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Texas Instruments OMAP3503ECUS72

Part No.:
OMAP3503ECUS72
Manufacturer:
Texas Instruments
Category:
Microprocessors
Package:
423-LFBGA, FCBGA
Datasheet:
AetrixOMAP3503ECUS72.pdf
Description:
IC MPU OMAP-35XX 720MHZ 423FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,082

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Product details

Overview

OMAP3503ECUS72 from Texas Instruments is a 720-MHz ARM Cortex-A8 applications processor in a 423-pin s-PBGA (CUS) package, featuring 256-KB L2 cache, 112-KB ROM, 64-KB shared SRAM, and integrated display subsystem supporting HD resolution, camera ISP, and dual LCD panels - deployed in portable media players and digital video cameras.

For engineers reviewing the OMAP3503ECUS72 datasheet, OMAP3503ECUS72 pinout, OMAP3503ECUS72 application, or OMAP3503ECUS72 equivalent, key selection considerations include its CUS-package–specific GPIO count (188 pins), absence of POP interface and discrete memory interface, SDRC/GPMC memory controller support, and SmartReflex-enabled adaptive voltage scaling for mobile power optimization.

Technical Context

The OMAP3503ECUS72 implements an in-order, dual-issue, superscalar ARMv7 architecture core with NEON SIMD coprocessor and TrustZone security extensions. Its MPU subsystem integrates a 16-KB/16-KB L1 instruction/data cache and MMU enhancements enabling Linux, Android, and Windows CE execution.

Unlike the OMAP3515, it omits the PowerVR SGX graphics accelerator. It retains full camera ISP (CCD/CMOS, BT.601/BT.656), display subsystem (RGB, RFBI, NTSC/PAL DACs), and serial interfaces including five McBSPs, four McSPI ports, three UARTs (one with IrDA/CIR), and three I²C controllers - all mapped to the 423-ball CUS package pinout.

Key Specifications

ParameterValue and Actual Design Meaning
Core ArchitectureARM Cortex-A8, ARMv7, Thumb-2, TrustZone, NEON SIMD coprocessor - enables HLOS execution and multimedia acceleration without external GPU.
Max Clock Frequency720 MHz - defines real-time video decode/encode throughput ceiling and OS scheduler responsiveness in embedded media applications.
L2 Cache256 KB - reduces external memory bandwidth demand and latency for concurrent video, graphics, and OS operations.
On-chip Memory112 KB ROM + 64 KB shared SRAM - provides boot firmware storage and low-latency scratchpad for critical ISR and display pipeline buffers.
Memory InterfacesSDRAM Controller (SDRC) + General Purpose Memory Controller (GPMC) - supports LPDDR SDRAM and glueless NAND/NOR/PSRAM for cost-optimized BOMs.
Display SupportDual LCD panels, HD max resolution, NTSC/PAL composite output via 2×10-bit DACs - enables primary display + secondary status screen or video-out functionality.
Power ManagementSmartReflex AVS with DVFS - dynamically scales core voltage (0.985–1.35 V) and frequency to match workload, reducing active power in battery-powered devices.

Pinout & Package

OMAP3503ECUS72 uses a 423-pin s-PBGA package (CUS suffix) with 0.65-mm ball pitch, no POP interface, and no discrete memory interface - distinguishing it from CBB/CBC variants. Ball assignments follow TI SPRS505H Figure 2-5 and Table 2-3.

Pin/TerminalCircuit RoleDesign Meaning
sdrc_d0–sdrc_d31SDRAM data bus32-bit bidirectional interface to LPDDR SDRAM; timing-critical path requiring matched trace lengths and termination.
sdrc_a0–sdrc_a14, sdrc_ba0–sdrc_ba1SDRAM address/bank select16-bit address + 2-bit bank control for up to 1 GB address space; multiplexed with GPMC in some configurations.
gpmc_a0–gpmc_a10, gpmc_nwe, gpmc_noe, gpmc_ncs0–ncs7GPMC address/controlSupports NAND/NOR flash, SRAM, FPGA glueless interfacing; CUS package provides all 8 chip-selects but no gpmc_wait1/2 or ncs1/2.
dss_data0–dss_data23, dss_pclk, dss_hsync, dss_vsyncParallel RGB display interfaceUp to 24-bit RGB + sync signals for direct LCD panel drive; enables high-fidelity local display without external TCON.
cam_d0–cam_d11, cam_pclk, cam_hs, cam_vs, cam_fldParallel camera sensor interface12-bit parallel input supporting BT.601/BT.656 protocols; connects directly to CMOS/CCD imagers with minimal external logic.
uart1_tx/rx/cts/rts, uart2_tx/rx, uart3_tx/rx/irrx/irtxAsynchronous serial I/OThree UARTs with infrared support; UART1 triple-muxed CTS/RTS enables flexible debug/peripheral routing on dense PCBs.

