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Texas Instruments OMAP3503ECBBA
- Part No.:
- OMAP3503ECBBA
- Manufacturer:
- Texas Instruments
- Category:
- Microprocessors
- Package:
- 515-VFBGA, FCBGA
- Datasheet:
-
OMAP3503ECBBA.pdf
- Description:
- IC MPU OMAP-35XX 600MHZ 515FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,356
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Product details
Overview
OMAP3503ECBBA from Texas Instruments is a 720-MHz ARM Cortex-A8 applications processor with 256-KB L2 cache, 112-KB ROM, and 64-KB shared SRAM, designed for portable media players and digital video cameras requiring integrated display, camera ISP, and multimedia acceleration.
For engineers reviewing the OMAP3503ECBBA datasheet, OMAP3503ECBBA pinout, OMAP3503ECBBA application, or OMAP3503ECBBA equivalent, this page delivers verified technical context, package-specific pin mapping (515-pin s-PBGA, CBB suffix), key timing and power parameters, and validated alternative options for embedded Linux and Android-based mobile systems.
Technical Context
The OMAP3503ECBBA implements an in-order, dual-issue, superscalar ARMv7 architecture core with NEON SIMD coprocessor and TrustZone security extensions. It integrates a dedicated Camera ISP supporting BT.601/656 interfaces, parallel CCD/CMOS sensor input, and hardware resize (1/4× to 4×) with color space conversion.
Its display subsystem provides dual-panel RGB output up to HD resolution, RFBI interface support, and NTSC/PAL composite video generation via two 10-bit DACs. Memory subsystem includes SDRAM controller (SDRC) with LPDDR support and General Purpose Memory Controller (GPMC) with eight chip-selects - though gpmc_ncs1/ncs2 and gpmc_wait1/wait2 are omitted in the CBB package.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Frequency | Up to 720 MHz - enables real-time H.264 decode at VGA resolution under Linux kernel with TI Codec Engine. |
| L2 Cache | 256 KB - reduces external memory bandwidth demand for multimedia workloads and OS task switching. |
| On-chip Memory | 112 KB ROM + 64 KB shared SRAM - hosts boot ROM firmware and fast-access scratchpad for critical ISR and DMA buffers. |
| Video DACs | Two 10-bit DACs - generate analog NTSC/PAL composite video and S-video outputs without external converters. |
| Process Node | 65-nm CMOS - enables adaptive voltage scaling (SmartReflex AVS) for dynamic core voltage adjustment between 0.985 V and 1.35 V. |
| I/O Voltage | 1.8-V I/O with 3.0-V MMC1 support - allows direct interfacing to LPDDR SDRAM and SD cards while maintaining low-power logic levels. |
| Package | 515-pin s-PBGA (CBB suffix), 0.5-mm top / 0.4-mm bottom ball pitch - supports POP memory stacking for compact handheld form factors. |
Pinout & Package
The OMAP3503ECBBA is housed in a 515-ball s-PBGA package with CBB suffix, featuring 0.5-mm ball pitch on top and 0.4-mm on bottom, optimized for Package-on-Package (POP) memory stacking. Ball assignments follow TI's SPRS505H specification, with quadrant-specific signal mapping confirmed for CBB layout.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| sdrc_d0–sdrc_d31 | SDRAM Data Bus | 32-bit bidirectional data path for LPDDR/DDR2 memory; requires matched trace lengths and termination per JEDEC spec. |
| sdrc_a0–sdrc_a14, sdrc_ba0–sdrc_ba1 | SDRAM Address & Bank Select | 16-bit address + 2-bit bank select for up to 1 GB address space; multiplexed with GPMC in some configurations. |
| gpmc_ncs0–gpmc_ncs7 | GPMC Chip Selects | Eight chip-select outputs - but ncs1/ncs2 are not available in CBB package; used for NOR/NAND flash, SRAM, FPGA glueless interface. |
| dss_data0–dss_data23, dss_hsync, dss_vsync, dss_pclk | Display Subsystem Parallel Output | 24-bit RGB + sync signals - directly drives TFT LCD panels up to 1280×720; supports RFBI mode for Sharp/Hitachi displays. |
| cam_d0–cam_d11, cam_pclk, cam_hs, cam_vs, cam_fld | Camera ISP Parallel Interface | 12-bit parallel image data bus with pixel clock and frame/line sync - connects to CMOS/CCD sensors without external FIFO or bridge IC. |
| uart1_tx/rx/cts/rts, uart2_tx/rx, uart3_tx/rx/irrx/irtx | Asynchronous Serial Interfaces | Three UARTs - UART1 supports IrDA/CIR; UART3 includes infrared transceiver pins; all support RTS/CTS flow control. |
Key Features
| Feature | Design Value |
|---|---|
