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Texas Instruments OMAP3515DCBC

Part No.:
OMAP3515DCBC
Manufacturer:
Texas Instruments
Category:
Microprocessors
Package:
515-VFBGA, FCBGA
Datasheet:
AetrixOMAP3515DCBC.pdf
Description:
IC MPU OMAP-35XX 600MHZ 515FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:119

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Product details

Overview

OMAP3515DCBC from Texas Instruments is a 720-MHz ARM Cortex-A8 applications processor with PowerVR SGX graphics acceleration, 256-KB L2 cache, and integrated display subsystem supporting HD resolution, NTSC/PAL video output, and dual LCD panels. It targets portable media players, digital video cameras, and web tablets requiring high-performance multimedia processing.

For engineers reviewing the OMAP3515DCBC datasheet, OMAP3515DCBC pinout, OMAP3515DCBC application, or OMAP3515DCBC equivalent, key selection factors include its 515-pin s-PBGA (CBC) package with POP support, discrete memory interface exclusion, 188 GPIOs, and SmartReflex-enabled adaptive voltage scaling for mobile power optimization.

Technical Context

The OMAP3515DCBC implements an in-order, dual-issue, superscalar ARMv7 architecture core with NEON SIMD coprocessor and TrustZone security extensions. Its MPU subsystem integrates 16-KB/16-KB L1 instruction/data caches and a 256-KB unified L2 cache, while the PowerVR SGX graphics engine delivers up to 10 MPoly/sec with OpenGLES 2.0 and OpenVG 1.0 API support.

It features a hierarchical L3/L4 interconnect fabric enabling concurrent access to SDRAM controller (SDRC), General Purpose Memory Controller (GPMC), Camera ISP, Display Subsystem, and multiple serial interfaces-including five McBSPs (two with Sidetone), four McSPI ports, three UARTs (one IrDA/CIR-capable), and dual USB 2.0 OTG/Host subsystems with ULPI/TLL support.

Key Specifications

ParameterValue and Actual Design Meaning
Core ArchitectureARM Cortex-A8, ARMv7, in-order dual-issue superscalar with Thumb-2 and Jazelle RCT
Max Operating Frequency720 MHz - enables real-time HD video decode and UI rendering in Linux/Android environments
L2 Cache256 KB unified - reduces external memory bandwidth pressure during multimedia workloads
Graphics AccelerationPowerVR SGX - supports OpenGL ES 2.0, OpenVG 1.0, and programmable pixel/vertex shaders
Memory InterfaceSDRAM Controller (SDRC) + GPMC - supports LPDDR, DDR2, NAND/NOR flash, SRAM, and FPGA glueless interfacing
Video OutputDual LCD + RFBI + CVBS/S-Video - enables simultaneous high-res panel and analog TV output without external encoder
Power ManagementSmartReflex AVS - dynamically scales core voltage (0.985–1.35 V) and frequency to minimize active power

Pinout & Package

OMAP3515DCBC uses a 515-pin s-PBGA package (CBC suffix) with 0.65-mm ball pitch on top and 0.5-mm on bottom, supporting Package-on-Package (POP) memory stacking but excluding discrete memory interface signals (gpmc_ncs1/ncs2, gpmc_wait1/wait2). Total I/O count is 188 GPIOs, with pin multiplexing governed by Table 2-2 in SPRS505H.

Pin/TerminalCircuit RoleDesign Meaning
sdrc_d0–sdrc_d31SDRAM Data Bus32-bit bidirectional data path for LPDDR/DDR2 memory; requires matched trace lengths and termination
sdrc_a0–sdrc_a14, sdrc_ba0–ba1SDRAM Address & Bank Select16-bit address + 2-bit bank select for up to 1 GB address space; timing-critical for setup/hold compliance
gpmc_ad0–ad15GPMC Address/Data Multiplexed Bus16-bit multiplexed interface for NOR/NAND flash, SRAM, or FPGA; supports asynchronous protocol control
dss_data0–dss_data23, dss_hsync/vsync/pclkDisplay Subsystem Parallel Output24-bit RGB + sync signals for direct connection to TFT LCD panels or RFBI interface chips
tv_out1/tv_out2, tv_vref, tv_vfb1/vfb2Composite Video DAC OutputsAnalog NTSC/PAL outputs with internal 2×10-bit DACs; require external RC filter per TI design guidelines
mcbsp1_dx/dr/fsx/clkxMcBSP1 Serial Audio InterfaceFull-duplex time-division multiplexed port for I2S, PCM, or TDM audio codecs; supports Sidetone only on McBSP2/3

