr, mcbsp1_clkx, mcbsp1_fsx | McBSP1 Audio Serial Interface | Full-duplex multichannel buffered serial port for I²S/PCM/TDM; used for baseband/audio codec interfacing |
Key Features
| Feature | Design Value |
|---|---|
| SmartReflex AVS | Real-time adaptive voltage scaling per power domain - reduces active power by up to 30% vs. fixed-voltage operation |
| Camera ISP | Hardware-accelerated BT.601/BT.656 capture, resize (1/4× to 4×), color space conversion, and alpha blending |
| Display Subsystem | Dual independent display pipelines with temporal dithering, RFBI support, and NTSC/PAL composite video output |
| Memory Interface Flexibility | Separate SDRC (LPDDR) and GPMC (NAND/NOR/PSRAM) controllers - enables concurrent high-bandwidth and low-latency memory access |
| Peripheral Integration | Three high-speed I²C, five McBSP (two with sidetone), four McSPI, three MMC/SDIO, 12 timers, and 188 GPIO (170 usable in CBB) |
Applications
| Portable Media Player | Digital Video Camera |
|---|---|
Use Scenario: High-resolution video playback (720p) with multitouch UI and local storage. IC Role / Device Role / Timing Role: Main applications processor executing Android framework, decoding H.264/VC-1 via DSP-assisted NEON, driving RGB LCD and audio codecs. Use Value: 720-MHz Cortex-A8 + 256-KB L2 cache delivers smooth 30-fps decode; integrated ISP offloads sensor preprocessing from CPU. |
Use Scenario: Real-time 1080i video capture, on-device encoding, and HDMI/TV-out playback. IC Role / Device Role / Timing Role: Central imaging SoC handling raw sensor data ingestion via BT.656, hardware resize, YUV→RGB conversion, and dual-display output. Use Value: Dedicated ISP pipeline enables zero-CPU-load 1080i capture; display subsystem simultaneously drives LCD and CVBS/S-video outputs. |
| Web Tablet | Point-of-Sale Terminal |
Use Scenario: Browser-based kiosk with touch interface, Wi-Fi/Bluetooth, and local media streaming. IC Role / Device Role / Timing Role: Primary HLOS host running Linux or Android, managing USB OTG, MMC storage, and parallel LCD timing. Use Value: Dual 32-bit watchdog timers ensure system reliability; 170 GPIO enable custom peripheral expansion (e.g., barcode scanner, RFID reader). |
Use Scenario: Compact retail terminal with receipt printing, magnetic stripe reading, and secure payment processing. IC Role / Device Role / Timing Role: Secure applications processor leveraging TrustZone for EMV-compliant cryptographic operations and isolated payment stack execution. Use Value: Hardware-enforced memory isolation prevents malware interference with payment firmware; SmartReflex extends battery runtime during intermittent use. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar applications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| OMAP3515ECBB | Includes PowerVR SGX 530 GPU (OMAP3503 omits SGX); identical MPU, memory, and peripheral set | Required for OpenGL ES 1.1/2.0 acceleration in 3D UI or gaming; unnecessary for 2D-only media playback | Select OMAP3515ECBB only if hardware-accelerated graphics rendering is mandatory; otherwise OMAP3503ECBB reduces BOM cost and thermal load. |
| OMAP3503ECUS | 423-pin s-PBGA (CUS), no POP interface, no discrete memory interface, reduced GPIO count (188 pins but fewer usable due to muxing) | Suitable for space-constrained designs where memory stacking and NAND/NOR support are not needed | Choose OMAP3503ECUS for compact form factors with simpler memory architecture; retain OMAP3503ECBB for maximum flexibility and scalability. |
Compared with OMAP3515ECBB, OMAP3503ECBB removes GPU silicon to lower cost and power, while retaining full CPU, ISP, and display capabilities; compared with OMAP3503ECUS, it adds POP support and full GPMC functionality for higher memory bandwidth and expandability.
Availability
OMAP3503ECBB is available at Aetrix Electronics and suitable for portable media players, digital video cameras, and web tablets requiring stable component supply and long-term industrial lifecycle support.
Supply support for OMAP3503ECBB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and wireless technologies, with decades of experience in high-performance mobile SoCs.
The OMAP3503 belongs to TI's OMAP™3 family of applications processors, engineered for cost-sensitive, battery-powered multimedia devices needing rich OS support without dedicated 3D graphics hardware.
FAQ
What distinguishes OMAP3503ECBB from OMAP3515ECBB?