| ARM Cortex-A8 Core | In-order dual-issue superscalar execution with 16-KB I-cache/16-KB D-cache - delivers >2× Dhrystone MIPS/Watt vs ARM926EJ-S. |
| Camera ISP | Hardware-accelerated pipeline including BT.601/656 capture, resize (1/4× to 4×), color space conversion, and alpha blending - offloads CPU during video recording. |
| Display Subsystem | Dual independent display layers (graphics + video) with temporal dithering, 3-layer composition, and HD resolution output - enables simultaneous UI rendering and video playback. |
| SmartReflex AVS | Adaptive voltage scaling across MPU domain using on-die process/voltage/temperature sensors - reduces active power by up to 40% at nominal frequency. |
| GPMC Flexibility | Configurable asynchronous protocol engine supporting NAND ECC (Hamming), NOR, SRAM, and FPGA interfaces - eliminates need for external glue logic in industrial HMI designs. |
Applications
| Portable Media Player | Digital Video Camera |
|---|---|
Use Scenario: High-resolution video playback with touch UI and battery life optimization. IC Role / Device Role / Timing Role: Main applications processor executing Android/Linux, driving LCD panel, decoding H.264/VC-1, and managing NAND storage. Use Value: Integrated display subsystem and SmartReflex reduce BOM count and extend runtime by enabling dynamic DVFS during video decode. |
Use Scenario: Real-time 720p video capture with electronic image stabilization and HDMI output. IC Role / Device Role / Timing Role: Camera ISP front-end processing, ARM core running V4L2 driver stack, and dual-display subsystem outputting preview + encoded stream. Use Value: Hardware resize and color space conversion enable 1080p sensor input scaled to 720p preview at 30 fps without CPU load. |
| Web Tablet | Point-of-Sale Terminal |
Use Scenario: Compact tablet with resistive/capacitive touchscreen, Wi-Fi, and web browsing performance. IC Role / Device Role / Timing Role: Primary SoC running Android, managing USB OTG host, SDIO Wi-Fi, and GPIO-based touch controller interface. Use Value: 188 GPIO pins and McSPI/McBSP peripherals allow integration of custom I/O expanders and audio codecs without additional ASICs. |
Use Scenario: Ruggedized retail terminal with barcode scanner, thermal printer, and secure payment interface. IC Role / Device Role / Timing Role: Secure applications processor handling EMV L1/L2 stack, managing RS-232/USB printer, and driving monochrome LCD with backlight PWM. Use Value: TrustZone-enabled secure boot and 12 GP timers with PWM capability simplify PCI-compliant peripheral control and audit logging. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar applications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| OMAP3515ECBBA | Includes PowerVR SGX graphics accelerator; same package, pinout, and memory subsystem. | Required for OpenGL ES 2.0-based 3D UIs and gaming; OMAP3503ECBBA lacks GPU hardware. | Select OMAP3515ECBBA when GPU-accelerated rendering is mandatory; otherwise OMAP3503ECBBA reduces cost and power in 2D-only applications. |
| AM3517BZCNA | ARM Cortex-A8 at 600 MHz, no video DACs, no camera ISP, but adds Ethernet MAC and USB 2.0 PHY. | Suitable for industrial HMIs and networked gateways where video output is handled externally. | Choose AM3517BZCNA for wired connectivity focus; OMAP3503ECBBA remains optimal for battery-powered multimedia endpoints. |
Compared with OMAP3515ECBBA, the OMAP3503ECBBA omits the PowerVR SGX GPU but retains identical CPU, memory, display, and camera capabilities - making it ideal for cost-sensitive, non-gaming multimedia devices. Versus AM3517BZCNA, it trades Ethernet for integrated video DACs and ISP, prioritizing analog video and imaging over networking.
Availability
OMAP3503ECBBA is available at Aetrix Electronics and suitable for portable media players, digital video cameras, and point-of-sale terminals requiring stable component supply and long-term industrial lifecycle support.
Supply support for OMAP3503ECBBA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, specializing in analog, embedded processing, and wireless technologies since 1930.
The OMAP3503ECBBA belongs to TI's OMAP™3 family of applications processors, engineered for high-performance, low-power mobile multimedia devices running Linux, Android, or Windows CE.
FAQ
What is the maximum operating frequency of the OMAP3503ECBBA?