Key Features

FeatureDesign Value
ARM Cortex-A8 CoreDelivers >2× performance vs ARM9 at same clock; enables Android/Linux boot in <5 sec with optimized kernel
PowerVR SGX GraphicsEnables hardware-accelerated 3D UIs and gaming without external GPU; eliminates frame buffer bottlenecks
Camera ISP PipelineSupports BT.601/BT.656, CCD/CMOS sensors, and resize (1/4×–4×); offloads CPU from raw image processing
Display SubsystemTriple-layer composition (2 video + 1 graphics), temporal dithering, and rotation (90°/180°/270°); enables multi-display UX
SmartReflex AVSReduces dynamic core power by up to 40% vs fixed-voltage operation; critical for battery life in portable devices

Applications

Portable Media PlayerDigital Video Camera

Use Scenario: High-resolution video playback (720p/1080p) with touch UI, codec decoding, and local storage access.

IC Role / Device Role / Timing Role: Main applications processor executing Android/Linux OS, managing video decode pipeline, display compositing, and storage I/O.

Use Value: Integrated PowerVR SGX and ISP eliminate need for discrete graphics/video ICs, reducing BOM cost and PCB area.

Use Scenario: Real-time HD video capture, sensor preprocessing, on-device encoding, and HDMI/TV-out playback.

IC Role / Device Role / Timing Role: Central imaging hub handling parallel camera interface, ISP hardware acceleration, and dual-display output timing.

Use Value: BT.656 interface and embedded resize engine enable direct CMOS sensor connection and scalable preview/resolution output.

Web TabletSmart Home Controller

Use Scenario: Web browsing, app execution, capacitive touch response, and Wi-Fi/Bluetooth coexistence with minimal latency.

IC Role / Device Role / Timing Role: Application processor running Android with integrated display subsystem driving RGB LCD and managing peripheral interrupts.

Use Value: 188 GPIOs and flexible McSPI/McBSP allow direct attachment of touch controllers, PMICs, and wireless modules without level shifters.

Use Scenario: Voice-controlled UI, local video streaming to displays, sensor aggregation, and secure OTA updates.

IC Role / Device Role / Timing Role: Secure applications processor leveraging TrustZone for isolated firmware execution and encrypted boot.

Use Value: Hardware crypto acceleration and secure boot ROM (112 KB) ensure firmware integrity and prevent unauthorized code execution.

Equivalent & Alternatives

The following parts are listed as comparable options for similar applications processor applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
OMAP3515CBBSame core, identical feature set, but CBB package includes discrete memory interface (gpmc_ncs1/ncs2, gpmc_wait1/wait2) and different POP ball layoutPreferred for designs requiring NAND/NOR boot from GPMC with full chip-select flexibilitySelect CBB if discrete memory interface and expanded GPMC wait/CS signals are required; CBC trades those for optimized POP stacking
OMAP3503DCBCPin-compatible 515-pin CBC package, but lacks PowerVR SGX graphics accelerator and has reduced display subsystem capabilitiesSuitable for cost-sensitive UI-only or non-3D applications where graphics acceleration is unnecessaryChoose OMAP3503DCBC when 3D graphics, OpenGLES 2.0, or advanced display composition are not required

Compared with OMAP3515CBB, OMAP3515DCBC sacrifices discrete memory interface signals for enhanced POP stacking capability, while versus OMAP3503DCBC it adds PowerVR SGX and full display subsystem functionality-making it the optimal choice for HD multimedia endpoints requiring both graphics and video I/O.

Availability

OMAP3515DCBC is available at Aetrix Electronics and suitable for portable media players, digital video cameras, and web tablets requiring stable component supply across extended product lifecycles.

Supply support for OMAP3515DCBC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies for industrial, automotive, and consumer markets.

