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Texas Instruments OMAP3515ECBB
- Part No.:
- OMAP3515ECBB
- Manufacturer:
- Texas Instruments
- Category:
- Microprocessors
- Package:
- 515-VFBGA, FCBGA
- Datasheet:
-
OMAP3515ECBB.pdf
- Description:
- IC MPU OMAP-35XX 600MHZ 515FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,985
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Product details
Overview
OMAP3515ECBB from Texas Instruments is a 720-MHz ARM Cortex-A8 applications processor with PowerVR SGX graphics acceleration, 256-KB L2 cache, and integrated display subsystem supporting HD resolution, NTSC/PAL video output, and dual LCD panels. It targets portable media players, digital video cameras, and web tablets requiring high-performance multimedia processing.
For engineers reviewing the OMAP3515ECBB datasheet, OMAP3515ECBB pinout, OMAP3515ECBB application, or OMAP3515ECBB equivalent, key selection considerations include its 515-pin s-PBGA (CBB) package with POP support, discrete memory interface, 188 GPIOs, and dual 10-bit DACs for composite/S-video output - all critical for embedded HLOS designs running Linux, Android, or Windows CE.
Technical Context
The OMAP3515ECBB implements an in-order, dual-issue, superscalar ARMv7 architecture with NEON SIMD coprocessor and TrustZone security extensions. Its MPU subsystem integrates a 16-KB/16-KB L1 instruction/data cache and supports dynamic voltage and frequency scaling via SmartReflex technology.
Graphics acceleration is handled by the dedicated PowerVR SGX subsystem (exclusive to OMAP3515, not OMAP3503), delivering up to 10 MPoly/sec with OpenGLES 1.1/2.0 and OpenVG 1.0 API support. The display subsystem includes RFBI, parallel RGB, and dual-output 3-layer composition with temporal dithering and SDTV→QCIF scaling.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | ARM Cortex-A8, ARMv7, in-order dual-issue superscalar microprocessor core |
| Max Operating Frequency | 720 MHz - defines real-time video decode/encode throughput ceiling for H.264/VC-1 at 720p |
| L2 Cache | 256 KB - reduces external memory bandwidth demand for OS kernel and application code |
| Graphics Engine | PowerVR SGX - enables hardware-accelerated 3D UI rendering and OpenGL ES 2.0 compliance |
| DAC Outputs | 2×10-bit - directly drives composite NTSC/PAL and S-video signals without external encoder |
| Package | 515-pin s-PBGA (CBB), 0.5-mm top / 0.4-mm bottom ball pitch - supports POP memory stacking |
| I/O Voltage | 1.8-V I/O, 0.985–1.35-V adaptive core - enables low-power operation with SmartReflex AVS |
Pinout & Package
OMAP3515ECBB uses a 515-ball s-PBGA package (CBB suffix) with 0.5-mm pitch on top and 0.4-mm pitch on bottom, optimized for Package-on-Package (POP) memory stacking. Ball assignments follow TI's documented quadrant layout (Figures 2-6 to 2-9), with unused balls at A1/A2/A22/A23/AB1/AB2/AB22/AB23/AC1/AC2/AC22/AC23/B1/B2/B22/B23.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| sdrc_d0–sdrc_d31 | SDRAM data bus | 32-bit wide interface to LPDDR/DDR2 memory; timing-critical for video frame buffering |
| sdrc_a0–sdrc_a14, sdrc_ba0–sdrc_ba1 | SDRAM address & bank select | Supports up to 1 GB address space across multiple banks for OS + application memory |
| gpmc_ncs0–gpmc_ncs7 | GPMC chip-select outputs | Eight independent chip-selects enable glueless interface to NAND/NOR flash, SRAM, FPGA |
| dss_data0–dss_data23, dss_hsync, dss_vsync, dss_pclk | Parallel RGB/LCD interface | 24-bit RGB + sync signals drive native LCD panels up to HD resolution (1280×720) |
| tv_out1, tv_out2, tv_vref, tv_vfb1, tv_vfb2 | Composite/S-video DAC outputs | Direct analog video output; requires external RC filter per TI design guidelines (Section 5.4) |
| uart1_tx/rx/cts/rts, uart2_tx/rx, uart3_tx/rx/irrx/irtx | Asynchronous serial interfaces | Three UARTs including IrDA/CIR support for peripheral connectivity and debug console |
Key Features
| Feature | Design Value |
|---|---|
| PowerVR SGX Graphics Accelerator | Hardware-accelerated 3D rendering enabling responsive touch UIs and gaming on Android/Linux |
| Camera ISP with BT.601/BT.656 Interface | Direct connection to CCD/CMOS sensors; eliminates external image pipeline ICs |