The OMAP3503ECBBA operates at up to 720 MHz under commercial temperature conditions (0°C to 90°C). This frequency is achieved with adaptive core voltage ranging from 0.985 V to 1.35 V, managed by SmartReflex AVS. The device supports multiple OPP (Operating Performance Points) defined in TI's software stack, and actual sustained frequency depends on thermal design and power delivery stability. OMAP3503ECBBA does not support overclocking beyond its rated specification.
Does the OMAP3503ECBBA include a graphics accelerator?
No, the OMAP3503ECBBA does not integrate a PowerVR SGX graphics accelerator. That feature is exclusive to the OMAP3515ECBBA variant within the same family. The OMAP3503ECBBA relies on CPU-based rendering or optional external GPUs for 3D graphics. Its display subsystem supports 2D composition, alpha blending, and video layering, but lacks programmable pixel/vertex shaders required for OpenGL ES 2.0 compliance. OMAP3503ECBBA is optimized for 2D UI and video-centric applications.
What video output interfaces does the OMAP3503ECBBA support?
The OMAP3503ECBBA supports analog composite video (NTSC/PAL) and S-video outputs via two integrated 10-bit DACs, as well as parallel RGB digital output up to HD resolution (1280×720) through its Display Subsystem. It also supports RFBI (Remote Frame Buffer Interface) for Sharp and Hitachi LCD panels. HDMI output requires an external TFP410 or similar TMDS encoder. OMAP3503ECBBA does not include native LVDS or MIPI DSI transmitters.
Is the OMAP3503ECBBA pin-compatible with the OMAP3515ECBBA?
Yes, the OMAP3503ECBBA and OMAP3515ECBBA share identical 515-pin s-PBGA (CBB) package dimensions, ball pitch, and pinout - including all power, ground, memory, and peripheral signals. The only functional difference is the absence of the PowerVR SGX GPU block in OMAP3503ECBBA; all other subsystems (CPU, ISP, display, GPMC, USB, etc.) are electrically and mechanically compatible. PCBs designed for OMAP3515ECBBA can use OMAP3503ECBBA without layout changes.
What camera interfaces are supported by the OMAP3503ECBBA?
The OMAP3503ECBBA integrates a dedicated Camera Image Signal Processor (ISP) with parallel interface supporting BT.601 (8-bit YCbCr 4:2:2) and BT.656 (10-bit YCbCr 4:2:2) standards. It accepts up to 12-bit parallel data (cam_d0–cam_d11), pixel clock (cam_pclk), horizontal/vertical sync (cam_hs/cam_vs), and field sync (cam_fld). The ISP performs hardware resize, color space conversion, and noise filtering - eliminating need for external image processors in digital video cameras and portable media players using OMAP3503ECBBA.
OMAP3503ECBBA Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 515-VFBGA, FCBGA
- Series:
- OMAP-35xx
- Packaging:
- Bulk
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A8
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 600MHz
- Co-Processors/DSP:
- Multimedia; NEON™ SIMD
- RAM Controllers:
- LPDDR
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- LCD
- Ethernet:
- -
- SATA:
- -
- USB:
- USB 1.x (3), USB 2.0 (1)
- Voltage - I/O:
- 1.8V, 3.0V
- Operating Temperature:
- -40°C ~ 105°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 515-POP-FCBGA (12x12)
- Additional Interfaces:
- HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART
OMAP3503ECBBA FAQ
1.How can I place an order for OMAP3503ECBBA through Aetrix?
Please submit a Request for Quotation (RFQ) for OMAP3503ECBBA on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for OMAP3503ECBBA reliable?
The price and inventory of OMAP3503ECBBA are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for OMAP3503ECBBA is usually 5 days.
3.What payment methods are accepted for OMAP3503ECBBA?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for OMAP3503ECBBA transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for OMAP3503ECBBA?
OMAP3503ECBBA orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your OMAP3503ECBBA order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for OMAP3503ECBBA?
For technical support, including OMAP3503ECBBA datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your OMAP3503ECBBA requirements.
6.How does Aetrix verify that OMAP3503ECBBA is sourced from the original manufacturer or authorized distributors?
All OMAP3503ECBBA products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that OMAP3503ECBBA meets industry standards.
7.What is the process for return or replacement of OMAP3503ECBBA?
All OMAP3503ECBBA units undergo pre-shipment inspection (PSI). If there is an issue with OMAP3503ECBBA, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The OMAP3503ECBBA part is unused and in its original packaging.
Return procedure for OMAP3503ECBBA:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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