The OMAP3515 product line was engineered to deliver high-performance, low-power multimedia processing for mobile Linux and Android platforms-integrating CPU, GPU, ISP, and display subsystems into a single die for portable computing and imaging devices.

FAQ

What is the maximum supported SDRAM capacity for OMAP3515DCBC?

The OMAP3515DCBC supports up to 1 GB of total address space via its SDRAM Controller (SDRC), accommodating configurations such as 256-MB × 4 banks or 512-MB × 2 banks of LPDDR/DDR2 memory. This capacity is sufficient for Android 2.x–4.x deployments with framebuffer, application heap, and kernel memory requirements. The SDRC implements automatic refresh and configurable burst lengths to meet JEDEC timing specifications.

Does OMAP3515DCBC support Android operating system?

Yes, OMAP3515DCBC is officially supported by Texas Instruments for Android versions up to 4.0 (Ice Cream Sandwich), with validated BSPs, kernel drivers, and graphics HALs. The device's ARM Cortex-A8 core, PowerVR SGX GPU, and integrated display subsystem provide the necessary compute, rendering, and output capabilities required for responsive Android UIs and multimedia apps.

How does SmartReflex technology function in OMAP3515DCBC?

SmartReflex in OMAP3515DCBC uses on-die process/voltage/temperature (PVT) sensors to dynamically adjust the adaptive core voltage (0.985–1.35 V) in real time, independent of frequency scaling. This reduces active power consumption by up to 40% compared to fixed-voltage operation, without compromising performance-critical for extending battery life in portable media players and tablets using OMAP3515DCBC.

What video output interfaces are integrated into OMAP3515DCBC?

OMAP3515DCBC integrates parallel digital RGB (up to 24-bit), RFBI, and analog composite video outputs. It includes two 10-bit DACs supporting NTSC and PAL standards, with dedicated pins (tv_out1/tv_out2, tv_vref, tv_vfb1/vfb2) for direct connection to TV encoders or passive filters. No external video encoder IC is required for basic CVBS/S-Video output.

Is OMAP3515DCBC pin-compatible with OMAP3503DCBC?

Yes, OMAP3515DCBC and OMAP3503DCBC share identical 515-pin s-PBGA (CBC) package dimensions, ball pitch, and pinout mapping. They differ functionally-OMAP3515DCBC includes PowerVR SGX graphics and full display subsystem features, while OMAP3503DCBC omits SGX and has reduced display capabilities-but mechanical and electrical interface compatibility is maintained for drop-in replacement in non-graphics use cases.

OMAP3515DCBC Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Package/Case:
515-VFBGA, FCBGA
Series:
OMAP-35xx
Packaging:
Tray
Product Status:
Obsolete
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
Ethernet:
-
SATA:
-
USB:
USB 1.x (3), USB 2.0 (1)
Voltage - I/O:
1.8V, 3.0V
Operating Temperature:
0°C ~ 90°C (TJ)
Grade:
-
Qualification:
-
Security Features:
-
Mounting Type:
Surface Mount
Supplier Device Package:
515-POP-FCBGA (14x14)
Additional Interfaces:
HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART

OMAP3515DCBC FAQ

1.How can I place an order for OMAP3515DCBC through Aetrix?

Please submit a Request for Quotation (RFQ) for OMAP3515DCBC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for OMAP3515DCBC reliable?

The price and inventory of OMAP3515DCBC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for OMAP3515DCBC is usually 5 days.

3.What payment methods are accepted for OMAP3515DCBC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for OMAP3515DCBC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for OMAP3515DCBC?

OMAP3515DCBC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your OMAP3515DCBC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for OMAP3515DCBC?

For technical support, including OMAP3515DCBC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your OMAP3515DCBC requirements.

6.How does Aetrix verify that OMAP3515DCBC is sourced from the original manufacturer or authorized distributors?

All OMAP3515DCBC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that OMAP3515DCBC meets industry standards.

7.What is the process for return or replacement of OMAP3515DCBC?

All OMAP3515DCBC units undergo pre-shipment inspection (PSI). If there is an issue with OMAP3515DCBC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The OMAP3515DCBC part is unused and in its original packaging.

Return procedure for OMAP3515DCBC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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