| Dual-Output Display Subsystem | Simultaneous RGB LCD + analog TV output - enables mirroring or extended desktop use cases |
| SmartReflex Adaptive Voltage Scaling | Real-time DVFS control reduces active power by >30% vs. fixed-voltage operation |
| Package-on-Package (POP) Support | Integrated memory stacking simplifies PCB layout and improves signal integrity for high-speed DDR |
Applications
| Portable Media Player | Digital Video Camera |
|---|---|
Use Scenario: High-resolution video playback (720p H.264) with multitouch UI and background audio decoding. IC Role / Device Role / Timing Role: Main applications processor executing Android framework, GPU-accelerated video decoder, and display controller. Use Value: Integrated PowerVR SGX and dual 10-bit DACs eliminate need for external video encoder and GPU, reducing BOM cost and board area. | Use Scenario: Real-time 1080i video capture from CMOS sensor, on-device encoding, and HDMI/TV-out preview. IC Role / Device Role / Timing Role: Camera ISP front-end, ARM Cortex-A8 encoder engine, and dual-display controller driving LCD viewfinder + composite output. Use Value: BT.656 interface and hardware resize engine enable direct sensor connection and 1/4×–4× scaling without external FPGA or ASIC. |
| Web Tablet | Smart Home Controller |
Use Scenario: Web browsing, Flash content rendering, and multi-window UI on 7-inch resistive/capacitive touchscreen. IC Role / Device Role / Timing Role: Primary HLOS host running Linux or Android, managing USB OTG peripherals, Wi-Fi/BT coexistence, and 24-bit RGB display. Use Value: 188 GPIOs and five McBSP ports allow integration of touch controller, audio codec, and custom I/O without companion MCU. | Use Scenario: Central hub aggregating Zigbee/Z-Wave sensor data, rendering local UI on small LCD, and streaming video to cloud. IC Role / Device Role / Timing Role: Application processor handling protocol stacks, secure boot, encrypted storage, and low-latency display update. Use Value: TrustZone security extensions and 112 KB ROM with secure boot firmware provide hardware-enforced root-of-trust for IoT edge devices. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar applications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| OMAP3503ECBB | No PowerVR SGX graphics accelerator; identical CPU, memory, and peripheral subsystems | Not suitable for 3D-accelerated UI or gaming; lower thermal/power profile | Select when graphics acceleration is unnecessary and cost reduction is prioritized |
| OMAP3515ECBC | Same silicon, 515-pin s-PBGA with 0.65-mm top / 0.5-mm bottom pitch; no POP support | Requires discrete memory placement; less optimal for space-constrained handhelds | Select when POP stacking is not required and PCB stack-up favors larger pitch |
Compared with OMAP3503ECBB, OMAP3515ECBB adds essential 3D graphics for modern UIs; compared with OMAP3515ECBC, it enables tighter memory integration via POP - both differences directly impact mechanical design, thermal management, and software feature set.
Availability
OMAP3515ECBB is available at Aetrix Electronics and suitable for portable media players, digital video cameras, and web tablets requiring stable component supply across long-life industrial and consumer programs.
Supply support for OMAP3515ECBB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies with over 90 years of innovation in industrial, automotive, and consumer electronics.
The OMAP3515ECBB belongs to TI's OMAP™3 family - designed specifically for high-performance mobile multimedia applications requiring full HLOS support, hardware-accelerated graphics, and integrated video/audio I/O.
FAQ
What operating systems does the OMAP3515ECBB officially support?
The OMAP3515ECBB officially supports Linux®, Windows® CE, and Android™ - all validated by Texas Instruments with BSPs, drivers, and reference kernels. Its ARM Cortex-A8 core and NEON coprocessor provide native compatibility with these HLOS environments, and TI's SDKs include bootloaders, graphics libraries (OpenGL ES 2.0), and camera/display frameworks. OMAP3515ECBB does not require third-party porting for baseline functionality.
