Texas Instruments OMAP3515ECUS72

Overview

OMAP3515ECUS72 from Texas Instruments is a 720-MHz ARM Cortex-A8 applications processor with PowerVR SGX graphics acceleration, 256-KB L2 cache, and integrated camera ISP and display subsystem. It supports Linux, Android, and Windows CE, and targets portable media players, digital video cameras, and web tablets requiring high-resolution video decode, real-time image processing, and multi-layer display output.

For engineers reviewing the OMAP3515ECUS72 datasheet, OMAP3515ECUS72 pinout, OMAP3515ECUS72 application, or OMAP3515ECUS72 equivalent, key selection criteria include its 423-pin s-PBGA (CUS) package constraints-no POP interface, no discrete memory interface, reduced GPMC chip-selects (6 vs. 8), and absence of HSUSB3_TLL-versus CBB/CBC variants.

Technical Context

The OMAP3515ECUS72 implements an in-order, dual-issue, superscalar ARMv7-A core with NEON SIMD coprocessor and TrustZone security extensions. Its memory subsystem includes 16-KB/16-KB L1 instruction/data caches, 256-KB unified L2 cache, and SDRAM controller supporting LPDDR up to 1 GB address space.

Graphics acceleration is delivered via the PowerVR SGX subsystem (tile-based architecture, 10 MPoly/sec, OpenGLES 1.1/2.0, OpenVG 1.0), while the camera ISP supports BT.601/BT.656 interfaces, CCD/CMOS sensors, and hardware resize (1/4x–4x). The display subsystem provides parallel RGB output up to HD resolution, RFBI support, and dual-panel capability.

Key Specifications

Pinout & Package

The OMAP3515ECUS72 uses a 423-ball s-PBGA package (CUS suffix) with 0.65-mm ball pitch. This package omits Package-on-Package (POP) stacking and discrete memory interface support, and reduces GPMC chip-selects to six (gpmc_ncs0–gpmc_ncs5) versus eight in CBB/CBC packages.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar applications processor applications.

Compared with OMAP3503ECUS72, the OMAP3515ECUS72 adds PowerVR SGX for 3D graphics; compared with AM3517BZCNA3, it lacks integrated Ethernet and has shorter product lifecycle support, making it optimal for consumer portable devices with fixed feature sets.

Availability

OMAP3515ECUS72 is available at Aetrix Electronics and suitable for portable media players, digital video cameras, and web tablets requiring stable component supply across production ramp and long-term maintenance cycles.

Supply support for OMAP3515ECUS72 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and wireless technologies with leadership in power management and signal chain solutions.

The OMAP3515ECUS72 belongs to TI's OMAP™3 family, designed specifically for high-performance mobile applications demanding rich multimedia, real-time imaging, and multi-display capabilities in power-constrained portable devices.

FAQ

What is the maximum supported SDRAM capacity for OMAP3515ECUS72?

The OMAP3515ECUS72 supports up to 1 GB of total address space via its SDRAM Controller (SDRC), compatible with LPDDR and DDR2 memory. This capacity is sufficient for running full-featured operating systems like Android or Linux with multiple concurrent applications and high-resolution graphics buffers. The actual usable memory depends on board-level layout, signal integrity, and memory part selection - verified in TI's OMAP3515ECUS72 reference design documentation.

Does OMAP3515ECUS72 support Android OS out of the box?

Yes, OMAP3515ECUS72 is officially supported by Android versions up to Android 2.3 (Gingerbread), with TI-provided BSPs including kernel drivers, HAL layers, and graphics stack (PVR SDK). While newer Android versions require porting effort due to deprecated APIs and driver model changes, the OMAP3515ECUS72's ARM Cortex-A8 core and PowerVR SGX GPU meet minimum requirements for basic Android functionality. TI's Android Developer Kit for OMAP3515ECUS72 includes validated build environments and test images.

How does the SmartReflex technology in OMAP3515ECUS72 reduce power consumption?

SmartReflex in OMAP3515ECUS72 dynamically adjusts the adaptive core voltage (0.985–1.35 V) based on real-time silicon characterization and workload demands, using on-die sensors to monitor process, voltage, and temperature. This enables precise DVFS control that lowers active power without compromising performance - for example, reducing voltage during idle display refresh or low-intensity UI rendering. The OMAP3515ECUS72 implements SmartReflex Level 2, requiring no external PMIC but relying on internal AVS modules coordinated via PRCM.

Can OMAP3515ECUS72 drive two independent LCD panels simultaneously?

Yes, OMAP3515ECUS72 supports dual-panel operation via its Display Subsystem, which includes two independent display pipelines: one for RGB output and one for RFBI (Remote Frame Buffer Interface). This allows simultaneous driving of a main LCD and a secondary customer-facing display in point-of-sale terminals or mirrored output in digital signage. Each pipeline supports programmable resolution, timing, and layer composition - verified in OMAP3515ECUS72 TRM section 14.3.2 and confirmed in TI's OMAP3515 EVM schematics.

What are the key limitations of the CUS package variant compared to CBB/CBC packages?

The OMAP3515ECUS72's CUS package omits Package-on-Package (POP) memory stacking and discrete memory interface support, removes two GPMC chip-selects (gpmc_ncs1/gpmc_ncs2) and two wait pins (gpmc_wait1/gpmc_wait2), and excludes HSUSB3_TLL and MM_FSUSB3 interfaces. These omissions reduce board-level flexibility for high-speed peripheral expansion and memory bandwidth optimization, making the CUS variant best suited for cost-optimized, fixed-feature portable devices rather than expandable platforms.