Key Features

FeatureDesign Value
ARM Cortex-A8 Core720-MHz superscalar execution with 16-KB/16-KB L1 cache and 256-KB L2 cache - delivers >2× ARM9 performance for real-time media processing.
Camera ISPHardware-accelerated image capture pipeline supporting CCD/CMOS sensors, BT.601/BT.656, and resize (1/4× to 4×) - offloads CPU from pixel-level processing.
Display SubsystemDual-layer video + graphics compositor with temporal dithering, 3-Layer overlay, and NTSC/PAL DACs - enables rich UI with video-in-background capability.
SmartReflex AVSAdaptive voltage scaling across 0.985–1.35 V core range - reduces dynamic power by up to 40% versus fixed-voltage operation at same frequency.
Peripheral Integration5×McBSP, 4×McSPI, 3×UART, 3×I²C, 12×GP timers, 188×GPIO - minimizes external logic and simplifies board layout for portable designs.

Applications

Portable Media PlayerDigital Video Camera

Use Scenario: High-resolution video playback with multitouch UI and background audio decoding.

IC Role / Device Role / Timing Role: Main applications processor executing Android/Linux, driving LCD and audio codecs via McBSP, managing NAND storage via GPMC.

Use Value: Integrated display subsystem and ISP eliminate external video encoder/decoder ICs, reducing BOM cost and PCB area by ~35%.

Use Scenario: Real-time 720p video capture, on-device encoding, and HDMI/NTSC output.

IC Role / Device Role / Timing Role: Camera ISP front-end processes raw sensor data; ARM Cortex-A8 runs H.264 encoder; DACs generate analog video output.

Use Value: Hardware-resize engine and BT.656 interface enable direct CMOS sensor connection without FPGA bridging, cutting development time by 6–8 weeks.

Portable Navigation DeviceWeb Tablet

Use Scenario: GPS-assisted turn-by-turn navigation with live traffic overlay and voice guidance.

IC Role / Device Role / Timing Role: MPU executes navigation stack; display subsystem overlays map graphics on video feed; UARTs interface to GPS module and cellular modem.

Use Value: Dual LCD support allows simultaneous map view and status bar; SmartReflex extends battery life to >8 hours under mixed workload.

Use Scenario: Web browsing, video streaming, and document editing on 7-inch resistive/capacitive touch display.

IC Role / Device Role / Timing Role: Runs Android with hardware-accelerated OpenGL ES 1.1/2.0; SDRC interfaces to 512 MB LPDDR; GPMC handles optional eMMC boot.

Use Value: NEON SIMD and L2 cache accelerate JavaScript and video decode, achieving 30+ FPS on 1080p YouTube playback.

Equivalent & Alternatives

The following parts are listed as comparable options for similar applications processor applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
OMAP3515ECBB72Includes PowerVR SGX graphics accelerator; CBB package supports POP memory stacking and discrete memory interface.Required for OpenGL ES 2.0–intensive UIs (e.g., 3D maps); supports higher memory bandwidth via POP LPDDR.Select when GPU-accelerated graphics or >1 GB RAM expansion is mandatory; not drop-in due to package and pinout differences.
AM3517BZCNA3ARM Cortex-A8 at 600 MHz; identical CUS package; omits camera ISP and video DACs; adds PRU-based industrial peripherals.Suited for industrial HMIs and gateway devices needing CAN/Ethernet but no camera/video; lower power and cost.Choose for deterministic real-time I/O (PRU) over multimedia features; shares footprint but requires redesign of camera/display signal routing.

Compared with OMAP3515ECBB72 and AM3517BZCNA3, OMAP3503ECUS72 uniquely balances multimedia capability (ISP + DACs + display) and compact CUS packaging - making it optimal for cost-sensitive, battery-powered consumer devices where GPU acceleration is unnecessary.

Availability

OMAP3503ECUS72 is available at Aetrix Electronics and suitable for portable media players, digital video cameras, and web tablets requiring stable component supply, long-lifecycle support, and qualified industrial-grade temperature operation.

Supply support for OMAP3503ECUS72 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of expertise in low-power, high-performance processors for mobile and industrial markets.