The OMAP3503ECBB excludes the PowerVR SGX 530 graphics accelerator present in OMAP3515ECBB, resulting in lower power consumption, reduced die size, and lower unit cost. Both share identical ARM Cortex-A8 core speed (720 MHz), L2 cache (256 KB), memory controllers, ISP, display subsystem, and peripheral sets. The OMAP3503ECBB is functionally complete for 2D multimedia and imaging applications where GPU acceleration is unnecessary.
Does OMAP3503ECBB support Android operating system?
Yes, OMAP3503ECBB is officially supported by Android versions up to Gingerbread (2.3.x) and compatible with community-maintained BSPs for later releases. Its ARM Cortex-A8 core, NEON SIMD engine, and 256-KB L2 cache meet Android's minimum performance requirements, and TI provided reference kernels, HALs, and device drivers specifically validated for OMAP3503ECBB in commercial Android deployments.
What memory interfaces does OMAP3503ECBB support?
OMAP3503ECBB supports two independent memory subsystems: (1) SDRAM Controller (SDRC) for LPDDR/DDR2 with 32-bit data bus and up to 1 GB address space, and (2) General Purpose Memory Controller (GPMC) with eight chip-selects for NAND flash (with Hamming ECC), NOR flash, SRAM, and pseudo-SRAM. The CBB package enables both interfaces concurrently.
Is OMAP3503ECBB pin-compatible with OMAP3503ECUS?
No, OMAP3503ECBB and OMAP3503ECUS are not pin-compatible. OMAP3503ECBB uses a 515-ball s-PBGA package (CBB) with 0.5-mm/0.4-mm ball pitch and POP interface, while OMAP3503ECUS uses a 423-ball s-PBGA (CUS) with 0.65-mm pitch and no POP. Ball counts, layouts, power domains, and signal routing differ significantly - PCB redesign is required for substitution.
What camera interfaces does OMAP3503ECBB provide?
OMAP3503ECBB integrates a dedicated Camera Image Signal Processor (ISP) with parallel digital input supporting BT.601 (8-bit YCbCr 4:2:2) and BT.656 (10-bit YCbCr 4:2:2) standards. It accepts up to 12-bit raw sensor data via cam_d0–cam_d11, with pixel clock (cam_pclk), horizontal sync (cam_hs), vertical sync (cam_vs), and field (cam_fld) signals - enabling direct connection to common CMOS and CCD imagers without external logic.
OMAP3503ECBB Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 515-VFBGA, FCBGA
- Series:
- OMAP-35xx
- Packaging:
- Bulk
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A8
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 600MHz
- Co-Processors/DSP:
- Multimedia; NEON™ SIMD
- RAM Controllers:
- LPDDR
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- LCD
- Ethernet:
- -
- SATA:
- -
- USB:
- USB 1.x (3), USB 2.0 (1)
- Voltage - I/O:
- 1.8V, 3.0V
- Operating Temperature:
- 0°C ~ 90°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 515-POP-FCBGA (12x12)
- Additional Interfaces:
- HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART
OMAP3503ECBB FAQ
1.How can I place an order for OMAP3503ECBB through Aetrix?
Please submit a Request for Quotation (RFQ) for OMAP3503ECBB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for OMAP3503ECBB reliable?
The price and inventory of OMAP3503ECBB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for OMAP3503ECBB is usually 5 days.
3.What payment methods are accepted for OMAP3503ECBB?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for OMAP3503ECBB transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for OMAP3503ECBB?
OMAP3503ECBB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your OMAP3503ECBB order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for OMAP3503ECBB?
For technical support, including OMAP3503ECBB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your OMAP3503ECBB requirements.
6.How does Aetrix verify that OMAP3503ECBB is sourced from the original manufacturer or authorized distributors?
All OMAP3503ECBB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that OMAP3503ECBB meets industry standards.
7.What is the process for return or replacement of OMAP3503ECBB?
All OMAP3503ECBB units undergo pre-shipment inspection (PSI). If there is an issue with OMAP3503ECBB, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The OMAP3503ECBB part is unused and in its original packaging.
Return procedure for OMAP3503ECBB:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
OMAP3503ECBB Tags
-
AT91SAM9260B-CU-999
Microchip Technology
-
AT91SAM9G25-CU
Microchip Technology
-
ATSAMA5D27C-CU
Microchip Technology
-
AT91SAM9X35-CU
Microchip Technology
-
AT91SAM9X25-CU
Microchip Technology
-
MCIMX6Y2CVM08AB
NXP Semiconductors
.JPG)
-
AM3352BZCZ100
Texas Instruments
-
AT91SAM9260B-CU
Microchip Technology
-
AT91SAM9260B-QU
Microchip Technology
-
ATSAMA5D31A-CU
Microchip Technology
-
AT91SAM9G20B-CU-999
Microchip Technology
-
MCIMX6Y2CVM05AB
NXP Semiconductors
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
