My Inquiry
My Account
Texas Instruments OMAP3503ECBBALPD
- Part No.:
- OMAP3503ECBBALPD
- Manufacturer:
- Texas Instruments
- Category:
- Microprocessors
- Package:
- 515-VFBGA, FCBGA
- Datasheet:
-
OMAP3503ECBBALPD.pdf
- Description:
- IC MPU OMAP-35XX 600MHZ 515FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,917
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
OMAP3503ECBBALPD from Texas Instruments is a 720-MHz ARM Cortex-A8 applications processor in a 515-pin s-PBGA (CBB) package, featuring 256-KB L2 cache, 112-KB ROM, 64-KB shared SRAM, and integrated camera ISP, display subsystem, and SDRC for LPDDR memory. It targets portable media players and digital video cameras requiring high-resolution imaging and Linux/Android OS support.
For engineers reviewing the OMAP3503ECBBALPD datasheet, OMAP3503ECBBALPD pinout, OMAP3503ECBBALPD application, or OMAP3503ECBBALPD equivalent, key selection criteria include its 720-MHz MPU core frequency, POP-enabled 515-ball CBB package, absence of PowerVR SGX graphics (distinguishing it from OMAP3515), dual DACs for composite video output, and SmartReflex DVFS for adaptive voltage scaling in battery-constrained designs.
Technical Context
The OMAP3503ECBBALPD implements an in-order, dual-issue, superscalar ARMv7 architecture with NEON SIMD coprocessor and TrustZone security extensions. Its memory subsystem includes a 16-KB/16-KB L1 instruction/data cache, SDRAM controller supporting LPDDR, and GPMC for NAND/NOR flash interfacing.
It integrates a dedicated Camera ISP with BT.601/BT.656 interfaces, a three-layer display processor supporting dual LCD panels and RFBI, and two 10-bit DACs for NTSC/PAL analog video output - all operating under a unified SmartReflex power management framework with dynamic voltage and frequency scaling.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | ARM Cortex-A8, ARMv7, in-order dual-issue superscalar microprocessor |
| Max Core Frequency | 720 MHz - defines real-time processing ceiling for HLOS tasks and multimedia pipelines |
| L2 Cache | 256 KB - reduces external memory bandwidth demand for video decode and image processing |
| On-chip Memory | 112 KB ROM + 64 KB shared SRAM - enables secure boot and low-latency firmware execution |
| Video Output | 2× 10-bit DACs - supports simultaneous composite NTSC and PAL analog video output |
| Power Management | SmartReflex AVS with DVFS - dynamically scales core voltage (0.985–1.35 V) and frequency per workload |
| Package | 515-pin s-PBGA (CBB), 0.5-mm top / 0.4-mm bottom ball pitch - supports POP memory stacking |
Pinout & Package
The OMAP3503ECBBALPD is housed in a 515-ball, 0.5-mm (top)/0.4-mm (bottom) pitch s-PBGA package (CBB suffix) with Package-on-Package (POP) interface support for stacked memory. Ball assignments follow TI SPRS505H Figure 2-6 through 2-9.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| sdrc_d0–sdrc_d31 | SDRAM data bus | 32-bit bidirectional interface to LPDDR SDRAM; timing-critical for video frame buffering |
| sdrc_a0–sdrc_a14, sdrc_ba0–sdrc_ba1 | SDRAM address & bank select | 16-bit address + 2-bit bank addressing for up to 1 GB memory space |
| gpmc_ncs0–gpmc_ncs7 | GPMC chip-select outputs | Eight independent enables for NOR/NAND/SRAM peripherals; ncs1/ncs2 omitted in CBB package |
| dss_data0–dss_data23, dss_hsync, dss_vsync | Parallel RGB/YUV display interface | Up to 24-bit RGB + sync signals for direct LCD panel connection or RFBI bridge |
| tv_out1, tv_out2, tv_vref | Analog video DAC outputs | Dual 10-bit current-output DACs with external filter components for NTSC/PAL CVBS/S-Video |
| cam_pclk, cam_hs, cam_vs, cam_d0–cam_d11 | Parallel camera sensor interface | 12-bit parallel input supporting CCD/CMOS imagers at up to 50-MHz pixel clock |
Key Features
| Feature | Design Value |
|---|---|
| ARM Cortex-A8 + NEON | Enables efficient H.264 decode and OpenGLES 1.1/2.0 acceleration without discrete GPU |
| Camera ISP with BT.656 | Hardware-accelerated image pipeline including color space conversion, resize (1/4x–4x), and anti-aliasing |
| Dual 10-bit Video DACs | Direct analog video output eliminates need for external encoder IC in portable media devices |