The OMAP3503 belongs to TI's OMAP 3 family - designed specifically for portable multimedia applications demanding high-definition video, rich graphics, and extended battery life through advanced power management.

FAQ

What is the maximum operating frequency of the OMAP3503ECUS72?

The OMAP3503ECUS72 operates at a maximum guaranteed frequency of 720 MHz under commercial temperature conditions. This rating is validated per TI SPRS505H Section 3.3 and applies to the CUS-package variant across its specified voltage range (0.985 V to 1.35 V core). The OMAP3503ECUS72 achieves this frequency using adaptive voltage scaling via SmartReflex, and actual sustained clock depends on thermal design and power delivery stability.

Does the OMAP3503ECUS72 include a PowerVR SGX graphics accelerator?

No, the OMAP3503ECUS72 does not include the PowerVR SGX graphics accelerator. That feature is exclusive to the OMAP3515 device variant. The OMAP3503ECUS72 retains full video processing capability - including display subsystem, camera ISP, and dual DACs - but relies on CPU and NEON for graphics rendering. This makes OMAP3503ECUS72 suitable for applications requiring video playback and UI composition without heavy 3D graphics workloads.

What memory interfaces are supported by the OMAP3503ECUS72?

The OMAP3503ECUS72 supports two primary memory interfaces: the SDRAM Controller (SDRC) for LPDDR SDRAM and the General Purpose Memory Controller (GPMC) for NAND/NOR flash, SRAM, and FPGA interfacing. Notably, the CUS package omits the discrete memory interface and POP interface found in CBB/CBC packages. GPMC provides eight chip-selects and flexible asynchronous protocol control, while SDRC supports 16-/32-bit data buses and up to 1 GB total address space - confirmed in SPRS505H Sections 1.1 and 6.4.

How many GPIO pins are available on the OMAP3503ECUS72?

Up to 188 general-purpose I/O pins are supported on the OMAP3503ECUS72, as documented in TI SPRS505H Table 1-1. However, pin multiplexing restricts the number simultaneously usable - actual count depends on active peripheral selections (e.g., enabling UART1 disables certain GPIO functions). The CUS package provides full access to all 188 GPIOs, unlike CBB which sacrifices 16 GPIOs, and pin assignments are defined in Table 2-3 and Figures 2-5 through 2-9 of the datasheet.

What video output standards does the OMAP3503ECUS72 support?

The OMAP3503ECUS72 supports NTSC and PAL composite video output via two integrated 10-bit digital-to-analog converters (DACs), as specified in SPRS505H Sections 1.1 and 5.2. It also provides parallel RGB (up to 24-bit) and RFBI interfaces for direct LCD panel drive. The DACs support luma/chroma separate (S-video) and combined (composite) outputs, with programmable gain and filtering - enabling analog video output without external encoders in portable media and navigation devices.

OMAP3503ECUS72 Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Package/Case:
423-LFBGA, FCBGA
Series:
OMAP-35xx
Packaging:
Tray
Product Status:
Active
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
720MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
-
SATA:
-
USB:
USB 1.x (3), USB 2.0 (1)
Voltage - I/O:
1.8V, 3.0V
Operating Temperature:
0°C ~ 90°C (TJ)
Grade:
-
Qualification:
-
Security Features:
-
Mounting Type:
Surface Mount
Supplier Device Package:
423-FCBGA (16x16)
Additional Interfaces:
HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART

OMAP3503ECUS72 FAQ

1.How can I place an order for OMAP3503ECUS72 through Aetrix?

Please submit a Request for Quotation (RFQ) for OMAP3503ECUS72 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for OMAP3503ECUS72 reliable?

The price and inventory of OMAP3503ECUS72 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for OMAP3503ECUS72 is usually 5 days.

3.What payment methods are accepted for OMAP3503ECUS72?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for OMAP3503ECUS72 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for OMAP3503ECUS72?

OMAP3503ECUS72 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your OMAP3503ECUS72 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for OMAP3503ECUS72?

For technical support, including OMAP3503ECUS72 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your OMAP3503ECUS72 requirements.

6.How does Aetrix verify that OMAP3503ECUS72 is sourced from the original manufacturer or authorized distributors?

All OMAP3503ECUS72 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that OMAP3503ECUS72 meets industry standards.

7.What is the process for return or replacement of OMAP3503ECUS72?

All OMAP3503ECUS72 units undergo pre-shipment inspection (PSI). If there is an issue with OMAP3503ECUS72, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The OMAP3503ECUS72 part is unused and in its original packaging.

Return procedure for OMAP3503ECUS72:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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