Does the OMAP3515ECBB include integrated video DACs, and what standards do they support?
Yes, the OMAP3515ECBB integrates two 10-bit digital-to-analog converters (DACs) supporting composite NTSC and PAL video output, as well as luma/chroma separate S-video. These DACs are fully compliant with ITU-R BT.601 (8-bit YCbCr 4:2:2) and BT.656 (10-bit) standards, enabling direct connection to legacy analog displays without external encoders. Designers must follow TI's recommended RC filter values (Section 5.4) for optimal signal fidelity.
How does the PowerVR SGX graphics engine in OMAP3515ECBB differ from the OMAP3503 variant?
The PowerVR SGX graphics accelerator is exclusive to the OMAP3515ECBB and absent in OMAP3503ECBB - this is the primary functional distinction between the two parts. OMAP3515ECBB delivers up to 10 MPoly/sec with full OpenGLES 1.1/2.0 and OpenVG 1.0 API support, enabling hardware-accelerated 3D UIs and gaming. OMAP3503ECBB relies solely on CPU-based rendering, making OMAP3515ECBB mandatory for any application requiring real-time 3D graphics.
What memory interface options are supported by the OMAP3515ECBB in the CBB package?
The OMAP3515ECBB in the CBB package supports both SDRAM Controller (SDRC) for LPDDR/DDR2 memory and General Purpose Memory Controller (GPMC) for NAND/NOR flash, SRAM, and FPGA interfacing. It provides eight GPMC chip-selects, four wait pins, and a 16-bit multiplexed address/data bus - enabling glueless connections to common memory types. Discrete memory interface is enabled in CBB/CBC packages but disabled in CUS.
Is the OMAP3515ECBB pin-compatible with other OMAP35xx variants like OMAP3530 or OMAP3525?
No, the OMAP3515ECBB is not pin-compatible with OMAP3530 or OMAP3525. While all share the OMAP35xx naming convention and ARM Cortex-A8 core, they differ in ball count (515 vs. 423), pitch (0.5/0.4 mm vs. 0.65/0.5 mm), and signal mapping - particularly in GPMC, display, and USB interfaces. Pin compatibility exists only within same-package variants (e.g., OMAP3515ECBB ↔ OMAP3503ECBB), as confirmed in Table 1-1 of SPRS505H.
OMAP3515ECBB Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 515-VFBGA, FCBGA
- Series:
- OMAP-35xx
- Packaging:
- Bulk
- Product Status:
- Not For New Designs
- Core Processor:
- ARM® Cortex®-A8
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 600MHz
- Co-Processors/DSP:
- Multimedia; NEON™ SIMD
- RAM Controllers:
- LPDDR
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- LCD
- Ethernet:
- -
- SATA:
- -
- USB:
- USB 1.x (3), USB 2.0 (1)
- Voltage - I/O:
- 1.8V, 3.0V
- Operating Temperature:
- 0°C ~ 90°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 515-POP-FCBGA (12x12)
- Additional Interfaces:
- HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART
OMAP3515ECBB FAQ
1.How can I place an order for OMAP3515ECBB through Aetrix?
Please submit a Request for Quotation (RFQ) for OMAP3515ECBB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for OMAP3515ECBB reliable?
The price and inventory of OMAP3515ECBB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for OMAP3515ECBB is usually 5 days.
3.What payment methods are accepted for OMAP3515ECBB?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for OMAP3515ECBB transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for OMAP3515ECBB?
OMAP3515ECBB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your OMAP3515ECBB order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for OMAP3515ECBB?
For technical support, including OMAP3515ECBB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your OMAP3515ECBB requirements.
6.How does Aetrix verify that OMAP3515ECBB is sourced from the original manufacturer or authorized distributors?
All OMAP3515ECBB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that OMAP3515ECBB meets industry standards.
7.What is the process for return or replacement of OMAP3515ECBB?
All OMAP3515ECBB units undergo pre-shipment inspection (PSI). If there is an issue with OMAP3515ECBB, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The OMAP3515ECBB part is unused and in its original packaging.
Return procedure for OMAP3515ECBB:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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