| SmartReflex DVFS | Reduces active power by up to 40% vs. fixed-voltage operation under variable computational load |
| POP-compatible CBB package | Enables compact system-in-package design with stacked mobile DDR memory for space-constrained PCBs |
Applications
| Portable Media Player | Digital Video Camera |
|---|---|
Use Scenario: High-resolution video playback (720p) with touch UI and long battery life. IC Role / Device Role / Timing Role: Main applications processor executing Android/Linux, managing video decode, display rendering, and power-aware scheduling. Use Value: Integrated ISP and dual DACs eliminate external video encoder; SmartReflex extends runtime by dynamically scaling voltage/frequency during playback vs. menu navigation. | Use Scenario: Real-time HD video capture, preview, and storage to SD card. IC Role / Device Role / Timing Role: Image signal processor front-end with parallel sensor interface, hardware scaler, and display subsystem for live view. Use Value: BT.656 interface and on-chip resize engine offload CPU from pixel processing; GPMC enables glueless NAND flash recording. |
| Web Tablet | Point-of-Sale Terminal |
Use Scenario: Compact touchscreen tablet running web browser and local apps with video streaming capability. IC Role / Device Role / Timing Role: Single-chip host processor handling UI rendering, network stack, and HTML5 video decoding via NEON-accelerated codecs. Use Value: 720-MHz Cortex-A8 delivers responsive web interaction; integrated USB OTG and MMC/SDIO support peripheral expansion without bridge ICs. | Use Scenario: Rugged handheld terminal capturing customer signatures, displaying receipts, and printing via thermal head. IC Role / Device Role / Timing Role: Central controller managing touchscreen, serial printer interface, and secure payment co-processor communication. Use Value: 188 GPIO pins enable flexible I/O expansion; dual DACs drive analog receipt printers or status indicators; TrustZone isolates payment firmware. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar applications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| OMAP3515ECBBALPD | Includes PowerVR SGX 3D graphics accelerator; identical MPU core, cache, memory interfaces, and package | Required for OpenGL ES 2.0-based UIs or 3D gaming; not needed for 2D media playback or industrial HMI | Select OMAP3515ECBBALPD only if hardware-accelerated 3D graphics or OpenVG 1.0 vector rendering is mandatory |
| AM3517BZCNA | Successor device with same ARM Cortex-A8 core but enhanced peripherals: USB 2.0 PHY, improved GPMC, and updated power management | Better long-term supply and extended temperature support; lacks POP interface and some legacy video features | Choose AM3517BZCNA for new designs requiring lifecycle assurance and USB host capability; verify DAC and ISP compatibility |
Compared with OMAP3515ECBBALPD, the OMAP3503ECBBALPD omits PowerVR SGX to reduce cost and power while retaining full imaging and video I/O - making it optimal for cost-sensitive media players. Versus AM3517BZCNA, it offers POP support and legacy video DACs but has shorter projected availability and no integrated USB PHY.
Availability
OMAP3503ECBBALPD is available at Aetrix Electronics and suitable for portable media players, digital video cameras, and point-of-sale terminals requiring stable component supply across extended product lifecycles.
Supply support for OMAP3503ECBBALPD includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies with over 50 years of innovation in low-power, high-performance silicon.
The OMAP3503ECBBALPD belongs to TI's OMAP™3 family of applications processors, designed specifically for portable multimedia devices requiring balanced performance, power efficiency, and rich peripheral integration - especially where analog video output and camera capture are central functions.
FAQ
What distinguishes OMAP3503ECBBALPD from OMAP3515ECBBALPD?
The OMAP3503ECBBALPD and OMAP3515ECBBALPD share identical ARM Cortex-A8 cores, memory subsystems, and packaging, but OMAP3503ECBBALPD excludes the PowerVR SGX 3D graphics accelerator present in OMAP3515ECBBALPD. This makes OMAP3503ECBBALPD lower-cost and lower-power, optimized for 2D media playback and imaging applications without demanding 3D graphics requirements.
Does OMAP3503ECBBALPD support analog video output?
Yes, OMAP3503ECBBALPD integrates two 10-bit digital-to-analog converters (DACs) supporting composite NTSC and PAL video output, as well as separate luma/chroma (S-Video) signals. These DACs require external passive RC filters per TI SPRS505H Section 5.4 to meet CVBS spectral mask requirements.
What memory interfaces does OMAP3503ECBBALPD support?
OMAP3503ECBBALPD supports LPDDR SDRAM via its SDRAM Controller (SDRC) with 32-bit data bus and up to 1 GB address space, plus a General Purpose Memory Controller (GPMC) with eight chip-selects for NOR/NAND flash, SRAM, and FPGA interfacing. The CBB package implements all eight GPMC chip-selects except ncs1 and ncs2.
Is OMAP3503ECBBALPD compatible with Android and Linux operating systems?
Yes, OMAP3503ECBBALPD is fully supported by Linux kernel versions 2.6.32+ and Android 2.2 (Froyo) and later. TI provides official BSPs including kernel drivers for its ISP, display subsystem, SDRC, and SmartReflex power management - enabling production deployment of Android-based portable media players and tablets.
What package type and ball pitch does OMAP3503ECBBALPD use?
OMAP3503ECBBALPD uses a 515-pin plastic ball grid array (s-PBGA) package with CBB suffix, featuring 0.5-mm ball pitch on the top side and 0.4-mm ball pitch on the bottom side. This asymmetric pitch enables Package-on-Package (POP) stacking with compatible mobile DDR memory packages.
OMAP3503ECBBALPD Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 515-VFBGA, FCBGA
- Series:
- OMAP-35xx
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A8
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 600MHz
- Co-Processors/DSP:
- Multimedia; NEON™ SIMD
- RAM Controllers:
- LPDDR
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- LCD
- Ethernet:
- -
- SATA:
- -
- USB:
- USB 1.x (3), USB 2.0 (1)
- Voltage - I/O:
- 1.8V, 3.0V
- Operating Temperature:
- -40°C ~ 105°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 515-POP-FCBGA (12x12)
- Additional Interfaces:
- HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART
OMAP3503ECBBALPD FAQ
1.How can I place an order for OMAP3503ECBBALPD through Aetrix?
Please submit a Request for Quotation (RFQ) for OMAP3503ECBBALPD on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for OMAP3503ECBBALPD reliable?
The price and inventory of OMAP3503ECBBALPD are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for OMAP3503ECBBALPD is usually 5 days.
3.What payment methods are accepted for OMAP3503ECBBALPD?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for OMAP3503ECBBALPD transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for OMAP3503ECBBALPD?
OMAP3503ECBBALPD orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your OMAP3503ECBBALPD order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for OMAP3503ECBBALPD?
For technical support, including OMAP3503ECBBALPD datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your OMAP3503ECBBALPD requirements.
6.How does Aetrix verify that OMAP3503ECBBALPD is sourced from the original manufacturer or authorized distributors?
All OMAP3503ECBBALPD products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that OMAP3503ECBBALPD meets industry standards.
7.What is the process for return or replacement of OMAP3503ECBBALPD?
All OMAP3503ECBBALPD units undergo pre-shipment inspection (PSI). If there is an issue with OMAP3503ECBBALPD, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The OMAP3503ECBBALPD part is unused and in its original packaging.
Return procedure for OMAP3503ECBBALPD:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
OMAP3503ECBBALPD Tags
-
AT91SAM9260B-CU-999
Microchip Technology
-
AT91SAM9G25-CU
Microchip Technology
-
ATSAMA5D27C-CU
Microchip Technology
-
AT91SAM9X35-CU
Microchip Technology
-
AT91SAM9X25-CU
Microchip Technology
-
MCIMX6Y2CVM08AB
NXP Semiconductors
.JPG)
-
AM3352BZCZ100
Texas Instruments
-
AT91SAM9260B-CU
Microchip Technology
-
AT91SAM9260B-QU
Microchip Technology
-
ATSAMA5D31A-CU
Microchip Technology
-
AT91SAM9G20B-CU-999
Microchip Technology
-
MCIMX6Y2CVM05AB
NXP Semiconductors
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
